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RS1G201ATDatasheetPch -40V -78A Power MOSFETl OutlineVDSS-40VRDS(on)(Max.)5.2mΩID 78APD40WHSOP8l Inner circuitl Features1) Low on - resistance2) Small Surface Mount Package (HSOP8)3) Pb-free plating ; RoHS compliantl Packaging specificationsPackingl ApplicationReel size (mm)Tape width (mm)Quantity (pcs)Taping codeMarkingTypeLoad SwitchingEmbossedTape330122500TB1RS1G201ATl Absolute maximum ratings (Ta 25 C ,unless otherwise specified)ParameterDrain - Source voltageContinuous drain currentTc 25 CTa 25 CPulsed drain currentGate - Source voltageAvalanche current, single pulseAvalanche energy, single pulseValueUnitVDSS-40VID*1IDIDP*2 78 20 80AAAVGSSIAS*3 20-203140VAmJW3.0150-55 to 150WEAS*3PD*1PD*4TjPower dissipationJunction temperatureOperating junction and storage temperature rangewww.rohm.com 2020 ROHM Co., Ltd. All rights reserved.SymbolTstg1/10 20200710 - Rev.002
RS1G201ATDatasheetl Thermal rmal resistance, junction - caseRthJC*1--3.1 /WThermal resistance, junction - ambientRthJA*4--41.7 /Wl Electrical characteristics (T a 25 C)ParameterSymbolDrain - Source breakdownvoltageBreakdown voltagetemperature coefficientConditionsV(BR)DSS VGS 0V, ID -1mAΔV(BR)DSS ID -1mAValuesUnitMin.Typ.Max.-40--V--22-mV/ ΔTjreferenced to 25 Zero gate voltagedrain currentIDSSVDS -40V, VGS 0V---1μAGate - Source leakage currentIGSSVGS 20V, VDS 0V-- 100nAGate threshold voltageVGS(th)VDS VGS, ID -1mA-1.0--2.5VGate threshold voltagetemperature coefficientΔVGS(th)-3.7-mV/ Static drain - sourceon - state resistanceRDS(on)*5VGS -10V, ID -20A-4.25.2VGS -4.5V, ID -20A-5.26.5ΔTjID -1mAreferenced to 25 mΩGate resistanceRGf 1MHz, open drain-4.6-ΩForward TransferAdmittance Yfs *5VDS -5V, ID -20A33--S*1 Tc 25 , Limited only by maximum temperature allowed.*2 Pw 10μs, Duty cycle 1%*3 L 0.1mH, V DD -20V, RG 25Ω, Starting Tj 25 Fig.3-1,3-2*4 Mounted on a Cu board (40 40 0.8mm)*5 Pulsedwww.rohm.com 2020 ROHM Co., Ltd. All rights reserved.2/1020200710 - Rev.002
RS1G201ATDatasheetl Electrical characteristics (Ta 25 nput capacitanceCissVGS 0V-6890-Output capacitanceCossVDS -20V-770-Reverse transfer capacitanceCrssf 1MHz-590-VDD -20V,VGS -10V-24-tr*5ID -10A-98-td(off)*5RL 2Ω-330-RG 10Ω-250-Turn - on delay timeRise timeTurn - off delay timetd(on)*5tf*5Fall timepFnsl Gate charge characteristics (Ta 25 C)ParameterTotal gate chargeSymbolV GS -10VQg*5Gate - Source chargeQgs*5Gate - Drain chargeQgd*5ValuesConditionsVDD -20VID -20AV GS -4.5VUnitMin.Typ.Max.-130--62--24--17-nCl Body diode electrical characteristics (Source-Drain) (Ta 25 C)ParameterContinuous forward currentSymbolISValuesConditionsTa 25 UnitMin.Typ.Max.---2.5A---80APulse forward currentISP*2Forward voltageVSD*5VGS 0V, IS -2.5A---1.2VReverse recovery timetrr*5-34-nsReverse recovery chargeQrr*5IS -20A, VGS 0Vdi/dt 100A/μs-33-nCwww.rohm.com 2020 ROHM Co., Ltd. All rights reserved.3/1020200710 - Rev.002
RS1G201ATDatasheetl Electrical characteristic curvesFig.1 Power Dissipation Derating CurveFig.2 Maximum Safe Operating AreaFig.3 Normalized Transient ThermalResistance vs. Pulse WidthFig.4 Single Pulse Maximum PowerDissipationwww.rohm.com 2020 ROHM Co., Ltd. All rights reserved.4/1020200710 - Rev.002
RS1G201ATDatasheetl Electrical characteristic curvesFig.5 Typical Output Characteristics(I)Fig.6 Typical Output Characteristics(II)Fig.7 Breakdown Voltage vs.Junction TemperatureFig.8 Typical Transfer Characteristicswww.rohm.com 2020 ROHM Co., Ltd. All rights reserved.5/1020200710 - Rev.002
RS1G201ATDatasheetl Electrical characteristic curvesFig.9 Gate Threshold Voltage vs.Junction TemperatureFig.10 Forward Transfer Admittance vs.Drain CurrentFig.11 Drain Current Derating CurveFig.12 Static Drain - Source On - StateResistance vs. Gate Source Voltagewww.rohm.com 2020 ROHM Co., Ltd. All rights reserved.6/1020200710 - Rev.002
RS1G201ATDatasheetl Electrical characteristic curvesFig.13 Static Drain - Source On - StateResistance vs. Junction TemperatureFig.14 Static Drain - Source On - StateResistance vs. Drain Current (I)Fig.15 Static Drain - Source On - StateResistance vs. Drain Current (II)Fig.16 Static Drain - Source On - StateResistance vs. Drain Current (III)www.rohm.com 2020 ROHM Co., Ltd. All rights reserved.7/1020200710 - Rev.002
RS1G201ATDatasheetl Electrical characteristic curvesFig.17 Typical Capacitances vs.Drain - Source VoltageFig.18 Switching CharacteristicsFig.19 Typical Gate ChargeFig.20 Source Current vs.Source Drain Voltagewww.rohm.com 2020 ROHM Co., Ltd. All rights reserved.8/1020200710 - Rev.002
RS1G201ATDatasheetl Measurement circuitsFig.1-1 Switching Time Measurement CircuitFig.1-2 Switching WaveformsFig.2-1 Gate Charge Measurement CircuitFig.2-2 Gate Charge WaveformFig.3-1 Avalanche Measurement CircuitFig.3-2 Avalanche Waveforml NoticeThis product might cause chip aging and breakdown under the large electrified environment.Please consider to design ESD protection circuit.www.rohm.com 2020 ROHM Co., Ltd. All rights reserved.9/1020200710 - Rev.002
RS1G201ATDatasheetl Dimensionswww.rohm.com 2020 ROHM Co., Ltd. All rights reserved.10/1020200710 - Rev.002
NoticePrecaution on using ROHM Products1.Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If youintend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transportequipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including caraccessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury orserious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for anydamages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for SpecificApplications.(Note1) Medical Equipment Classification of the Specific ��CLASSⅢCLASSⅣCLASSⅢ2.ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductorproducts can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequatesafety measures including but not limited to fail-safe design against the physical injury, damage to any property, whicha failure or malfunction of our Products may cause. The following are examples of safety measures:[a] Installation of protection circuits or other protective devices to improve system safety[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure3.Our Products are designed and manufactured for use under standard conditions and not under any special orextraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any wayresponsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under anyspecial or extraordinary environments or conditions. If you intend to use our Products under any special orextraordinary environments or conditions (as exemplified below), your independent verification and confirmation ofproduct performance, reliability, etc, prior to use, must be necessary:[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,H2S, NH3, SO2, and NO2[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items[f] Sealing or coating our Products with resin or other coating materials[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-solublecleaning agents for cleaning residue after soldering[h] Use of the Products in places subject to dew condensation4.The Products are not subject to radiation-proof design.5.Please verify and confirm characteristics of the final or mounted products in using the Products.6.In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying powerexceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affectproduct performance and reliability.7.De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use inthe range that does not exceed the maximum junction temperature.8.Confirm that operation temperature is within the specified range described in the product specification.9.ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined inthis document.Precaution for Mounting / Circuit board design1.When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect productperformance and reliability.2.In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method mustbe used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,please consult with the ROHM representative in advance.For details, please refer to ROHM Mounting specificationNotice-PGA-E 2015 ROHM Co., Ltd. All rights reserved.Rev.004
Precautions Regarding Application Examples and External Circuits1.If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of thecharacteristics of the Products and external components, including transient characteristics, as well as staticcharacteristics.2.You agree that application notes, reference designs, and associated data and information contained in this documentare presented only as guidance for Products use. Therefore, in case you use such information, you are solelyresponsible for it and you must exercise your own independent verification and judgment in the use of such informationcontained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or lossesincurred by you or third parties arising from the use of such information.Precaution for ElectrostaticThis Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take propercaution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not beapplied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).Precaution for Storage / Transportation1.Product performance and soldered connections may deteriorate if the Products are stored in the places where:[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2[b] the temperature or humidity exceeds those recommended by ROHM[c] the Products are exposed to direct sunshine or condensation[d] the Products are exposed to high Electrostatic2.Even under ROHM recommended storage condition, solderability of products out of recommended storage time periodmay be degraded. It is strongly recommended to confirm solderability before using Products of which storage time isexceeding the recommended storage time period.3.Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leadsmay occur due to excessive stress applied when dropping of a carton.4.Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products ofwhich storage time is exceeding the recommended storage time period.Precaution for Product LabelA two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.Precaution for DispositionWhen disposing Products please dispose them properly using an authorized industry waste company.Precaution for Foreign Exchange and Foreign Trade actSince concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreigntrade act, please consult with ROHM in case of export.Precaution Regarding Intellectual Property Rights1.All information and data including but not limited to application example contained in this document is for referenceonly. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or anyother rights of any third party regarding such information or data.2.ROHM shall not have any obligations where the claims, actions or demands arising from the combination of theProducts with other articles such as components, circuits, systems or external equipment (including software).3.No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or anythird parties with respect to the Products or the information contained in this document. Provided, however, that ROHMwill not assert its intellectual property rights or other rights against you or your customers to the extent necessary tomanufacture or sell products containing the Products, subject to the terms and conditions herein.Other Precaution1.This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.2.The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior writtenconsent of ROHM.3.In no event shall you use in any way whatsoever the Products and the related technical information contained in theProducts or this document for any military purposes, including but not limited to, the development of mass-destructionweapons.4.The proper names of companies or products described in this document are trademarks or registered trademarks ofROHM, its affiliated companies or third parties.Notice-PGA-E 2015 ROHM Co., Ltd. All rights reserved.Rev.004
DatasheetGeneral Precaution1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a nyROHM’s Products against warning, caution or note contained in this document.2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any priornotice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale srepresentative.3.The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that allinformation contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible orliable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of orconcerning such information.Notice – WE 2015 ROHM Co., Ltd. All rights reserved.Rev.001
Tc 25 C ID*1 78 A Ta 25 C ID 20 A Pulsed drain current IDP*2 80 A Gate - Source voltage VGSS 20 V Avalanche current, single pulse IAS*3-20 A Avalanche energy, single pulse EAS*3 31 mJ Power dissipation PD*1 40 W PD*4 3.0 W Junction temperature Tj 150 Operating junction and storage temperature range Tstg-55 to 150 www.rohm .
