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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)Flexible Termination System (FT-CAP), Ultra-Stable X8RDielectric, 10 – 100 VDC (Commercial & Automotive Grade)OverviewKEMET’s Flexible Termination (FT-CAP) Multilayer CeramicCapacitor in Ultra-Stable X8R dielectric incorporates aunique, flexible termination system that is integrated withKEMET’s standard termination materials. A conductivesilver epoxy is utilized between the base metal and nickelbarrier layers of KEMET’s standard termination systemin order to establish pliability, while maintaining terminalstrength, solderability and electrical performance.This technology was developed in order to address theprimary failure mode of MLCCs– flex cracks, which aretypically the result of excessive tensile and shear stressesproduced during board flexure and thermal cycling. Flexibletermination technology inhibits the transfer of board stressto the rigid ceramic body, therefore mitigating flex crackswhich can result in low IR or short circuit failures.(KPS) product lines by providing a complete portfolio of flexmitigation solutions.Combined with the stability of KEMET’s Ultra-Stable hightemperature dielectric technology, these flex-robust devicesare RoHS Compliant, offer up to 5 mm of flex-bend capabilityand feature a 150 C maximum operating temperature.Ultra-Stable X8R dielectric offers the same temperaturecapability as conventional X8R, but without the capacitanceloss due to applied DC voltage. These devices exhibit nochange in capacitance with respect to voltage and boast aminimal change in capacitance with reference to ambienttemperature. They are also suitable replacements for highercapacitance and larger footprint devices that fail to offercapacitance stability. Capacitance change with respect totemperature is limited to 15% from 55 C to 150 C.Although this technology does not eliminate the potentialfor mechanical damage that may propagate during extremeenvironmental and handling conditions, it does providesuperior flex performance over standard terminationsystems. FT-CAP complements KEMET’s Open Mode,Floating Electrode (FE-CAP), Floating Electrode withFlexible Termination (FF-CAP), and KEMET Power SolutionsIn addition to Commercial Grade, Automotive Grade devicesare available which meet the demanding AutomotiveElectronics Council's AEC-Q200 qualification requirements.Ordering InformationCCeramic12061Open PDF in Adobe Reader for full functionality104Case Size Specification/ Capacitance(L" x W")SeriesCode (pF)060308051206121018121XClick image above for interactive 3D contentX FlexibleTerminationTwosignificantdigits andnumber ofzeros.J3ReatedCapacitanceVoltageTolerance(VDC)B 0.10 pFC 0.25 pFD 0.5 pFF 1%G 2%J 5%K 10%M 20%8 104 163 255 501 100HACAUTODielectricFailureRate/DesignTermination Finish1Packaging/Grade(C-Spec)H UltraStable X8RA N/AC 100% Matte SnL SnPb (5% Pb minimum)Additional termination finish options may be available. Contact KEMET for details.SnPb termination finish option is not available on Automotive Grade product. KEMET Electronics Corporation KEMET Tower One East Broward Boulevard Fort Lauderdale, FL 33301 USA 954-766-2800 www.kemet.comSee"PackagingC-SpecOrderingOptions Table"Built Into TomorrowC1063 X8R FT-CAP SMD 10/28/20201
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)Packaging C-Spec Ordering Options TablePackaging/GradeOrdering Code (C-Spec)Packaging TypeCommercial Grade1Bulk Bag7" Reel/Unmarked13" Reel/Unmarked7" Reel/Unmarked/2 mm pitch213" Reel/Unmarked/2 mm pitch2Not Required (Blank)TU7411 (EIA 0603 and smaller case sizes)7210 (EIA 0805 and larger case sizes)70817082Automotive Grade37" Reel13" Reel/Unmarked7" Reel/Unmarked/2 mm pitch213" Reel/Unmarked/2 mm pitch2AUTOAUTO7411 (EIA 0603 and smaller case sizes)AUTO7210 (EIA 0805 and larger case sizes)31903191Default packaging is “Bulk Bag”. An ordering code C-Spec is not required for “Bulk Bag” packaging.The terms “Marked” and “Unmarked” pertain to laser marking option of capacitors. All packaging options labeled as “Unmarked” will containcapacitors