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Sudhir KoulDirector Engineering, SoC DesignSamsung Semiconductors IncOctober, 2019

Samsung Automotive Solutions Evolution in Automotive Technology Product Solutions Design Solutions Methodology Solutions Process Solutions Manufacturing Solutions IP Solutions Success StoriesSamsung Foundry-2-

October 2019

The Evolution of Automotive Technology Transportation Intelligence4

Technologies for Autonomous VehiclesDeep Learning5G NetworkSecurity SystemProcessing PowerV2V,V2I,V2XBiometrics5

October 2019

Samsung Solutions for AutomotiveFront SensingDriver MonitoringInfotainmentNPU / Image Sensor /DVSADASProcessor / NPUSecurity ICMemoryProcessor / DDI / TouchIC Security IC / PMICMemorySurround / RearView CameraImage Sensor / DVSSteering WheelKey FobSecurity ICFingerprint SensoreMirrorFingerprint SensorBio ProcessorIris Sensor / PMICImage SensorDDI / PMIC7

Samsung in Automotive2017JAN2018OCT2019JAN2019MAYSource : Samsung Newsroom8

IVI System Trend and Samsung9

IVI System TrendDistributedDomain CentralizedVehicle Centralized(Audio/Video Navigation)(Integrated Cockpit)(High Computing Platform)PT/ChassisMULTII/O LTIBODYIVI/CLUI/O NodeI/O NodeI/O NodeI/O NodePT/ChassisADASDomain 1 3 or 4 independent networks Collaboration of ECUs within 1 domain Limited communications among domains Central Domain Controller Consolidation of functions※ Integrated Cockpit (Cost Optimization) HW : Low Power/High Performance SOC SW : Hypervisor for Multi /CLUDomain 2 Virtual Domain: Integrated Domain Controller High-complexity, high-computing functionsHW : High Performance Computing SOCSW : HW Agnostic SW Driven Architecture Gateway backboneExynosAutoV920※ IVI : In-Vehicle Infotainment※ CLU : Cluster※ PT : Powertrain10

Telematics System Trend and Samsung11

Modem Technology Evolution forAutonomous DrivingSamsung leads 5G standard as a 5GAA board member1G/2GVoice CallTexting3GMobileInternet4GMobile ComputingStreaming Services5GUltra-reliable & Low LatencyEnhanced Mobile BroadbandMassive IoTCellular V2XLive StreamingAR/3D MapsSNS12

Samsung 5G Modem 4G3G/2G20MHz13

Samsung Memory and ImageSensor Solution for Automotive14

Samsung Memory Solution for AutomotiveIncreasing Demand forHigh Bandwidth, High DensityLPDDR5/GFX/HBM6,400Mbps 〈LPDDR4X〈 4,266MbpsLPDDR4UFS/SSD〈 3,733MbpsDDR2/3DRAM〈 2,133Mbps〈 TBUFS〈 256GBeMMC〈 128GBNANDInfotainment2016Connected Car2018Autonomous Car2020 20212025 15

Cameras for Next Generation ADASMove to “More Pixel” & “More Camera”Need efficient development for the complex camera systemsAD level12 15Mp x 2, 3eawith wide & tele-HFOVFront Sensing / NCAP / AD8.3 12Mp x 2, 3eawith wide & tele-HFOVSound View MonitoringLevel4 ISP[Gpix/s]75E-mirror / Blind spots7.4 8.3Mp x 2, 3eawith wide & tele-HFOV56 5Mp x 4 6eaLevel3 2.5Mp x 4ea7.4 8.3Mp x 1eawith wide-HFOV 5Mp x 2eawith typ-HFOV44 2.5Mp x 4eaLevel2 5Mp x 2eawith typ-HFOV18 2.5Mp x 4eawith Fisheye-HFOVEntryMediumPremium16

ADAS Trends and Samsung17

ADAS AD TrendDifferent Use Cases for ADAS and ADPERSONAL VEHICLEMOBILITY AS A SERVICECostCost-effective sensor setExpensive sensor setFleetSome fleet usageCentralized fleet modelUp to 130 kph for highway and urbanMax 70 kph for urbanControlNo outside controlService model (regular pit stops)DesignDesign criticalPurpose builtSpeedSamsung is focused on ADAS/AD solutions for personal vehicles.18

Scalable SoC ApproachScaling problem of the car architecturede-centralizedSamsung ADAS “scale out” solutioncentralizedL4NCAPL0Computational Power% of Availability of ADAS functionsNext SOC Gen.NCAPL0L1L2L3Central Comp.: L0-l2 Parking2 x Exynos A HighCCClassClassModel SegmentsDDClassClassFront Camera: L0-l2 DMExynos A HighExynos A LowBB ClassClassCentral Comp.:L3 Functionality3 x Exynos A HighExynos A MidAAClassClassL4 and L5Front Camera: L0-l2Front Camera: NCAPE/FE/FClassClassNanometersFlexible ADAS solution suitable for all car lines, saving cost and time.19

