Transcription
Packaging Technology TrendsRon Huemoeller l Corporate Vice President l WW R&D and Technology Strategy 2017 Amkor Technology, Inc.1
OutlineMarket DynamicsMarket TrendsKey Package PlatformsSummary 2017 Amkor Technology, Inc.2
Economics of Packaging Today 2017 Amkor Technology, Inc.3
Semiconductor Outlook Continued growth– Moore’s Law extends– Mobility– Automotive– IoE through a connected world Greater need for advancedpackages– Advanced SiP– Heterogeneous integration 2017 Amkor Technology, Inc.4
Advanced Packaging: Must Pay to Play Developing & manufacturing newpackage platforms is expensive Requires a high degree ofengineering expertise Requires perpetual funding inR&D Requires ability to invest in ‘new’ideas Adding new blocks of capacityexpensive – challenging ROI 2017 Amkor Technology, Inc.5
Economics of Business Today Changing competitive environment– Tier 1 OSATs dominate intechnology– Entry of foundry– Suppliers upward ambition Pace of change accelerating!– Forcing “all in” mentality 2017 Amkor Technology, Inc.6
Market Trends 2017 Amkor Technology, Inc.7
Major Package TrendsMobilityIoTAutomotiveHPC/Networking Ultra Thin, Small Miniaturization Reliable, AEC-006 Performance Integration, SiP Integration Integration, SiP Integration 5G Secure 5G Thermal, Power Envelope Tracker Power/Connected ADAS/Connected AI/AR AR/Streaming Home/Factory/Auto Infotainment/ECU Data Center/SiPHO 2017 Amkor Technology, Inc.8
Key Market Segments Driving Packaging TechnologyMobile 80 packagedLowcost FlipdieChipopportunitiesWLCSP/Fan-OutMEMS & SensorsChoicesSubstrate SiPWafer SiPConsumer/IoTAutomotiveHPC Low cost Flip Chip WLCSP MEMSSensorsnarrowas& product Substrate SiPpackageddie 100MEMS& Sensorsopportunities Substrate SiP Substrate SiP Wafer SiPbecomes more complicated 2017 Amkor Technology, Inc.9
Mobile Market GrowthSource: GFK May 2017 2017 Amkor Technology, Inc.10
Smartphone SegmentsLow-endMid-endHigh-endModel NameLenovo K3 NoteOPPO R9SApple iPhone 7Release DateMar. 2015Oct. 2016Sep. 2016Price X 2X 4XAP Spec 80packageddieQualcommopportunitiesApplein high end smartphoneMediaTekMT6752Snapdragon 625A10# of Pkgs264969SourceAmkor TeardownAmkor TeardownAmkor Teardown 2017 Amkor Technology, Inc.11
Technology in the Mobile Market SegmentsAP/BB,StandaloneAP or BBfcCSPRF ConnectivityCodecPMICSensor SoCPeripheralsfcCSPfcCSPLCCSP (ETS, MSP)WLCSPWLCSPWLCSPWLFOWLFOfcCSP-HybridTMV PoP5s WLCSPMEP/Fan-In PoPSWIFT SiPWLFOSiP 2017 Amkor Technology, Inc.12
Wafer-Level Packaging Smartphones driving wafer-level packaging Phones getting thinner Number of WLP per phoneincreasing WLP proliferating into otherapplications and markets77 GHz Radar SystemSource: TechSearch International, Inc. 2017 Amkor Technology, Inc.13
Number of SiP Packages Increasing RF related packages: power amplifier, front-end module, antenna switchand Wi-Fi2G3G4GProductNokia 1800ZTE Z PhoneSamsung Galaxy S7Release DateNov. 2009Sept. 2012Feb. 2016Total Number of SiPs128 2017 Amkor Technology, Inc.14
5G Requires Massive Filtering# of Supported Bands3GLTE5G# of Supported Bands 2017 Amkor Technology, Inc.15
Automotive ICsUbiquitous3 Electronic value added to vehicles estimated at 40% and increasing2with 100 packaged die opportunities in high end automobiles54112345Camera ModulesBody SystemsInfo-CenterMEMS & SensorsSafety Systems 2017 Amkor Technology, Inc.16