that have not been laser marked.2The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) casesize devices. For more information regarding 2 mm pitch option see “Tape & Reel Packaging Information”.3Reeling tape options (Paper or Plastic) are dependent on capacitor case size (L” x W”) and thickness dimension. See “Chip Thickness/Tape & ReelPackaging Quantities” and “Tape & Reel Packaging Information”.3For additional Information regarding “AUTO” C-Spec options, see “Automotive C-Spec Information”.3All Automotive packaging C-Specs listed exclude the option to laser mark components. Please contact KEMET if you require a laser marked option. Formore information see “Capacitor Marking”.11Benefits 55 C to 150 C operating temperature rangeSuperior flex performance (up to 5 mm)Lead (Pb)-free, RoHS and REACH compliantEIA 0603, 0805, 1206, 1210, and 1812 case sizesDC voltage ratings of 10 V, 16 V, 25 V, 50 V and 100 VCapacitance offerings ranging from 0.5 pF to 0.22 μFAvailable capacitance tolerances of 0.10 pf, 0.25 pf, 0.5 pf, 1%, 2%, 5%, 10%, and 20% Extremely low ESR and ESL High thermal stability High ripple current capability No capacitance change with respect to applied rated DCvoltage Non-polar device, minimizing installation concerns Commercial and Automotive (AEC–Q200) grades available 100% pure matte tin-plated termination finish allowing forexcellent solderability SnPb plated termination finish option available uponrequest (5% Pb minimum)ApplicationsTypical applications include decoupling, bypass, filtering and transient voltage suppression in critical and safety relevantcircuits without (integrated) current limitation, including those subject to high levels of board flexure or temperature cycling. KEMET Electronics Corporation KEMET Tower One East Broward Boulevard Fort Lauderdale, FL 33301 USA 954-766-2800 www.kemet.comC1063 X8R FT-CAP SMD 10/28/20202
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)Automotive C-Spec InformationKEMET automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council.Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for PassiveComponents. These products are supported by a Product Change Notification (PCN) and Production Part Approval Processwarrant (PPAP).Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec, “AUTO.”This C-Spec was developed in order to better serve small and medium-sized companies that prefer an automotive gradecomponent without the requirement to submit a customer Source Controlled Drawing (SCD) or specification for review by aKEMET engineering specialist. This C-Spec is therefore not intended for use by KEMET OEM automotive customers and arenot granted the same “privileges” as other automotive C-Specs. Customer PCN approval and PPAP request levels are limited(see details below.)Product Change Notification (PCN)The KEMET product change notification system is used to communicate primarily the following types of changes: Product/process changes that affect product form, fit, function, and/or reliability Changes in manufacturing site Product obsolescenceProcess/Product changeObsolescence*Days Prior ToImplementationKEMET assignedYes (with approval and sign off)Yes180 days minimumAUTOYes (without approval)Yes90 days minimum11Customer Notification Due To:KEMET AutomotiveC-SpecKEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET.Production Part Approval Process (PPAP)The purpose of the Production Part Approval Process is: To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts. To provide the evidence that all customer engineering design records and specification requirements are properlyunderstood and fulfilled by the manufacturing organization. To demonstrate that the established manufacturing process has the potential to produce the part.PPAP (Product Part Approval Process) LevelKEMET AutomotiveC-Spec12345KEMET assigned1 AUTO1 KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET. Part number specific PPAP available Product family PPAP only KEMET Electronics Corporation KEMET Tower One East Broward Boulevard Fort Lauderdale, FL 33301 USA 954-766-2800 www.kemet.comC1063 X8R FT-CAP SMD 10/28/20203
