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A Year in the Life of theNASA Electronic Parts and Packaging(NEPP) ProgramA NASA Office of Safety and MissionAssurance (OSMA) ProgramKenneth A. LaBel,NEPP Program Co-Managerken.label@nasa.govPresented by Kenneth A. LaBel at the Radiation Hardened Electronics Technology (RHET) Conference, Colorado Springs, CO, November 6-8, 2017.1

AcronymsAcronym3DAFAF UGSNHBMHPSCICDefinitionThree Dimensional (3D)Air Force (AF)Air Force Space and Missile Systems Center (AF SMC)Artificial Intelligence (AI)NASA Ames Research Center (ARC)BAE Systems (BAE)Bayesian Networks (BN)Body of Knowledge (BOK)Brigham Young University (BYU)NASA CIO Leadership Teams (CLTs)Complementary Metal Oxide Semiconductor (CMOS)Commercial Off The Shelf (COTS)Cosmic Ray Effects on Micro ElectronicsCopperDouble Data Rate (DDR) [DDR3 Generation 3; DDR4 Generation 4]Dis-integrated Random Access Memory (DiRAM)Defense Logistics Agency (DLA)Defense Microelectronics Activity (DMEA)Department of Defense (DoD)Department of Energy (DOE)Dynamic Random-Access Memory (DRAM)Electrical, Electronic, and Electromechanical (EEE)European Space Agency (ESA)Electronics Technology Workshop (ETW)Fully-Depleted Silicon-On-Insulator (FD-SOI)Fin Field Effect Transistors (FinFETs)Field Programmable Gate Array (FPGA)Gallium Nitride (GaN)Government-Industry Data Exchange Program (GIDEP)Graphics Processing Unit (GPU)Goal Structuring Notation (GSN)High Bandwidth Memory (HBM)High Performance Spacecraft Computing (HPSC)Integrated Circuit vy rared (IR)Joint Electron Device Engineering Council (JEDEC)Los Alamos National Laboratories (LANL)Military AI Works (MAIW)Model-Based Missions Assurance (MBMA)Military (Mil)Metal–Oxide–Semiconductor Field-Effect Transistor (MOSFET)Multi-Processing System on Chip (MPSOC)National Aeronautics and Space Administration (NASA)Naval Surface Warfare Center, Crane, Indiana (Navy Crane)NASA EEE Parts Assurance Group (NEPAG)NASA Electronic Parts and Packaging (NEPP) ProgramNASA National Electric Safety Code (NESC)United States Navy National Reconnaissance Office (NRO)Office of the Chief Engineer (OCE)NASA Office of Safety and Mission Assurance (OSMA) ProgramPlastic Ball Grid ArrayPackage-on-Package (PoP)Quad-Flat No-Leads (QFN)Reliability and Maintainability (R&M)Radiation Hardened (RH)Radiation Hardness AssuranceSociety of Automotive Engineers (SAE)Space Asset Protection Program (SAPP)Systems Engineering and Assurance Modeling (SEAM)Single Event Burnout (SEB)Single Event Effect (SEE)Silicon Carbide (SiC)Small and Medium-sized Enterprises (SME)Sandia National Laboratories (SNL)Systems on a Chip (SOC)NASA's Space Technology Mission Directorate (STMD)System Modeling Language (SysML)Technical Operating Report (TOR)Presented by Kenneth A. LaBel at the Radiation Hardened Electronics Technology (RHET) Conference, Colorado Springs, CO, November 6-8, 2017.2

NEPP Mission StatementProvide NASA’s leadership fordeveloping and maintaining guidancefor the screening, qualification, test,and reliable usage of electrical,electronic, and electromechanical(EEE) parts by NASA, in collaborationwith other government Agencies andindustry.Presented by Kenneth A. LaBel at the Radiation Hardened Electronics Technology (RHET) Conference, Colorado Springs, CO, November 6-8, 2017.3

