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12500 TI Boulevard, MS 8640, Dallas, Texas 75243PCN# 20220617001.1AQualification of STATS ChipPac Korea as an additional Assembly siteand updated BOMs for select devicesChange Notification / Sample RequestDate: July 18, 2022To:MOUSER PCNDear Customer:Revision A is to update the Qual results table for AMKOR K4 to match Product attributes. Weapologize for any inconvenience this may have caused.This is an announcement of a change to a device that is currently offered by TexasInstruments. The details of this change are on the following pages.Texas Instruments requires acknowledgement of receipt of this notification within 30 days ofthe date of this notice. Lack of acknowledgement of this notice within 30 days constitutesacceptance of the change. If samples or additional data are required, requests must bereceived within 30 days of this notification.The changes discussed within this PCN will not take effect any earlier than the proposed firstship date on Page 3 of this notification, unless customer agreement has been reached on anearlier implementation of the change.This notice does not change the end-of-life status of any product. Should product affected beon a previously issued product withdrawal/discontinuance notice, this notification does notextend the life of that product or change the life time buy offering/discontinuance plan.For questions regarding this notice or to provide acknowledgement of this PCN, you maycontact your local Field Sales Representative or the PCN Team(PCN ww admin team@list.ti.com). For sample requests or sample related questions, contactyour local Field Sales Representative.Sincerely,PCN TeamSC Business ServicesTexas Instruments, Inc.TI Information - Selective DisclosurePCN# 20220617001.1A
20220617001.1AAttachment: 1Products Affected:The devices listed on this page are a subset of the complete list of affected devices. Accordingto our records, these are the devices that you have purchased within the past twenty-four(24) months. The corresponding customer part number is also listed, if available.DEVICECUSTOMER PART llnullnullnullTechnical details of this Product Change follow on the next page(s).Texas Instruments, Inc.TI Information - Selective DisclosurePCN# 20220617001.1A
PCN Number:20220617001.1APCN Date:July 18, 2022Qualification of STATS ChipPac Korea as an additional Assembly site and updated BOMsTitle:for select devicesPCN ManagerCustomer Contact:Dept:Quality ServicesSample requestsProposed 1st Ship Date: Sept 22, 2022Jul 22, 2022*accepted until:*Sample requests received after (Jul 22nd 2022) will not be supported.Change Type:Assembly SiteDesignWafer Bump SiteAssembly ProcessData SheetWafer Bump MaterialAssembly MaterialsPart number changeWafer Bump ProcessMechanical SpecificationTest SiteWafer Fab SitePacking/Shipping/LabelingTest ProcessWafer Fab MaterialsWafer Fab ProcessPCN DetailsDescription of Change:Texas Instruments is pleased to announce the qualification of STATS ChipPac Korea as additionalAssembly Site and updated BOMs for Select Devices listed in the “Product Affected” Section.Material differences are as follows.Assembly SiteAssembly Site OriginAssembly Country CodeAssembly CityAmkor K4AMPKORGwangjuSTATS ChipPac KoreaSCKKORIncheonConstruction and process differences are noted below:Amkor K4 (New)Amkor K4 (Old)Underfill101354427n/aMolding processCUFMUFMold compound101353433101417921STATS ChipPac Korean/aMUFRA01-0157UReason for Change:Continuity of supply.Anticipated impact on Form, Fit, Function, Quality or Reliability (positive / negative):NoneImpact on Environmental RatingsChecked boxes indicate the status of environmental ratings following implementation of thischange. If below boxes are checked, there are no changes to the associated environmental ratings.RoHSNo ChangeREACHNo ChangeGreen StatusNo ChangeIEC 62474No ChangeChanges to product identification resulting from this PCN:Texas Instruments, Inc.TI Information - Selective DisclosurePCN# 20220617001.1A