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)Dimensions – Millimeters (Inches)LWBTSEIA SizeCodeMetric engthWWidth1.60 (0.063) 0.17 (0.007)2.00 (0.079) 0.30 (0.012)3.30 (0.130) 0.40 (0.016)3.30 (0.130) 0.40 (0.016)4.50 (0.178) 0.40 (0.016)0.80 (0.032) 0.15 (0.006)1.25 (0.049) 0.30 (0.012)1.60 (0.063) 0.35 (0.013)2.60 (0.102) 0.30 (0.012)3.20 (0.126) 0.30 (0.012)T ThicknessBBandwidthSee Table 2 forThickness0.45 (0.018) 0.15 (0.006)0.50 (0.02) 0.25 (0.010)0.60 (0.024) 0.25 (0.010)0.60 (0.024) 0.25 (0.010)0.70 (0.028) 0.35 (0.014)SSeparationMinimum0.58 (0.023)0.75 (0.030)N/AMountingTechniqueSolder WaveorSolder ReflowSolder ReflowOnlyQualification/CertificationCommercial Grade products are subject to internal qualification. Details regarding test methods and conditions arereferenced in Table 4, Performance & Reliability.Automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Detailsregarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for PassiveComponents. For additional information regarding the Automotive Electronics Council and AEC–Q200, please visit theirwebsite at www.aecouncil.com.Environmental ComplianceLead (Pb)-free, RoHS, and REACH compliant without exemptions (excluding SnPb termination finish option). KEMET Electronics Corporation KEMET Tower One East Broward Boulevard Fort Lauderdale, FL 33301 USA 954-766-2800 www.kemet.comC1063 X8R FT-CAP SMD 10/28/20204
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)Electrical isticsOperating Temperature RangeCapacitance Change with Reference to 25 C and 0 VDC Applied (TCC)Aging Rate (Maximum % Capacitance Loss/Decade Hour)Dielectric Withstanding Voltage (DWV)123Dissipation Factor (DF) Maximum Limit at 25ºCInsulation Resistance (IR) Minimum Limit at 25 C 55 C to 150 C 15%0%250% of rated voltage(5 1 seconds and charge/discharge not exceeding 50mA)2.5%1,000 MΩ µF or 100 GΩ(Rated voltage applied for 120 5 seconds at 25 C)DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of thecapacitor.2Capacitance and dissipation factor (DF) measured under the following conditions:1 MHz 100 kHz and 1.0 0.2 Vrms if capacitance 1,000 pF.1 kHz 50 Hz and 1.0 0.2 Vrms if capacitance 1,000 pF.3To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 & Agilent E4980 have a feature known asAutomatic Level Control (ALC). The ALC feature should be switched to "ON".1Post Environmental LimitsHigh Temperature Life, Biased Humidity, Moisture ResistanceDielectricRated DCVoltageCapacitanceValueDissipation Factor(Maximum %)CapacitanceShiftUltra-Stable X8RAllAll3.00.3% or 0.25 pF KEMET Electronics Corporation KEMET Tower One East Broward Boulevard Fort Lauderdale, FL 33301 USA 954-766-2800 www.kemet.comInsulationResistance10% of InitialLimitC1063 X8R FT-CAP SMD 10/28/20205
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)Table 1 – Capacitance Range/Selection Waterfall (0603 – 1812 Case EQEQEQEQEQEQEQEQEQEQEQEQEQEQEQEQEQVoltage CodeCase EQEQEQRated Voltage BBBBBBBBBBBBBBBBBBBBB10508 & 758758109 - nce Tolerance0.50 & 0.75 pF0.75 pF1.0 - 9.1 pF*1.1 pF1.2 pF1.3 pF1.5 pF1.6 pF1.8 pF2.0 pF2.2 pF2.4 pF2.7 pF3.0 pF3.3 pF3.6 pF3.9 pF4.3 pF4.7 pF5.1 pF5.6 pF6.2 pF6.8 pF7.5 pF8.2 pF9.1 pF10 pF11 pF12 pF13 pF15 pF16 pF18 pF20 pF22 pF24 pF27 pF30 pF33 pF36 pF39 pF43 pF47 pF51 pF56 pF62 pF68 pF75 pF82 pF91 pF100 pF110 pF120 pF130 pF150 pF160 pF180 pF200 pFC1210C350RatedVoltage itanceC0603CVoltage Code10Case Size/SeriesProduct Availability and Chip Thickness CodesSee Packaging Specs for Chip Thickness DimensionsC0805C KEMET Electronics Corporation KEMET Tower One East Broward Boulevard Fort Lauderdale, FL 33301 USA 954-766-2800 www.kemet.comC1206CC1210CC1812CC1063 X8R FT-CAP SMD 10/28/20206
