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Application ReportSZZA021C September 2005Semiconductor Packing MethodologyCles Troxtell, Bobby O’Donley, Ray Purdom, and Edgar ZunigaStandard Linear & LogicABSTRACTThe Texas Instruments Semiconductor Group uses three packing methodologies to preparesemiconductor devices for shipment to end users. The methods employed are linked to thedevice level for shipping configuration keys. End users of the devices often need to perusemany TI and industry publications to understand the shipping configurations. This applicationreport documents TI’s three main shipping methods and typical dimensions for end users toreview.ContentsIntroduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3Background . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3Typical Applications of Each Packing Method . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5Stick Magazine (Shipping Tube) Primary Component Container . . . . . . . . . . . . . . . . . . . . . . . . . . . 5Tray Primary Component Container . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8Tape and Reel Primary Component Container . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20Testing for Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20Dry-Packing Process . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21Dry Packing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21Typical Packing Method . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21Conclusion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27Acknowledgment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 281

SZZA021CList of ck-Magazine Shipping Tube . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3JEDEC Tray . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3Reel With Carrier Tape . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4Intermediate Packing for PDIP Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5Example of Trays Stacked and Bound . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8JEDEC Tray With Properly Arranged Units . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9Tape-and-Reel Packing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10Carrier-Tape Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11Carrier Tape Pocket Quadrant Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14Rectangular QFP Package Properly Oriented in Carrier Tape . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15EIA-783 Guideline, Rules 1 and 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16EIA-783 Guideline, Rule 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16Typical TI Component Orientations for Tape-and-Reel Packing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17Typical Reel Outline as Defined by EIA-481-x . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18Loaded Reel (Not Moisture Sensitive) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19Standard Box Containing Loaded Reel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19Tray Box and Sealed Moisture-Barrier Bag (Top), Opened Bag and Tray Stack (Bottom) . . . . . . 22Dry-Packed Tape-and-Reel Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23Moisture-Sensitive Identification (MSID) Label . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24Moisture-Sensitivity Caution Label (Levels 2a Through 5a) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24Humidity-Indicator Card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25List of Tables123452Stick Magazine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6SLL Packages and Standard Quantities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9Tape-and-Reel Packing Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12Floor Life for Different Package Moisture-Sensitivity Levels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21Packing-Material Environmental Coding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25Semiconductor Packing Methodology

SZZA021CIntroductionThis application report describes in detail the methods used by the TI Standard Linear & Logic(SLL) business unit to pack semiconductor devices (components). This application reportprovides customers answers to the most frequently asked questions and allows them to reviewthe different methods used to pack our products.BackgroundTI ships product in three basic configurations: stick magazine, tray, and tape and reel. Thefollowing paragraphs define each packing configuration. Stick magazine The stick magazine (also called shipping tube) was developed in the earlydays of the integrated circuit (IC) industry. The magazine is used to transport and storeelectronic components between the manufacturer and the customer and for use in themanufacturing plant. Magazines also are used to feed components to automatic-placementmachines for surface and through-hole board mounting. Multiple stick magazines are placedin next-level intermediate containers (boxes and bags) in standard packing quantities. Atypical stick magazine is shown in Figure 1.Figure 1. Stick Magazine Tray The IC shipping tray contains the components during component-assemblyoperations, during transport and storage from the component manufacturing plant to thecustomer’s board-assembly site, and when feeding components to automatic-placementmachines for surface mounting on board assemblies. The tray is designed for componentsthat have leads on four sides (QFP and TQFP packages) and require component leadisolation during shipping, handling, or processing. Trays are stacked and bound together toform standard packing configurations. SLL uses only standard JEDEC tray configurations. Atypical JEDEC tray is shown in Figure 2.Figure 2. JEDEC TraySemiconductor Packing Methodology3

SZZA021C Tape and reel The tape-and-reel configuration is used for transport and storage from themanufacturer of the electronic components to the customer, and for use in the customermanufacturing plant. The configuration is designed for feeding components toautomatic-placement machines for surface mounting on board assemblies. The configurationcan be used for all SMT packages and provides component lead isolation during shipping,handling, and processing. The complete configuration consists of a carrier tape withsequential individual cavities that hold individual components, and a cover tape that sealsthe carrier tape to retain the components in the cavities. In most cases, single reels ofcomponents are inserted into intermediate boxes before shipping. A typical loaded reel isshown in Figure 3.Figure 3. Reel With Carrier Tape4Semiconductor Packing Methodology

SZZA021CTypical Applications of Each Packing MethodStick Magazine (Shipping Tube) Primary Component ContainerStick magazines are constructed of rigid clear or translucent polyvinylchloride (PVC) material.Stick magazines are extruded in applicable standard outlines that meet current industrystandards, and protect components during shipping and handling. The stick-magazinedimensions provide proper component location and orientation for industry-standardautomated-assembly equipment.Stick magazines are packed and shipped in multiples of single magazines. Multiple stickmagazines are loaded into intermediate containers (bags and boxes) to form standardquantities, for ease of handling and order simplification. Typical intermediate-level packingquantities for magazines vary by pin count and package type. Figure 4 shows intermediate-levelpacking for PDIP packages. Stick magazine packing quantities are included in Table 1.Figure 4. Intermediate Packing for PDIP PackagesSemiconductor Packing Methodology5

SZZA021CTable 1. Stick Thickness(mm)PDIP(300 mil)8P14 N16 N20 N24 NT28 600 mil)24 N15750507.00.56SOP(JEDEC,narrow body)8D14 D16 D755040150010001000507.00.55SOP(JEDEC,wide body)16 DW20 DW24 DW28 DW402525201000100010001000507.00.76SOP(EIAJ)8 PS14 NS16 NS20 narrow body,pitch 1 mm)28 DB30 DB38 DB505040100010001000SSOP(wide body,pitch 1 mm)28 DL48 DL56 ctor Packing MethodologySectional Shape(mm)Pin or PlugShape and Dimensions(mm)

SZZA021CTable 1. Magazine (Continued)PackageTypeTSSOP(narrow body,pitch 1 mm,max height 1.20 mm)TSSOP(wide body,pitch 1 mm,max height 1.20 erMagazineContainerStandardQuantity8 PW14 PW16 PW20 PW24 PW150909070601500108010801050120048 DGG56 DGG64 DGG40352510001015100020 FN28 FN44 FN46372627602035960Sectional Shape(mm)20 Pin28 Pin44 WallThickness(mm)530.00.60497.30.64Pin or PlugShape and Dimensions(mm)A20 Pin28 Pin44 Pin8.0012.0717.15Semiconductor Packing Methodology7