Modular, vision-based ADAS SolutionOpen and flexible Approach architected to allow third-party IntegrationOption 1Option 2Option 320

Samsung in AutomotiveDriving autonomous vehicle revolution with a comprehensive AutomotiveSemiconductor PortfolioAIAI NPUDelivering innovative and disruptivesolutions with synergies across productsDeveloping Samsung AutomotiveEcosystem across OEMs, Tier 1s, Tier 2sMulti-function IVI-Tele-ADAS systemOEMsServer ArchitectureTier 1 Tier 2High performance CIS & MemorySolutions and technology partners21

October 2019

SoC Platform Based Design Solution23

Automotive Platform SolutionSamsung provides product-proven automotive solutions Automotive design platform with safety mechanisms and security solutions Silicon-proven IPs in compliance with ISO 26262 and AEC-Q100 Design, test and package infrastructure dedicated for automotive applicationsAutomotive SoCSafetysubsystemNOCISP/UFS/CSI/PCIeMemorySerDes IPPeripheralSecurityCustom IPProcess Technology- 12”: 5LPE, 8LPP, 14LPU, 28FDS, LNF28- 8”: LF6S, BCD1370- 28nm eNVM solution for MCU24

Design Services135Architectural Design2Functional DesignSystem specification & architecture defineIP & RTL DesignBus design : legacy AMBA, NoC BusSOC & System IP IntegrationBus exploration : bandwidth & latencySynthesis & timing constraint descriptionDesign Verification4DFT (Design For Testability)UVM-based platform SOC functional verificationDFT architecture definition and implementationEmulator (Palladium) based platform SOCperformance verificationDFT/Test related customer supportPhysical Design & Verification6SW SolutionSOC physical design(P&R, timing closure)Device driver development on Linux OSOff-chip power integrity / signal integrityFirmware development for IP validationPhysical verification (DRC, LVS, ERC, etc)Post silicon validation25

October 2019

Process Technology for Infotainment & ADAS Fast Move to Automotive Node Due to Higher Processing NeedsAutomotive Process Adopts Automotive Program to Ensure Reliability, Robustness & SafeySurroundviewHead UnitHead UnitADASHead Unit- Multi-VGA Camera- Augmented Reality- Navigation- Single VGA- Rear-Camera Park AssistSensorfusionSurroundviewMulti-Resolution CamerasFor higher depth of view5LPE (TBD)8LPP28FDS14LPUMCU28LPP eFlashSamsung27

Automotive IP –AEC-Q100 & ASIL CertifiedAutomotive Qualified to accelerate ISO26262 System QualAutomotive IP sign-off conditionHard IP tested to AEC-Q100 Grade temperatureAEC-Q100 targeted for Grade 2 and Grade 1Soft IP tested to ASIL RequirementsASIL targeted for ASIL-B with key IPs for ASIL-DAEC-Q100 Qualification RequirementsVmax/Vmin, -40/125 Vmax/Vmin, -40/105 3 years, Vmax, 150 3 years, Vmax, 150 AutoAuto3 years, Vmax, Tac3 years, Vmax, TacAuto G1Auto G2ASIL Reports via SGS TUV28

Automotive Package SolutionData communication, key factor for future automotive productsLead frame or WB PBGA for Grade 0 & 1, FC-BGA or SIP for Grade 2 & 3ADAS(Grade 1 3)Package type by areas in carInfotainment(Grade 2 3) Leadframe PBGA FCBGA POP/SIP/MCP Leadframe PBGA FCBGA POP/SIP/MCPBody &Convenience(Grade 0 3)Chassis & Safety(Grade 0 1) Leadframe PBGAPowertrain(Grade 0 1) Leadframe Leadframe PBGA FCBGA POP/SIP/MCP PBGA29

October 2019

Samsung Automotive SoC Design MethodologyPower-On Self-Test (POST)Chip 1 Boot-up time fault detectionTool Evaluation and Qualification General guide to achieve the confidencein the use of S/W toolsLogic/Memory Built-In Self-TestCPU 1Boundary ScanSRAM Inter-chip connection test method forsystem-level testingCPU 2 Soft error analysis/mitigation Soft error mitigation with ECCPERISRAMSRAMSRAMSER (Transient Fault)-Aware Design In-system test method againstprogressive faults in logic areaSRAMAlpha particle/ neutronsSRAMFFFFChip 2CLKDFT Implementation Guide DFT guide for improved test coverage forlower DPPM Thermal analysis for reliable designFault Injection Simulation Fault injection simulation for safetyanalysis of designAutomotive Electrical and ReliabilitySign-off GuideIDDQ Test IDDQ test for additional fault coverageThermal AwarenessAutomotive RequirementsAEC-Q100ISO 26262Grade 2: -40 C to 105 CASIL B: 100FIT (PMHF)SPFM (90%), LFM (60%) AEC-Q100 grade-relatedtiming/power/reliability sign-off guidebased on product specification andmission profilesTied to ISO26262Tied to AEC-Q10031