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)Table 1 – Capacitance Range/Selection Waterfall (0603 – 1812 Case Sizes) ZFUFM84351843518435 KEMET Electronics Corporation KEMET Tower One East Broward Boulevard Fort Lauderdale, FL 33301 USA 954-766-2800 SDSDRDRDRDRDRDRDRDRDRDRDDDFDGProduct Availability and Chip Thickness CodesSee Packaging Specs for Chip Thickness CJCJCJCJCJCJCJCJ125Voltage CodeCase JJJJJJJJJJJJJJJJJJJJJJJJJJJJJJJJJJJ410010Rated Voltage acitance Tolerance220 pF240 pF270 pF300 pF330 pF360 pF390 pF430 pF470 pF510 pF560 pF620 pF680 pF750 pF820 pF910 pF1,000 pF1,100 pF1,200 pF1,300 pF1,500 pF1,600 pF1,800 pF2,000 pF2,200 pF2,400 pF2,700 pF3,000 pF3,300 pF3,600 pF3,900 pF4,300 pF4,700 pF5,100 pF5,600 pF6,200 pF6,800 pF7,500 pF8,200 pF9,100 pF10,000 pF12,000 pF15,000 pF18,000 pF22,000 pF27,000 pF33,000 pF47,000 pF56,000 pF68,000 pF82,000 pF100,000 pF120,000 pF150,000 pF180,000 pF220,000 pFC1210C350RatedVoltage itanceC0603CVoltage Code10Case Size/Series151C1812CC1063 X8R FT-CAP SMD 10/28/20207
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)Table 2A – Chip Thickness/Tape & Reel Packaging QuantitiesPaper Quantity1Plastic QuantityThicknessCodeCaseSize1Thickness Range (mm)7" Reel13" Reel7" Reel13" 12181218120.80 0.15*0.78 0.200.90 0.101.00 0.201.10 0.101.25 0.150.78 0.200.90 0.201.00 0.201.10 0.201.20 0.151.60 0.200.78 0.200.90 0.201.00 0.101.10 0.151.25 0.201.55 0.201.70 0.201.85 0.201.00 0.101.25 0.151.40 0.151.55 0.101.60 0.201.70 ize1Thickness Range (mm)7" Reel13" Reel7" Reel13" ReelPaper Quantity1Plastic QuantityPackage quantity based on finished chip thickness specifications.1If ordering using the 2 mm Tape and Reel pitch option, the packaging quantity outlined in the table above will be doubled. This option is limited to EIA0603 (1608 metric) case size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information". KEMET Electronics Corporation KEMET Tower One East Broward Boulevard Fort Lauderdale, FL 33301 USA 954-766-2800 www.kemet.comC1063 X8R FT-CAP SMD 10/28/20208
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)Table 2B – Bulk Packaging QuantitiesLoose PackagingPackaging TypeBulk Bag (default)Packaging C-Spec1N/A 2Case SizePackaging Quantities (pieces/unit packaging)EIA (in)Metric ,000120,000The "Packaging C-Spec" is a 4 to 8 digit code which identifies the packaging type and/or product grade. When ordering, the proper code must beincluded in the 15th through 22nd character positions of the ordering code. See "Ordering Information" section of this document for further details.Commercial grade product ordered without a packaging C-Spec will default to our standard "Bulk Bag" packaging. Contact KEMET if you require a bulkbag packaging option for Automotive grade products.2A packaging C-Spec (see note 1 above) is not required for "Bulk Bag" packaging (excluding Anti-Static Bulk Bag and automotive grade products). The15th through 22nd character positions of the ordering code should be left blank. All products ordered without a packaging C-Spec will default to ourstandard "Bulk Bag" packaging.1 KEMET Electronics Corporation KEMET Tower One East Broward Boulevard Fort Lauderdale, FL 33301 USA 954-766-2800 www.kemet.comC1063 X8R FT-CAP SMD 10/28/20209
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351 (mm)EIASizeCodeMetricSizeCode0603Density Level A:Maximum (Most)Land Protrusion (mm)Density Level B:Median (Nominal)Land Protrusion (mm)Density Level C:Minimum (Least)Land Protrusion .405.403.70Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflowsolder processes. KEMET only recommends wave soldering of EIA 0603, 0805, and 1206 case sizes.Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should performqualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).Image below based on Density Level B for an EIA 1210 case size.V1YYXCV2XCGrid Placement Courtyard KEMET Electronics Corporation KEMET Tower One East Broward Boulevard Fort Lauderdale, FL 33301 USA 954-766-2800 www.kemet.comC1063 X8R FT-CAP SMD 10/28/202010
