Transcription
ARTIK 530/530s Module Datasheet
Samsung Semiconductor, Inc.ARTIK 530/530s Module DatasheetMODULE OVERVIEWARTIK 530The Samsung ARTIK 530/530s Module is a highly-integratedSystem-in-Module that combines a quad-core ARM Cortex A9 processor packaged with 512MB or 1GB DRAM and Flashmemory, a Security Subsystem, and a wide range of wirelesscommunication options—such as 802.11a/b/g/n for Wi-Fi ,Bluetooth 4.2 (BLE Classic), and 802.15.4 for Zigbee—all intoone 49 36mm footprint. The many standard digital controlinterfaces support external sensors and higher performanceperipherals to expand the module’s capabilities. With thecombination of 802.11, Bluetooth and 802.15.4, the ARTIK530/530s Module is the perfect choice for home automationand home hub devices, while also supporting a rich UI/UXcapability for camera and display requirements. The inclusionof a hardware-based Secure Element provides end-to-endsecurity.ARTIK 530s and ARTIK 530s 1GProcessorCPUQuad-core ARM Cortex -A9@1.2GHzGPU3D graphics acceleratorMediaCamera I/FDisplay4-lane MIPI CSI up to 5M (1920x1080@30fps)4-lane MIPI DSI and HDMI1.4a (1920x1080p@60fps)or LVDS (1280 720p@60fps)AudioTwo I2S audio interfaceDRAM512MB or 1GB DDR3 @ 800MHzFLASH4GB eMMC v4.5MemorySecuritySecure ElementARTIK 530s: 0530-1.04 W34ARTIK 530s 1G: 0533-1.00 W31Trusted ExecutionEnvironmentWLANBluetooth LR WPANIEEE 802.11a/b/g/n, dual-band SISO4.2 (Classic BLE)IEEE 802.15.4Power ManagementPMICFigure 1. ARTIK 530/530s Module Top ViewTrustwareRadioARTIK 530s: SIP-005AFS302ARTIK 530s 1G: SIP–005AUS332ARTIK 530s: 530ARTIK 530s 1G: 533Secure point to point authentication and datatransferProvides all power of the ARTIK 530/530s Moduleusing onboard bucks and LDOsInterfacesEthernetAnalog and Digital I/O10/100/1000Base-T MAC (External PHY required)GPIO, UART, I2C, SPI, SDIO, USB Host, USB OTG,HSIC, ADC, PWM, I2S, JTAG2
Samsung Semiconductor, Inc.ARTIK 530/530s Module DatasheetTABLE OF CONTENTSModule Overview. 2Version History .9Block Diagram and Module Features . 10ARTIK 530/530s Module Features. 11GPIO . 11I2S . 11PWM . 12SPI . 12UART . 12I2C . 13ADC . 13Power Management . 13Wi-Fi . 13Bluetooth . 14802.15.4 for Zigbee . 14USB OTG . 14USB HOST . 14HSIC . 15MIPI CSI . 15MIPI DSI . 15HDMI . 16LVDS . 16Gigabit EMAC . 16SD/MMC .17Memory Controller .17JTAG .17Security Subsystem . 18Quad-Core Processor System . 19Timer . 19Interrupt Controller . 19DMA . 20RTC . 20Video Input Processor . 21Scaler . 21Multiformat Codec . 21Graphics Pipeline . 22PCM . 22Module Pads .23Ball Table Column Definitions.24North Ball Array .24South Ball Array .26East Ball Array .28West Ball Array . 30Center Ball Array . 313
Samsung Semiconductor, Inc.ARTIK 530/530s Module DatasheetFunctional Interfaces.33ADC .33Booting .33Bluetooth PCM.33MIPI CSI.34MIPI DSI.34GMAC.34GPIO.35HDMI .36HSIC . 37I2C . 37I2S. 37JTAG.38AliveGPIO.38LVDS .38Miscellaneous .39Power .39PWM .39SD/MMC. 40SPI . 40UART . 41USB HOST/USB OTG . 41802.15.4 for Zigbee . 41GPIO Alternate Functions.42Booting Selection . 46Power Sequence.47Power States .48Antenna Connections. 49Electrical Specifications . 50Absolute Maximum Ratings . 50Recommended Operating Conditions . 51Power/Current Consumption . 51ESD Ratings .52DC Electrical Characteristics .53AC Electrical Characteristics .56SD/MMC AC Electrical Characteristics .56SPI AC Electrical Characteristics . 57I2C AC Electrical Characteristics . 60RF Electrical Characteristics . 61Wi-Fi, 2.4GHz Receiver RF Specifications . 61Wi-Fi, 2.4GHz Transmitter RF Specifications .62Wi-Fi, 5GHz Receiver RF Specifications .63Wi-Fi, 5GHz Transmitter RF Specifications . 64Bluetooth RF Specifications .65802.15.4 Receiver RF Specifications . 66Mechanical Specifications .674