PI System Level PDN Optimization for AutomotiveWorst-Case Current ScenarioSystem PDN OptimizationMode change scenario based on early power estimation Idle-to-Active (di/dt) Scenario : voltage drop due to off-chip inductance Burst-Transient (resonance) Scenario : voltage drop due to PDNresonance Mode change scenario can be modified using other modes customerwant to consider.Pre- & post-layout what-if analysis Pre-layout : design target extraction by what-if analysis Post-layout : PKG de-cap optimization considering positionsPre-Layout Analysis PKG Layout # of Balls CdieWhat-if Analysis # of BallsM CyclesVdrop @bump SpecActiveScenario Board De-cap CombinationIdleDesign Target PKG De-cap CombinationTActive TIdleCLK OffPost-Layout AnalysisTr (for di/dt scenario)[De-cap Combination]C1 x2, C2 x9, C3 x1, C4 x4, C5 x10C2C5C5PKG De-cap Combination (Position Dependent)C1C3C2C5Optimum Combination & 5OffC5OffC5OnC5CLK OffC2DataC2CLKC4PowerC4ModeVoltage DropEffect of Position: 15% of specWidth of PDN Resonance Freq.(for resonance scenario)32

In System Test for AutomotiveSafety-critical systems require POST (Power-On Self-Test) via memory and logic BIST When power is turned on, BISTs run to determine if a device is operating properly POST Controller Interpreting ROM data and interfacing to the BISTChecking the test results of BISTsFlexible access mechanism via IEEE 1687, 1149, 1500TDIAddressGeneratorTDOExternal Pinsfor TestJTAG TAPsFSMEmbedded logic testing solutionHigh fault coverage through multi-seedingDynamic X-masking solutionClockControllerInternalSystem portsEmbedded SRAM testing and repair solutionSoft-repair solution as well as hard repairAutomotive-specific SRAM test algorithmSEEDPRPGIEEE std. emory BISTSignalGeneratorDataGeneratorLogic BIST––– MBISTControllerTAPControllerIEEE std. SIB–––TCKTMSTCMDECODERLBIST DECOMPLBISTControllerLBIST COMPMISRSIGNATURE33

October 2019

Samsung Foundry Automotive ManufacturingTesla Autonomy Day – April 2019There’s an awful lot of specs associatedwith this new Tesla-designed, Samsungmanufactured silicon – The VergeMusk said they contained what was“objectively” the “best chip in the world.”And that’s not best by a little, but “by a hugemargin.”260 square millimeter, 6 billion transistors –claims 21x performance increase over previous solution35

Global Manufacturing Fabs & Design CentersSamsungFoundryGlobal Technology, Manufacturing, Test & Package LocationsSamsungDesign ServiceOver 1600 Design, IP, Methodology etc Engineers in Korea, US (San Jose), and IndiaAdditional 10 Design Service Partners Worldwide8”, 12”, P&T(Korea)SF DS 1)(Korea)S2-Line(US/Texas)SF DS(US/SanJose)SSIR 2)(India)SESS(China)1) SF DS: Samsung Foundry Design Service2) SSIR: Samsung Semiconductor India R&D Center36

October 2019

Automotive IP Readiness & PlanProductMain IP28FDS 28LPP 14LPU 8LPP 5LPEADASInfotainmentMCUG2G2G1G1TrendMarket req.- AEC-Q100/ISO26262- Functional Safetybased AutoSafe platform . ISO26262 (FMEA/FMEDA, LPDDR4, Ethernet AVB,G1 - ASIL-B ASIL-C/DMIPI, HDMI, PCIe, SATA,ASIL-B/D)- Embedded Vision /ADC- ReliabilitySecurity / Sensor Fusion. AEC-Q100 G1- Real-time Multimedia / - QualityUSB, LPDDR4, EthernetSecurity / Sensor Fusion. Meet quality levelsAVB, MIPI, PCIe, ADCrequired for automotive- eNVM readinessEthernet 10/100/1000,applications. eFlash G1 (done) /ADC, I/F peripheralseMRAM G2 (developing))38

Automotive IPs from Samsung and Partners Contact Samsung for complete listing by process node Available Under Development39