WIXLIB

3D & Advanced PackagingCompany Overview – March 12, 2015Tuesday, October 03, 2017

3D & ADVANCEDPACKAGING ISNOW WITHINREACH3D & Advanced Packaging

WHAT IS NEXT LEVEL INTEGRATION?Next Level Integration blends high density packaging with advancedinterconnect to quickly deliver miniaturized solutionsNext Level IntegrationSemiconductor LevelIntegrationSystem LevelIntegrationGoing forward, ISI believes that packaging technology will playas big a role as transistor evolution in advancing Moore’s Law3D & Advanced Packaging

DEVELOPING IC PACKAGES SINCE 1987KEYMILESTONESDeveloped 557 I/O PPGAfor 48 Watt GaAs die1993200120103D & Advanced PackagingInvested in equipment &clean room to provide ICassembly servicesSignificantly increased 3D& stacked die capabilities

IC PACKAGING 101Die Attach & Wire BondFlip Chip & UnderfillISI designs multi-die modules utilizing both Wire Bond and Flip Chip die.3D & Advanced Packaging

PACKAGING TECHNOLOGIES3D Die Stacking Multiple processes qualified Utilize standard die - no TSVs (through silicon vias) requiredExamples:3D & Advanced Packaging

PACKAGING TECHNOLOGIESThermoset OvermoldingMultiple packaged ICs, bare die, and passive components can be ‘molded’ into single, monolithic component Thermoset epoxy is same type of material used in standard BGA and QFP packages Does not melt or soften during subsequent reflow processes Ultra-fine particle size can underfill BGAs and flip chips and also provide wirebond encapsulationIdeal for rugged environmentsCross-Section3D & Advanced Packaging

PACKAGING TECHNOLOGIES3D Substrate StackingISI designs and manufactures high-density z-axis interconnect to facilitate stacking of thin substrates 0.4mm pitch and above (area array) Precision dimensions / thin walls minimize keep-out areaSubstrateStackingStacked Substratesusing Bare Die3D & Advanced PackagingStacked Substratesusing Packaged Devices

2.0”ADVANCED PACKAGING EXAMPLESSystem in Package45x45mm BGA2 Flip Chip Die3 Wire Bond Die2 Packaged ICsMultiple Passives1.5”1.0”20mm.5”10mm45 x 45 mm (1.77” x 1.77”)Final assembly is a BGApackage with heat spreader3D & Advanced Packaging

2.0”ADVANCED PACKAGING EXAMPLES1.5”1.0”20mmAtom DDR3 Module40x45mm BGA(1) Intel Atom Processor(9) SDRAM DDR3L x8 (x72 bank)Integrated Heat SpreaderOvermolded for High Reliability applicationsFinal assembly is a BGApackage with heat spreader3D & Advanced Packaging.5”10mm40 x 45 mm (1.57” x 1.77”)

2.0”ADVANCED PACKAGING EXAMPLES1.5”1.0”20mmSystem in Package(SiP).5”10mm22 x 22 mm (.86” x .86”)4 Die Stack: Processor DDR Flash ADCVR Die & PassivesHiLo Connector for Stacking22x22mm ModuleShown prior to encapsulation3D & Advanced Packaging

ISI FC512 CONFIGURATORBGA Package 13x13mm body size 9 die module 224 balls 0.8mm pitch13x13mm BGA27-Up Array3D & Advanced Packaging9-Up Array

2.0”ADVANCED PACKAGING EXAMPLESMicro FPGA Compute NodeFlip Chip FPGA Die(2) Multi-Die DDR3 packagesPower managementCard Edge Interface3D & Advanced Packaging1.5”1.0”20mm.5”10mm21 x 29 mm (.82” x 1.14”)

ADVANCED PACKAGING EXAMPLES32 Node Compute Cluster32 nodes are inserted intowater-cooled Master Module3D & Advanced PackagingEach Micro FPGACompute Node isenclosed in a heatspreaderMaster Module interfaces tosystem board through custom2368 pin ISI HiLo socketingsystem

2.0”ADVANCED PACKAGING EXAMPLES1.5”1.0”20mmChip on Flex.5”10mm3 wire bond diePassivesEmbedded in smart credit card32.3 x 28.2 mm(1.27” x 1.11”)Chip on Rigid-FlexDual die designFlex portion allows 90orientation of sensors3D & Advanced Packaging22 x 23 mm(.86” x .90”)

2.0”ADVANCED PACKAGING EXAMPLESHigh Density Memory Module5 DDR3 DieLong wirebonds to reach center-of-die pads3D & Advanced Packaging1.5”1.0”20mm.5”10mm32 x 25 mm (1.25” x .98”)