NEPP - CharterEEE PartsInfrastructure NEPAG Telecons andWorking Groups SME Capabilities Communication andOutreach within NASAand to the greateraerospace communityAgency Priorities –Independent Support Commercial Crew Small MissionReliability Coordination withNASA Consolidation,CLTs, NESC, STMD,SAPP, and radiationblock buy Collaborate withDoD/DOE on spaceradiation testinfrastructureTechnology Evaluation Advanced /new EEEparts/technologies Ex. Advanced CMOS,GaN, SiC Working Groups (NASA, government,aerospace) Screening/qualification/test/usage guidelines Partnering: NASA,Government Agencies,Industry, University,InternationalAgency Leadership NASA Policies andProcedures Agency Guidelines,Body of Knowledge(BOK) documents,and Best Practices Coordination ofGovernment andIndustry Standards Audit Coordinationwith AF, NRO, DLA Partnering withinNASA and otherAgencies, Industry,University, andInternationalMissionAssuranceTrusted and RHElectronics Collaboration withNASA and otherAgency Supply Chainand Trust/CounterfeitElectronicsOrganizations Support DoD effortson Trusted Foundriesand FPGAs (w/NASASTMD and OCE/SpaceAsset Protection) Support DoD RHeffortsEEE Parts ProblemInvestigations Agency/Industry-wideproblems GIDEP and NASA AlertdevelopmentPresented by Kenneth A. LaBel at the Radiation Hardened Electronics Technology (RHET) Conference, Colorado Springs, CO, November 6-8, 2017.4

NEPP – Product DeliveryBest Practicesand GuidelinesNASA EEE PartsPolicy andStandards Test, usage,screening,qualification Radiation facilitystudies SAE G11/G12/JEDEC JC13 Aerospace TORsBOK Technology andproduct status andgap analysisGovernment andIndustryStandardsRepresentationAssuranceNEPP StandardProducts Test, summary, andaudit reports Conference andworkshoppresentations AlertsRelated task areas:Technology/parts evaluations lead to new best practices, etc Presented by Kenneth A. LaBel at the Radiation Hardened Electronics Technology (RHET) Conference, Colorado Springs, CO, November 6-8, 2017.5

Body of Knowledge (BOK) Documents What goes into a BOK– An overview of the technology– An overview of technology applicability tospace/aeronautics– An overview of technology maturity, produceability and/orcommercial availability– Reliability, qualification, and/or radiation knowledge-base– Technology direction or extent of the reliability issue forthe future Identification of experts, technology sources,test houses, etc.– Facilities/capabilities– Recommendation for follow-on NEPP task (if applicable)Presented by Kenneth A. LaBel at the Radiation Hardened Electronics Technology (RHET) Conference, Colorado Springs, CO, November 6-8, 2017.6

What’s New for NEPP in FY18 Increased emphasis on needs of small missionssuch as CubeSats and model-based missionassurance (MBMA)– Partnering with other NASA organizations, Agencies,and universities More assurance products– BOKs, Guidelines, Tools, Information Sharing, Training Significant update of the NEPP website– Easier to find guidance and search for data– New tie-ins to the SmallSat community Support for Agency efforts for EEE PartsConsolidation, Radiation Beam Block Buys, andCapability Leadership TeamsPresented by Kenneth A. LaBel at the Radiation Hardened Electronics Technology (RHET) Conference, Colorado Springs, CO, November 6-8, 2017.7

Advanced Technologies Technology/device evaluations with a nod todeveloping test methods and user guidanceHynix 3D Flash MemoryAMD Ryzen Processor New: collaboration with DMEA andGlobalFoundries on 22nm FD-SOI and 28nm bulkradiation evaluationPresented by Kenneth A. LaBel at the Radiation Hardened Electronics Technology (RHET) Conference, Colorado Springs, CO, November 6-8, 2017.8

NEPP – Processors, Systems on a Chip (SOC), andField Programmable Gate Arrays (FPGAs)State of the ArtCOTSProcessors Sub 32nm CMOS,FinFETs, etc Samsung, Intel,AMD“Space” FPGAs Microsemi RTG4 Xilinx MPSOC ESA Brave (future) “Trusted” FPGA(future)GraphicsProcessorUnits (GPUs)COTS FPGAs Xilinx Kintex Mitigationevaluation TBD: MicrosemiPolarFire Intel, AMD, Nvidia Enabling dataprocessingRadiationHardenedProcessorEvaluation BAE RAD55XX Vorago(microcontrollers) Support HighPerformanceSpacecraftComputing (HPSC)BestPracticesandGuidelinesPartnering Processors: NavyCrane, BAE/NRO FPGAs: AF SMC,SNL, LANL, BYU, Microsemi, Xilinx,Synopsis Cubic AerospacePotential task areas:artificial intelligence (AI) hardware, Intel Stratix 10Presented by Kenneth A. LaBel at the Radiation Hardened Electronics Technology (RHET) Conference, Colorado Springs, CO, November 6-8, 2017.9

NEPP – MemoriesNew materials/architecturesDRAMs Resistive Fujitsu/Panasonic Spin torque transfermagnetoresistive Avalanche, Everspin 3D Xpoint Intel Optane Enabling “universal”memories DDR4 test capability (inprogress) Commercial DDR(various) Tezzaron DiRAM(w/HPSC) Enabling highperformancecomputingCommercial Flash 3D Samsung, Hynix,Micron Planar – TBD Enabling data storagedensityPartneringBestPracticesandGuidelines Navy CraneNASA STMDAvalancheUniversity of PadovaRelated task areas:Deprocessing for single event testing (also w/processors, FPGAs, )Presented by Kenneth A. LaBel at the Radiation Hardened Electronics Technology (RHET) Conference, Colorado Springs, CO, November 6-8, 2017.10