Assembly SiteAmkor K4STATS ChipPac KoreaAssembly Site Origin (22L)Assembly Site Origin (22L)ASO: AMPASO: SCKSample product shipping label (not actual product label)Product IWR6843AQSABLIWR6843AQSABLRXI1843AQGABLSTATS ChipPac Korea Qualification ReportAutomotive New Product Qualification Summary(As per AEC-Q100 and JEDEC Guidelines)Approve Date 17-May-2022Product AttributesAttributesAutomotive Grade Level*Product FunctionWafer Fab SupplierAssembly SitePackage TypePackage DesignatorBall/Lead CountQualification Device:xWR1843 ES2.0Qualification Device:xWR2243 ES2.0Grade 2-Radar processorGrade 2-Radar ProcessorUMC F12SCK-FCBGA161 ABL205UMC F12SCKFCBGA161 ABL205*All currently qualified product niches in Radar business with ABL package are covered by this qualification: xWR1xxx, xWR2xxx,and xWR6xxx.Qualification ResultsData Displayed as: Number of lots / Total sample size / Total xas Instruments, R1843 ES2.0Results(lots/samplesize/fails)xWR2243 ES2.0High Temp OpLife, 140C Tj1000Hours3/231/0QBS xWR1843Early LifeFailure Rate,48 Hours3/2400/0QBS xWR1843SS/LotTest Name /Condition3773800TI Information - Selective DisclosurePCN# 20220617001.1A
ndB108SBSAECQ100010BLRTempCycleJEDECJESD22A104140C Tj26PreconditioningLevel 3260C3/1677/0**1/170/0377BiasedTemperature &Humidity,85C/85%RH1000Hours3/231/0QBS xWR1843326TemperatureCycle, /0QBS xWR18431451000Hours3/77/0QBS xWR1843377264 Hours3/231/0QBS xWR1843310PhysicalDimensions(Cpk 1.67)NAComplete/PassQBS xWR184350Solder BallShear(Cpk 1.67)3 lots / 5balls perdevice/10devices perlotComplete/PassQBS xWR18431000 cyc1/32/0 at 1kcyc(Weibull plotavailable uponrequest)QBS xWR184333--PowerTemperatureCycle, -40/125CHigh Temp.Storage Bake,150CUnbiasedHAST,110C/85%RH-40/125C,60min cycJESD22-A104,Condition G,Soak Mode 4QBS Qualification By Similarity.Tests D1 through D5 were completed at silicon technology level. Summary is available upon request.A1 (PC): Preconditioning:Performed completed on TC, PTC, UHAST, HTSL, and THB samples.**15 Post-precondition electrical endpoint test rejects on xWR1843 and 8 Temperature Cycle electrical endpoint test rejects onxWR2243 were discounted due to an Electrically-Induced Physical Damage (EIPD) failure mechanism, common across all units,which is unrelated to the changes under qualification. These do not affect the required AEC-Q100 test quantities shown in theresults table, as extra units were populated.Green/Pb-free Status:Qualified Pb-Free(SMT) and GreenTexas Instruments, Inc.TI Information - Selective DisclosurePCN# 20220617001.1A
Amkor K4 Qualification ReportAutomotive New Product Qualification Summary(As per AEC-Q100 and JEDEC Guidelines)Approve Date 17-May-2022Product AttributesQualification Device:xWR1843 ES2.0AttributesAutomotive Grade Level*Product FunctionQualification Device:xWR2243 ES2.0Qualification Device:xWR1243 ES 3.0Qualification Device:AWR1642 ES 2.0Qualification Device:AWR6843 ES 2.0Grade 2Grade 2Grade 2Grade 2Grade 2-Radar processor-Radar Processor-Radar Processor-Radar processor-Radar processorWafer Fab SupplierUMC F12UMC F12UMC F12UMC F12UMC F12Assembly SiteAmkorAmkorAmkorAmkorAmkorPackage Type-FCBGAFCBGAFCBGA-FCBGA-FCBGAPackage Designator161 ABL161 ABL161 ABL161 ABL161 ABL205205205205205Ball/Lead Count*Change From - capillary flip-chip underfill and baseline mold compound, To - new molded underfill (mold and flip-chip underfill aresame material). Bump and assembly site is Amkor K4, which was previously qualified and is not