ADVANCED PACKAGING EXAMPLESLiquid Crystal on Silicon (LCoS) PackageLarge LCoS die (30mm )Precise mechanical tolerances to provide alignment to optical systemVery flat heatsink ( /- 0.0005”) to prevent image distortionMaterial set Engineered to be stable over operating temp rangeHigh volume cost-sensitive application3D & Advanced Packaging2.0”1.5”1.0”20mm.5”10mm61.6 x 67.3 mm (2.42” x 2.64”)

2.0”ADVANCED PACKAGING EXAMPLESMulti Die Module1.5”1.0”20mm.5”10mm9 die in module smaller than credit card55 x 39 mm (2.16” x 1.53”)Less than 20% of the size of discretecomponent design3D & Advanced Packaging

HIGH-DENSITY MEMORY SOLUTIONSFive-Chip Memory ModuleBumped substrate is wirebonded to memory die tomake CSP building blockThree CSP buildingblocks are embeddedin the baseThe top substrate has BGA padsallowing for placement of twoadditional packaged memoriesThe bottom side of modulehas BGA spheres forassembly to the boardUnique memory solution using die and packaged devicesBGA Package in Package (PiP)and Package on Package (PoP)Flash StacksPoPPiP withembeddedBGATwo HighDoubles SDRAM density in same PCB footprint3D & Advanced PackagingFour HighUp to 4X Density

3D DDR3 MODULECustomer’s Challenge Customer required high density compute nodes for HPCapplicationISI’s Solution Placed overmolded 3D-DIMM modules on bottom side of PCB,directly under the FPGAEliminated 14 layers on customer PCB by mapping 3D-DIMMmodule pin-out directly to FPGA pins, connect by though-holeviaLower profile design increased airflow, and allowed computenodes to be stacked together on a tighter pitchFreed up massive real estateImproved signal integrity by dramatically reducing trace lengthfrom FPGA to DDR33D & Advanced Packaging4 memories onbottom of topboard1 memories register miscon top of bottomboardHeat spreader can beadded to center ofmodule if required4 Memories onTopside of ModuleVoid-free overmold/ underfill betweenmodule substrates

MMCM: MOLDED MULTI-COMPONENT MODULESMMCM Complex, multiple components integrated ina single module Bare or packaged die passiveelectronic components overmoldedwith thermoset epoxy3D Stacked BGAmodule and x-ray Ideal for miniaturized, rugged applicationsin harsh environments An affordable way to ruggedize electronicmodules3D Stacked BGAmodule and x-ray Modules can be designed to directly replaceobsolete devices40-pin DIPmodule and x-ray3D & Advanced Packaging

MULTI COMPONENT PACKAGES350 BGA MMCM240 QFP MMCMTop ViewTop ViewInternal components include: Modern FPGA in small BGA package Level translators for IO Voltage regulation Decoupling caps, etc.Bottom View3D & Advanced Packaging

40-PIN DIP PACKAGE FOR AVIONICSCustomer’s Challenge Avionics customer faced obsolescence on part, neededalternative IC packageRedesigning avionics main board would mean requalificationDue to high temp and vibration requirements, a standard nonovermolded adapter would not be an optionSMT CSPOvermold encapsulantEtched Leadframe, PDIP40Laminate substrateISI’s Solution After in-depth cost analysis, customer determined it would be morecost effective to design an ISI overmolded 40-pin DIP package toreplace current IC packageThe rugged overmolded design consisted of off-the-shelf packagedparts on an FR4 PCB with ISI lead frame pinsNon-molded prototypes delivered and tested within 4-6 weeksMolded prototypes met customer qualifications and delivered within 2weeks after approvalISI solution flexible to meet any of the customer’s future redesignissues3D & Advanced Packaging

THANK YOU!Contact ISI to engage on your next project:» Dave GagnonWestern USAOffice: (714) 993-9618Cell:(714) 261-3733Email: dave.gagnon@molex.comAddress:Phone:Website:» Bob GaronMidwest USACell:(630) 707-0991Email: bob.garon@molex.com741 Flynn Road / Camarillo, California 93012(805) 482-2870www.ISIPKG.com» Brian WitzenEastern USACell:(919) 633-0798Email: brian.witzen@molex.com

Die Attach & Wire Bond Flip Chip & Underfill ISI designs multi-die modules utilizing both Wire Bond and Flip Chipdie. 3D & Advanced Packaging PACKAGING TECHNOLOGIES . Ultra-fine particle size can underfill BGAs and flip chips and also provide wirebond encapsulation Ideal for rugged environments Cross-Section PACKAGING TECHNOLOGIES.