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MARKET & TECHNOLOGY REPORTREPORT OBJECTIVES Provide a clear understanding of the GaN power industry, covering markets from epiwafers anddiscretes to GaN ICs – with valuations in units and M Analyze the market drivers and bottlenecks of the GaN power industry by studying GaNadoption for different end-applications and supply chains A ssess the status and trends of GaN power device technology D escribe the industry landscape and market dynamics Discussion of recent investments, M&A, and the competitive advantages of key playersCOMPANIES CITED IN THE REPORT (non exhaustive list)Aixtron, Allos, Alpha & Omega, Amec, Amkor, Apple, ASE, AT&S, Azur Space, BMW, Carsem,CGD, Coorstek, Delta Electronics, Dialog Semiconductors, DongKe, Dowa, Efficient PowerConversion, Egtronics, Enkris, Energous, EpiGaN, Episil, Epistar, Evatran, Exagan, Fairchild,Finsix, Ford, Fuji Electric, GaN Systems, GaN Power, Gener8, GlobalWafers, Huawei, IGaN,Imec, Infineon, Innoscience, IQE, LG Electronics, Jedec, Kyma, Mitsubishi Chemical, Nanowin,Navitas Semiconductors, Neditek, Nexgen, Nordic Power Converters, Nuvoton, NXP, OdysseySemiconductor, OKMETIC, On Semiconductor, Panasonic, Philos, Powerex, Powdec, PowerIntegrations, Qromis, Qualcomm, Saint-Gobain Lumilog, Samsung, Sanan IC, Sanken, SAS, Sharp,Siltronic, SinoNitride, Soitec, STMicroelectronics, Sumco, Sumitomo SEI, Tagore Technology,Toshiba, Toyota, Toyoda Gosei, Tesla, Texas Instruments, TSMC, Transphorm, Veeco, Velodyne,VIS, VisIC Technologies, Wingtech, Wise Integration, Xfab, Yaskawa, and more. TABLE OF CONTENTS (complete content on i-Micronews.com)Abbreviations and definitions2Table of contents3Report methodology4About the authors5Companies cited in this report6What we got right, what we got wrong 7Related reports8What’s new?11Executive summary17Context61Market forecasts69 GaN power devices: market forecast GaN power device market ( M) GaN power market: HEMT vs. SiP vs. SoC GaN power devices: market forecast split byapplication (2019 - 2026)- Power supplies- Power supplies: datacom and telecom- I ndustrial applications: industrial motordrive and industrial power supply- Automotive and mobility- UPS- PV- Wireless power- LiDAR GaN power device market: split by substratetechnology GaN power device market in M: split byvoltage Open and captive GaN power epiwafervolume: 6” equivalent GaN power wafer demand (units) GaN power epiwafer pricing ( ) Device revenue market share in M: SiC vs.GaN vs. siliconMarket trends90 GaN power market segmentation Overview of GaN power application markets Overview of technology and economicrequirements per applicationMarket share and supply chain197 GaN power supply chain and business models GaN industry timeline, key investments, andpartnerships Main players and the power electronicslandscape GaN industry: projects and subsidies Mapping of key players in different geographicalregions Epitaxy and fab capacities Company profiles (Power Integrations,Navitas, Innoscience, Wise Integrations, CGD) Focus on ChinaGaN power device technology trends 231 GaN device technology overview D -mode or E-mode GaN? GaN epitaxy GaN power device reliability GaN power device integration Packaging Commercially available devicesOutlooks and conclusions285RELATED REPORTS, MONITORS & TRACKS Power SiC: Materials, Devices andApplications 2021 Power Electronics for E-Mobility 2021 Status of the Power Module PackagingIndustry 2020 Status of the Power Electronics Industry2020 Compound Semiconductor QuarterlyMarket MonitorMore information and details about our offers and bundles opportunities on www.i-micronews.comAUTHORSAhmed Ben Slimane, PhD. is aTechnology & Market Analyst, specialized inCompound Semiconductors and EmergingSubstrates at Yole Développement (Yole). Aspart of the Power & Wireless team, Ahmed iscontributing to the development of dedicatedcollection of compound semiconductorsmarket & technology reports and monitor.Previously, he worked as an epitaxy (MBE/MOCVD) & fabrication process engineerfor GaAs-based photovoltaic applicationsat TOTAL and IPVF (Paris-Saclay, France).Ahmed also completed his PhD in MaterialEngineering from KAUST (Saudi Arabia),where his mission was focused on GaNbased microstructures for flexible solidstate lighting. During his career, AhmedBen Slimane proposed lot of presentationstowards an international audience. Heauthored/co-authored more than 20publications in the semiconductor field andsubmitted a patent on the III-V heterostructure for PV industry. Ahmed obtainedhis Master Degree in Electronics Engineeringfrom INPG (Grenoble, FR).Poshun Chiu is a Technology &Market Analyst specializing in CompoundSemiconductor and Emerging Substrates atYole Développement (Yole). As a member ofthe Power Electronics & Wireless division atYole, Poshun focuses on power, RF, and optoelectronics. He is engaged in the developmentof technology and market reports and is alsoinvolved in custom projects. Before joiningYole, Poshun had 9 years’ experience in R&Dand product management at Epistar (TW& CHN). He is the author or co-author ofmore than 10 patents in solid-state-lighting.Poshun was also engaged in the developmentand evaluation of novel applications ofprocess technology and componentsbased on relevant semiconductor materialsystems. Poshun received an MSc degree inMicroelectronics from National Cheng KungUniversity (TW) and an MBA from IESEGSchool of Business(FR).