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)Soldering ProcessRecommended Soldering Technique: Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206 All other EIA case sizes are limited to solder reflow onlyRecommended Reflow Soldering Profile:KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual),convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermalstress. KEMET’s recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/JSTD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes atthese conditions.Termination FinishSnPbTP100% Matte SnPreheat/SoakTemperature Minimum (TSmin)Temperature Maximum (TSmax)Time (tS) from TSmin to TSmax100 C150 C60 – 120 seconds150 C200 C60 – 120 secondsRamp-Up Rate (TL to TP)3 C/secondmaximum3 C/secondmaximumLiquidous Temperature (TL)183 C217 CTime Above Liquidous (tL)60 – 150 seconds60 – 150 secondsPeak Temperature (TP)235 C260 CTime Within 5 C of MaximumPeak Temperature (tP)20 secondsmaximum30 secondsmaximumRamp-Down Rate (TP to TL)6 C/secondmaximum6 C/secondmaximumTLTemperatureProfile FeaturetPMaximum Ramp-up Rate 3 C/secondMaximum Ramp-down Rate 6 C/secondtLTsmaxTsmin25ts25 C to PeakTimeTime 25 C to Peak6 minutes8 minutesTemperaturemaximummaximumNote: All temperatures refer to the center of the package, measured on thecapacitor body surface that is facing up during assembly reflow. KEMET Electronics Corporation KEMET Tower One East Broward Boulevard Fort Lauderdale, FL 33301 USA 954-766-2800 www.kemet.comC1063 X8R FT-CAP SMD 10/28/202011
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)Table 4 – Performance & Reliability: Test Methods & ConditionsStressReferenceTest or Inspection MethodTerminal StrengthJIS–C–6429Appendix 1, Note: Force of 1.8 kg for 60 seconds.Board FlexJIS–C–6429Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mmfor C0G. Flexible termination system – 3.0 mm (minimum).Magnification 50 X. Conditions:SolderabilityJ–STD–002a) Method B, 4 hours at 155 C, dry heat at 235 Cb) Method B at 215 C category 3c) Method D, category 3 at 260 CTemperature CyclingJESD22 Method JA–104Biased HumidityMIL–STD–202 Method103Moisture ResistanceThermal ShockHigh Temperature LifeStorage LifeVibrationMechanical ShockResistance to SolventsMIL–STD–202 Method106MIL–STD–202 Method107MIL–STD–202 Method108/EIA–198MIL–STD–202 Method108MIL–STD–202 Method204MIL–STD–202 Method213MIL–STD–202 Method2151,000 cycles ( 55 C to 150 C). Measurement at 24 hours 4 hours after test conclusion.Load humidity: 1,000 hours 85 C/85%RH and rated voltage. Add 100K ohm resistor.Measurement at 24 hours 4 hours after test conclusion.Low volt humidity: 1,000 hours 85 C/85% RH and 1.5 V. Add 100 K ohm resistor.Measurement at 24 hours 4 hours after test conclusion.t 24 hours/cycle. Steps 7a and 7b not required. Measurement at 24 hours. 4 hours aftertest conclusion. 55 C/ 150. Note: Number of cycles required – 300. Maximum transfer time – 20 seconds.Dwell time – 15 minutes. Air – Air.1,000 hours at 150 C with 2 X rated voltage applied.150 C, 0 VDC for 1,000 hours.5 g's for 20 minutes, 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB 0.031" thick7 secure points on one long side and 2 secure points at corners of opposite sides. Partsmounted within 2" from any secure point. Test from 10 – 2,000 Hz.Figure 1 of Method 213, Condition F.Add aqueous wash chemical, OKEM Clean or equivalent.Storage & HandlingCeramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust inother environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,and long term storage. In addition, packaging materials will be degraded by high temperature – reels may soften or warpand tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximumstorage humidity not exceed 70% relative humidity. Temperature fluctuations should be minimized to avoid condensation onthe parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stockshould be used promptly, preferably within 1.5 years of receipt. KEMET Electronics Corporation KEMET Tower One East Broward Boulevard Fort Lauderdale, FL 33301 USA 954-766-2800 www.kemet.comC1063 X8R FT-CAP SMD 10/28/202012
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)Flexible Termination System (FT-CAP), U
produced during board flexure and thermal cycling. Flexible termination technology inhibits the transfer of board stress to the rigid ceramic body, therefore mitigating flex cracks which can result in low IR or short circuit failures. Although this technology does not eliminate the potential for mechanical damage that may propagate during extreme