2016 Data Center Data DC fabrication investment rivals semiconductor fab investment China has 7 of the 10 largest DCs in the worldLargest Data Center in World China Telecom 10M sq.ft. with 150 MW power requirementSource: Finisar OFC 2016 2017 Amkor Technology, Inc.17
2016 Largest DC in The WorldChina Telecom: 10,763,910 sq. ft.Hohhot (Inner Mongolia)Wembley Stadium: 172,000 sq. ft.Can fit 63 Wembley stadiums 2017 Amkor Technology, Inc.18
High Performance Computing & NetworkingMore DevicesMore ApplicationsMore DataData needs to be accessible always and in real-time400GESilicon Photonics100GEHyperscale Data Centers2.5D TSV10G/40GEData Centers, EnterprisefcBGAWLANWiFi, LTE, Small CellSiPSWIFT 2017 Amkor Technology, Inc.19
Next Level of Package IntegrationMajor Package Platform 2017 Amkor Technology, Inc.20
“The Big 5” Packaging PlatformsChip ScalePackagingWaferFlip ChipMEMsLaminateLaminate/Leadframe/WaferSystem inPackage: SiPNext GenSiPLaminateWafer 2017 Amkor Technology, Inc.21
Flip Chip Technologies The best choice for larger single die & big body packages A mature technology with focus on lowering cost Enables SiP packaging 2017 Amkor Technology, Inc.22
MEMS IoE, wearables & industrial– Sensor fusion– SOIC, QFN & laminate– Low power, form factor & cost– A step into SiP System & functional integration 2017 Amkor Technology, Inc.23
SiP Requires State of the Art TechnologyReference DesignSmall FormFactorPassive comp./IPD/EmbeddedEmbedded &ConformalShieldingSide by SidePOSSUM StackedCavityPoPF2FH.3D-WLFO rame 2017 Amkor Technology, Inc.24
Advanced SiP (Wafer-based) Provides very best in performance Thinnest form factor Ultimate in:– Power– Electrical– Thermal 2017 Amkor Technology, Inc.25
Fan-Out Package Evolution to Adv Wafer yCostAdv Wafer SiPHigh Density FOWLPLow Density FOWLP Better scalability, 3Dcompatible processand extended platformto SiP Logic to Memory or Logic Fan-out module attach tosubstrate as alternative toTSV 2.5D Limited scalability &platform extension toMCM, SiP and 3D 2017 Amkor Technology, Inc.26
Summary Technology Pace has Quickened 2017 Amkor Technology, Inc.27
MobilityIoTAutomotiveHPC/NetworkingHeterogeneous Integration is the over riding common theme Ultra Thin, Small Miniaturization Reliable, AEC-006 Performance Integration, SiP Integration Integration, SiP Integration 5G Secure 5G Thermal, Power Envelope tracker Power/Connected ADAS/Connected AI/AR AR/Streaming Home/Factory/Auto Infotainment/ECU Data Center/SiPHO 2017 Amkor Technology, Inc.28
Packaging the Future Economics of packaging– Requires intelligent growth & investmentsBestSolution Mobility, IoT, Automotive & Networking– Biggest market drivers for next 5-10 years Innovative technologies– Enabling more functionality and offering higherlevels of integration is a clear focus 2017 Amkor Technology, Inc.29
Thank YouRon.Huemoeller@amkor.com 2017 Amkor Technology, Inc.30
Fan-Out Package Evolution to Adv Wafer SiP Low Density FOWLP Limited scalability & platform extension to MCM, SiP and 3D Adv Wafer SiP Logic to Memory or Logic Fan-out module attach to substrate as alternative to TSV 2.5D High Density FOWLP Better scalability, 3D compatible process and extended platform to SiP Miniaturization Integration
