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ONE COMPANY MANY SOLUTIONSEPOXYPOTTING & MARINEMEDICALTELECOMMUNICATIONSCONSUMER ELECTRONICSUTILITIESISO 9001:2008 Registered Quality System SAI Global File #004008 Burlington, Ontario, Canada

WHAT IS MG CHEMICALS?MG Chemicals is a manufacturer and wholesaler of chemical products for the electronics industry. Our chemicalproducts include dusters and circuit coolers, electronic cleaners, flux removers, contact cleaners, protectivecoatings, epoxies, adhesives, RTV silicones, lubricants, EMI/RFI shielding coatings, thermal management products,prototyping supplies, solders and more. We also distribute related non-chemical products such as wipes, swabs,brushes, desoldering braids, copper-clad boards and 3D printing filaments.MG SERVICEMG Chemicals understands that setting up production involves multiple challenges. Our service team has yearsof experience in production and equipment use, and understands the various technical issues you may encounterduring planning, pilot studies and production runs. To overcome these challenges, we offer the following professionalservices.MG Chemicals can Provide advice on equipment and materialsAssist with setup and troubleshootingReview your proposed application processesSuggest ways of optimizing and customizing processes to best meet your needsOffer training on the proper use of our productsQuality AssuranceSince 1955, MG Chemicals has provided the North American electronics industry with a full line of high performancechemicals and accessories. The MG Chemicals manufacturing facility operates under the ISO 9001 Quality SystemStandard. All products undergo MG Chemicals’ design process, including the testing and analysis of each productto maximize performance, user safety, environmental safeguards and market desirability.Customer Care Customer care is what separates MG Chemicals from the rest. Our commitment to all of these principles focuseson getting you the quality product and support you deserve.2

TABLE OF CONTENTSINTRODUCTION TO EPOXY ENCAPSULATING AND POTTING COMPOUNDS4-5832 SERIES - Non-UL spec products6832HD - Black, 1:16832C - Translucent6832B - Black, 2:1832WC - Water Clear6832FX - Flexible7832TC - Thermally Conductive7832HT - High Temperature7832 SERIES COMPARISON TABLE8Available Packaging (Cartridges)8834 SERIES - Compounds meeting the UL 746E standard834B - Balanced Formula9834FRB - Low Viscosity9834ATH - Economical10834FX - Flexible10834HTC - High Thermal Conductivity10834 SERIES COMPARISON TABLE11Available Packaging (Kits) 10-113

INTRODUCTION TO EPOXY POTTINGAND ENCAPSULATING COMPOUNDSEpoxy Potting and Encapsulating CompoundsPotting compounds are designed to provide a high level of protection to printed circuit boards and electronicdevices by embedding them in a thick, durable polymer. Epoxies are used when extreme operatingconditions require optimum protection. They offer different physical and chemical properties from otheralternatives, and these properties are listed below.Physical Protection – These compounds hold components firmly in place, preventing damage from vibration,mechanical shocks, abrasion, bending, tension, compression and torsion.Environmental Protection - They are non-porous, providing complete protection from humidity and water,allowing for direct submersion in salt water, and granting complete protection from dust, soil, corrosion andfungus. They also are extremely chemically resistant and can resist most fuels, oils, alcohols, mild solvents,and strong acids.Electrical Protection - Epoxies have inherent insulative properties that result in a high volume resistivityand dielectric strength. These features allow epoxies to provide protection from static discharge, electricalshocks and arcing, and also allow tighter spacing between components.Thermal Protection – They provide a high level of resistance to thermal cycling and thermal shock, which isan important requirement for many customers who are looking to protect their electronics from temperatureswings.Technology Protection – Black systems block visual inspection and are very difficult to remove withoutdestroying the underlying device, making it more difficult for competitors to reverse engineer.The three main chemistries in thermosetting, potting and encapsulation compounds are epoxies, siliconesand polyurethanes. Epoxies provide a set of benefits not seen with the other chemistries, some of which arelisted below:BENEFITS & FEATURES Cost effectiveEasy to useExtended shelf lifeRoom temperature shipping and storageRoom temperature cures are the normCuring can usually be accelerated with heatLow VOC’sIsocyanate-freeChemical resistancePrimerless adhesion to many substratesMore rigidExcellent moisture resistanceExcellent durabilityExcellent bond strengthMultifunctional protection4