NEPP – PackagingSubstratesDaisy ChainPoPThru Mold ViaCobham –FC/OrganicCobham –Cu PillarNon-Hermetic3D LiteraturereviewQFNPBGA3DTSV g Tezzaron AuroraSemiconductor Xilinx CobhamPresented by Kenneth A. LaBel at the Radiation Hardened Electronics Technology (RHET) Conference, Colorado Springs, CO, November 6-8, 2017.11

Working Industry/Agency-WideConcernsThermal Image of failure locationsTantalum capacitor failureHigh magnitude opticalimages of failurelocationsCross-section of failurelocationFailure analysis of Schottkydiode radiation damagePresented by Kenneth A. LaBel at the Radiation Hardened Electronics Technology (RHET) Conference, Colorado Springs, CO, November 6-8, 2017.12

Vendor Validation TestsGaN IC – radiation test analysisComparison of n-type 60V trenchMOSFET SEB thresholdsPresented by Kenneth A. LaBel at the Radiation Hardened Electronics Technology (RHET) Conference, Colorado Springs, CO, November 6-8, 2017.13

Infrastructure ChallengesUsing Proton Cancer Therapy Centersfor electronics testingPresented by Kenneth A. LaBel at the Radiation Hardened Electronics Technology (RHET) Conference, Colorado Springs, CO, November 6-8, 2017.14

NEPP - Small Mission EffortsCOTS andNon-Mil DataSEEReliabilityAnalysisBestPractices andGuidelinesModel-BasedMissionAssurance(MBMA) W NASA basesReliableSmallMissionsWorkingGroupsPotential future task areas: automotive and avionics resiliencePresented by Kenneth A. LaBel at the Radiation Hardened Electronics Technology (RHET) Conference, Colorado Springs, CO, November 6-8, 2017.15

NEPP Small Mission Efforts and MBMA(w/ NASA MBMA Program)NASA/GSFC (Campola)Small Mission RHATBDSmall Mission EEE Parts Best PracticesNASA/GSFC (Xapsos)RHA Confidence ApproachAerospace (proposed)CubeSat Kit Vendor Survey“Mid-space” Grade Survey andRequirements DefinitionVanderbilt UniversityGSN Exemplar (SEE) – completeTBDGSN Exemplar – EEE parts reliabilitySaint Louis UniversityCubeSat Success StudyJPLCubeSat EEE Parts DatabasesTBDCubeSat EEE Parts TestingNASA/GSFC (Berg)SEE Classic ReliabilityVanderbiltCRÈME ToolsuiteTBDResilience, autonomyVanderbilt UniversityBN follow-onBN integrated into SEAMOtherIntegration with SmallSpacecraft Virtual nstituteEmerging ModelingVanderbilt UniversityWeb-based tool (SEAM)NASA/GSFC (Campola) - VanderbiltNotional RHA Tool (R-GENTIC)OtherMAIWSmallSat Reliability Initiative(NASA/AF/ others)https://modelbasedassurance.org/Presented by Kenneth A. LaBel at the Radiation Hardened Electronics Technology (RHET) Conference, Colorado Springs, CO, November 6-8, 2017.16

Partnering is key Within– NASA With– Othergovernmentagencies– Industry– University– InternationalPresented by Kenneth A. LaBel at the Radiation Hardened Electronics Technology (RHET) Conference, Colorado Springs, CO, November 6-8, 2017.17

Emerging Assurance Methods(Witulski, Vanderbilt University, NEPP ETW 2017)9th Annual NEPPElectronicsTechnologyWorkshop (ETW)Radiation TestingScheduled dates:June 18-21, 2018NASA/GSFC and on-lineCommercial IC PackagingAdvanced Technology ReliabilityPresented by Kenneth A. LaBel at the Radiation Hardened Electronics Technology (RHET) Conference, Colorado Springs, CO, November 6-8, 2017.18

http://nepp.nasa.govPresented by Kenneth A. LaBel at the Radiation Hardened Electronics Technology (RHET) Conference, Colorado Springs, CO, November 6-8, 2017.19

Presented by Kenneth A. LaBel at the Radiation Hardened Electronics Technology (RHET) Conference, Colorado Springs, CO, Novembe-8, 2017.r 6 6 What's New for NEPP in FY18