changing.Qualification ResultsData Displayed as: Number of lots / Total sample size / Total sults(lots/samplesize/fails)xWR1243 ES 3.0Results(lots/samplesize/fails)AWR1642ES 2.0Results(lots/samplesize/fails)AWR6843ES 2.0QBSxWR1843QBS xWR1843QBSxWR1843QBSxWR1843QBSxWR1843QBS 43 843QBS xWR1843QBSxWR1843QBSxWR1843TemperatureCycle, 55/150C1000Cycles3/231/01/90/0QBSxWR1843 , 40/125C1000Cycles3/54/0QBSxWR1843QBS xWR1843QBSxWR1843QBSxWR1843145High Temp.Storage Bake,150C1000Hours3/87/0QBSxWR1843QBS sedHAST,110C/85%RH264Hours3/231/0QBSxWR1843QBS 8310PhysicalDimensions(Cpk 1.67)NAComplete/PassQBSxWR1843QBS xWR1843QBSxWR1843QBSxWR1843SBSAECQ100010350Solder BallShear(Cpk 1.67)3 lots / 5balls perdevice/10devicesComplete/PassQBSxWR1843QBS tTest Name /ConditionDurationHTOLJEDECJESD22A108377High Temp OpLife, 140C Tj1000HoursEFRAECQ1000083800Early LifeFailure Rate,140C Tj48 vel 3260CTHBJEDECJESD22A101377BiasedTemperature 6PTCJEDECJESD22A1051HTSLJEDECJESD22A103UHASTTexas Instruments, 1/0 (SCKlots – sameG355Smaterial)3/2400/0 (SCKlots – sameG355Smaterial)TI Information - Selective DisclosurePCN# 20220617001.1A
per lotBLRTempCycleJEDECJESD22A104---40/125C,60min cycJESD22-A104,Condition G,Soak Mode 41000 cyc1/32/0 at 1kcyc(Weibull plotavailable uponrequest)1/32/0 at1kcyc (Weibullplot availableupon request)QBS xWR1243QBSxWR1843QBSxWR1843QBS Qualification By Similarity.Tests D1 through D5 were completed at silicon technology level. Summary is available upon request.A1 (PC): Preconditioning:Performed completed on TC, PTC, UHAST, HTSL, and THB samples.Qualification By Similarity Information / Justification:Green/Pb-free Status:Qualified Pb-Free(SMT) and GreenFor questions regarding this notice, e-mails can be sent to the regional contacts shown belowor your local Field Sales Representative.LocationE-MailWW PCN TeamPCN ww admin team@list.ti.comIMPORTANT NOTICE AND DISCLAIMERTI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES(INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETYINFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES,EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OFMERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTYINTELLECTUAL PROPERTY RIGHTS.These resources are intended for skilled developers designing with TI products. You are solely responsiblefor (1) selecting the appropriate TI products for your application, (2) designing, validating and testing yourapplication, and (3) ensuring your application meets applicable standards, and any other safety, security, orother requirements. These resources are subject to change without notice. TI grants you permission to usethese resources only for development of an application that uses the TI products described in the resource.Other reproduction and display of these resources is prohibited. No license is granted to any other TIintellectual property right or to any third party intellectual property right. TI disclaims responsibility for,and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, andliabilities arising out of your use of these resources.TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or otherapplicable terms available either on ti.com or provided in conjunction with such TI products. TI’s provisionof these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers forTI products.Texas Instruments, Inc.TI Information - Selective DisclosurePCN# 20220617001.1A
extend the life of that product or change the life time buy offering/discontinuance plan. For questions regarding this notice or to provide acknowledgement of this PCN, you may . SC Business Services . Texas Instruments, Inc. TI Information - Selective Disclosure PCN# 20220617001.1A . WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES "AS .