All of our epoxy compounds share certain characteristics; however, the characteristics of each of our productsvary to meet the specific needs of the different applications they are intended to serve. Here are some of theways the characteristics of our compounds vary:UL Ratings – In the epoxy potting compound line, this comprises the UL 94 flammability rating and the UL746A certification for electrical and mechanical properties. Some industries, such as aerospace and defense,require UL listings to even consider using a product. All compounds in our 834 series are either in theprocess of being certified or are already UL certified to UL 94V-0.Thermal Conductivity – Certain applications involve a lot of heat generation at the board level, requiringthermal management considerations. As polymers are generally thermally insulative on their own, formulatingspecifically for thermal conductivity is important. Our thermally conductive compounds address the issueof thermal management by transferring the heat from the electronics through the potting compound, thusincreasing life span and reliability as well as reducing the overall temperature of components.Hard or Flexible – We offer epoxy potting compounds that are either hard (70-90 Shore D) or flexible (80-90Shore A). Certain applications require hard compounds; however, hard compounds can introduce stressesthat affect sensitive components in situations where a lot of thermal cycling occurs. Flexible epoxies providea low-stress option in sensitive applications where traditional hard options cannot be used but the corechemical properties of an epoxy are still desired.Optical Clarity – Most potting compounds are pigmented black to prevent visual inspection and maximizeradiative cooling. However, we offer products that are clear to allow visual inspection: 832C, which istranslucent amber, and 832WC, which is water-clear for maximum optical transmission.Mix Ratios – MG Chemical formulates epoxies with convenient 1:1 or 2:1 mix ratios for easy processing.In some of our specialty products, we utilize mix ratios that are 4:1 or 5:1 to achieve certain desirableproperties.Viscosity – Viscosity is the measurement of a product’s resistance to flow, and is usually measured incentipoise (cP). The viscosity is important for an application and should be considered during the designstage. Our products vary from low viscosity (less than 1000 cP, thin) to high viscosity (greater than 18000cP). Products that contain a lot of filler are usually thick, while some compounds can be extremely thin.Working Time – Our epoxies have various working times, depending on the specific resin and hardener beingused. Epoxies cure exothermically, and the reaction is accelerated through heat, meaning that a curing epoxyis self-accelerating. Depending on application needs, a low exotherm epoxy may be desired when workingwith larger quantities, and higher exotherm options may be desired for throughput when working with smallquantities. We measure and list our working times using 100 g batches of epoxy.Cure Schedule– Most epoxies can be cured at room temperature; however, optimal properties are achievedwhen using an elevated temperature. Generally, we try to provide multiple cure schedules, and the mostcommonly used cure temperatures are 25 C, 65 C, and 80 C. Typically, increasing temperature willdecrease cure time. Each system has a limit as to how high it can be heated without impairing the qualitiesof the cured product.5

832 SERIES– Non-UL spec products832B - Black, 2:1832HD - Black, 1:1A general epoxy potting and encapsulating compoundthat is extremely tough and durable.A general epoxy potting and encapsulatingcompound with a 1:1 volume mix ratio.BENEFITS & FEATURESBENEFITS & FEATURES 2:1 volume mix ratioVery high tensile strengthVery strong compressive strengthStrong flexural strength Cat. NumberPackagingNet VolumeNet Weight832B-375MLKit375 mL12.6 fl oz403 g832B-3LKit2.55 L0.68 gal2.74 kg832B-12LKit10.8 L2.88 gal832B-60LKit60 L16 galVery high lap shear strengthCat. NumberPackagingNet VolumeNet Weight0.89 lb832HD-25MLDual syringe*25 mL0.8 fl oz26.2 g0.92 oz6.04 lb832HD-50MLDual cartridge*50 mL1.6 fl oz52.5 g1.85 oz11.6 kg25.6 lb832HD-400MLDual cartridge400 mL 13.5 fl oz420 g14.8 oz64.5 kg142 lb832HD-7.4LKit7.4 L1.9 gal7.77 kg17.1 lb832HD-40LKit40 L10 gal42 gal92 lb832C - Translucent832WC - Water ClearA general epoxy potting and encapsulating compoundthat is a translucent amber color.An optically clear compound for encapsulatingLED’s, fiber optics, or any potting or adhesiveapplication requiring optimal clarityBENEFITS & FEATURES BENEFITS & FEATURES2:1 volume mix ratioAmber color allows for visual inspectionVery high tensile strengthVery strong compressive strengthVery high electrical resistivity Cat. NumberPackagingNet Volume12.9 oz832WC-375MLKit375 mL 12.6 fl oz483 g15.5 oz832WC-3LKit2.7 L2.85 qt5.39 pt2.73 kg6.0 lb832WC-12LKit10.8 L16 gal64.3 kg142 lb832WC-60LKit60 LCat. NumberPackagingNet Volume832C-375MLKit375 mL 12.7 fl oz402 g832C-450MLDual cartridge450 mL 25.3 fl oz832C-3LKit2.55 L832C-60LKit60 L62:1 volume mix ratioOptically clearMinimal yellowing over timeNet Weight*Dispensing gun(s) and / or additional static mixers available. See website for details.Net Weight401 g14.1 oz2.89 kg6.37 lb2.88 gal 11.5 kg25.5 lb16 gal64.2 kg141 lb

832FX - FlexibleFor use in stress-sensitive or low temperatureapplications.BENEFITS & FEATURES 1:1 volume mix ratioSoft, 88 Shore A hardnessLow mixed viscosity of 700 cPLow Tg of 8.8 CCat. NumberPackagingNet VolumeNet Weight832FX-450MLKit450 mL15.2 fl oz475 g1.05 lb832FX-1.7LKit1.7 L57 fl oz1.8 kg3.9 lb832FX-7.4LKit7.4 L1.9 gal7.82 kg17.2 lb832FX-40LKit40 L10 gal42.2 kg93.2 lb832TC - Thermally Conductive832HT - High TemperatureFor use when potting heat generating components.For use in high temperature applications, orapplications requiring strong chemical resistance orphysical strength.BENEFITS & FEATURESBENEFITS & FEATURES 1:1 volume mix ratioGood thermal conductivityGood lap shear strengthLow exothermLong working time of 2 hoursNet VolumeNet Weight2:1 weight mix ratioHigh tensile strengthVery high dielectric strengthStrong compressive strengthStrong flexural strengthGood lap shear strengthExcellent chemical resistanceHigh Tg of 89 CCat. NumberPackagingCat. NumberPackaging832TC-450MLKit450 mL15.2 fl oz752 g1.66 lb832HT-375MLKit340 mL11.5 fl oz377 g12.1 oz832TC-2LKit1.7 L0.45 gal2.84 kg6.26 lb832HT-3LKit2.3 L2.43 qt2.55 kg5.62 lb832TC-8LKit7.2 L1.92 gal12.0 kg26.5 lb832TC-40LKit40 L10.7 gal66.8 kg147 lbNet VolumeNet Weight7