Samsung Semiconductor, Inc.ARTIK 530/530s Module DatasheetCertifications and Compliance .70Bluetooth .70CE.70FCC .70IC.71KCC .71SRRC .71HDMI Compliance .71RoHS Compliance .71FCC Regulatory Disclosures .71Industry Canada Regulatory Disclosures . 73Industry Canada Statement . 73EU Regulatory Disclosures . 73Statement* . 73Ordering Information .745
Samsung Semiconductor, Inc.ARTIK 530/530s Module DatasheetLIST OF FIGURESFigure 1. ARTIK 530/530s Module Top View. 2Figure 2. ARTIK 530/530s Module Functional Block Diagram. 10Figure 3. ARTIK 530/530s Module Top View Ball Organization .23Figure 4. ARTIK 530/530s Module Power-On Sequence (Timing) Diagram .47Figure 5. ARTIK 530/530s Module Power Management State Diagram .48Figure 6. RF Connector for Bluetooth/Wi-Fi and Zigbee . 49Figure 7. High-Speed SD/MMC Interface Timing .56Figure 8. SPI Interface Timing (CPHA 0, CPOL 1 (Format A)) . 57Figure 9. I2C Interface Timing . 60Figure 10. ARTIK 530/530s Module Top View Mechanical Dimensions and Part Location.67Figure 11. ARTIK 530/530s Module Mechanical Dimensions Top View.68Figure 12. ARTIK 530/530s Module Mechanical Dimensions Bottom View .68Figure 13. L-Shaped Pad Pins (Top View). 696
Samsung Semiconductor, Inc.ARTIK 530/530s Module DatasheetLIST OF TABLESTable 1. Ball Table Column Definition .24Table 2. North Ball Array.24Table 3. South Ball Array .26Table 4. East Ball Array .28Table 5. West Ball Array. 30Table 6. Center Ball Array. 31Table 7. ADC .33Table 8. Booting.33Table 9. Bluetooth PCM.33Table 10. MIPI CSI .34Table 11. MIPI DSI .34Table 12. GMAC.34Table 13. GPIO.35Table 14. HDMI .36Table 15. HSIC . 37Table 16. I2C . 37Table 17. I2S. 37Table 18. JTAG.38Table 19. Key .38Table 20. LVDS.38Table 21. Miscellaneous .39Table 22. Power.39Table 23. PWM .39Table 24. SD/MMC . 40Table 25. SPI . 40Table 26. UART. 41Table 27. USB Host/USB OTG. 41Table 28. 802.15.4 . 41Table 29. GPIO Alternate Functions—North Part.42Table 30. GPIO Alternate Functions—South Part.43Table 31. GPIO Alternate Functions—East Part.45Table 32. GPIO Alternate Functions—West Part.45Table 33. Boot Selection Configuration . 46Table 34. Absolute Maximum Ratings . 50Table 35. Recommended Operating Conditions . 51Table 36. ARTIK 530/530s Module Power/Current Consumption . 51Table 37. ESD Ratings.52Table 38. Shock and Vibration Ratings.52Table 39. I/O DC Electrical Characteristics GPIO .53Table 40. I/O DC Electrical Characteristics 802.15.4.53Table 41. I/O DC Electrical Characteristics PMIC .54Table 42. I/O DC Electrical Characteristics PCM Signals.54Table 43. GPIO Pull-up Resistor Current .55Table 44. Power-on Reset Timing Specifications.55Table 45. High-Speed SD/MMC Interface Transmit/Receive Timing Constants .56Table 46. SPI Interface Transmit/ Receive Timing Constants with 15pF Load.58Table 47. SPI Interface Transmit/Receive Timing Constants with 30pF Load .59Table 48. I2C BUS Controller Module Signal Timing. 60Table 49. Wi
MIPI CSI Data Negative 0 PA11 AP_MIPICSI_DN0 1.8V IO N MIPI CSI Data Negative 1 PA12 AP_MIPICSI_DN1 1.8V IO N MIPI CSI Data Negative 2 PA13 AP_MIPICSI_DN2 1.8V IO N MIPI CSI Data Negative 3 PA14 AP_MIPICSI_DN3 1.8V IO N MIPI CSI Data Positive Clock PB10 AP_MIPICSI_DPCLK 1.8V IO N MIPI CSI Data Positive 0 PB11 AP_MIPICSI_DP0 1.8V IO N