CONTACTWestern US & CanadaSteve Laferriere - steve.laferriere@yole.fr 1 310 600-8267India and RoATakashi Onozawa – takashi.onozawa@yole.fr 81-80-4371-4887Eastern US & CanadaChris Youman – chris.youman@yole.fr 1 919 607 9839KoreaPeter Ok - peter.ok@yole.fr 82 1040890233Europe and RoWLizzie Levenez – lizzie.levenez@yole.fr 49 15 123 544 182JapanMiho Ohtake – miho.ohtake@yole.fr 81 34405-9204Toru Hosaka – toru.hosaka@yole.fr 81 90 1775 3866Benelux, UK & SpainMarine Wybranietz - marine.wybranietz@yole.fr 49 69 96 21 76 78Japan and SingaporeItsuyo Oshiba – itsuyo.oshiba@yole.fr 81-80-3577-3042Greater ChinaMavis Wang – mavis.wang@yole.fr 886 979336809 86 136 61566824Sales Coordination& Customers ServiceDavid Jourdan – david.jourdan@yole.fr 33 472 83 01 90Fayçal El Khamassi – faycal.khamassi@yole.fr 33 472 83 01 95ABOUT YOLE DEVELOPPEMENTFounded in 1998, Yole Développement (Yole) has grown to become a group of companies providing marketing, technology and strategy consulting, mediaand corporate finance services, reverse engineering and reverse costing services. With a strong focus on emerging applications using silicon and/or micromanufacturing, the Yole group of companies has expanded to include more than 120 collaborators worldwide covering MEMS and Image Sensors, CompoundSemiconductors, RF Electronics, Solid-state Lighting, Displays, Software, Optoelectronics, Microfluidics & Medical, Advanced Packaging, Manufacturing,Power Electronics, Batteries & Energy Management and Memory.The “More than Moore” market research, technology and strategy consulting company Yole Développement, along with its partners System Plus Consulting,PISEO and Blumorpho, supports industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technologytrends to grow their business.CONSULTING AND ANALYSIS Market data & research, marketing analysis Technology analysis Strategy consulting Reverse engineering & costing Design and characterization of innovative optical systems Financial services (due diligence, M&A)More information on www.yole.frMEDIA & EVENTS i-Micronews.com website, application & related e-newsletter Communication & webcast services Events: TechDays, forums More information on www.i-Micronews.comREPORTS & MONITORS Market & technology reports Market and reverse technology quarterly monitors Structure, process and cost analysis and teardowns Cost simulation toolMore information on www.i-micronews.com/reportsCONTACTSFor more information about : Consulting & Financial Services: Jean-Christophe Eloy (eloy@yole.fr) Reports & Monitors: David Jourdan (david.jourdan@yole.fr) & FayçalKhamassi (faycal.khamassi@yole.fr) Public Relations: Sandrine Leroy (sandrine.leroy@yole.fr) Marketing & Communication: Jean-Christophe Eloy (eloy@yole.fr)

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devices, including product charts for each along with device descriptions Overview of the GaN power industrial landscape, from epitaxy and device design to device processing, with a focus on China Discussion of GaN power market dynamics GaN power device voltage analysis State-of-the-art developments for power GaN packaging and