Transcription
FAST AND LS TTLPackage InformationIncludingSurface Mount7
BIPOLAR LOGIC SURFACE MOUNTSurface Mount components are sent directly to the assemblyline, eliminating an intermediate step.Automatic placement equipment is available that can placeSurface Mount components at the rate of a few thousand perhour to hundreds of thousands of components per hour.Surface Mount Technology is cost effective, allowing themanufacturer the opportunity to produce smaller units and/oroffer increased functions with the same size product.WHY SURFACE MOUNT?Surface Mount Technology is now being utilized to offeranswers to many problems that have been created in the useof insertion technology.Limitations have been reached with insertion packages andPC board technology. Surface Mount Technology offers theopportunity to continue to advance the State-of-the-Artdesigns that cannot be accomplished with InsertionTechnology.Surface Mount Packages allow more optimum deviceperformance with the smaller Surface Mount configuration.Internal lead lengths, parasitic capacitance and inductancethat placed limitations on chip performance have beenreduced.The lower profile of Surface Mount Packages allows moreboards to be utilized in a given amount of space. They arestacked closer together and utilize less total volume thaninsertion populated PC boards.Printed circuit costs are lowered with the reduction of thenumber of board layers required. The elimination or reductionof the number of plated through holes in the board, contributesignificantly to lower PC board prices.Surface Mount assembly does not require the preparationof components that are common on insertion technology lines.SURFACE MOUNT AVAILABILITYBipolar Logic is currently offering LS-TTL and FAST-TTL inproduction quantities in SOIC packages.Refer to the following Selector Guide (SG366/D) which indicate availability and package type for these families.These families may be ordered in rails or on Tape and Reel.Refer to Tape and Reel information for ordering details.THERMAL DATAThe power dissipation of surface mount packages is dependent on many factors that must be taken into consideration inthe initial board design. The board material, the board surfacemetal thickness, pad area and the proximity to other heatgenerating components all have a bearing on the devicedissipation capability.200180 C/WθJA160MIN DIE SIZE2K MILS2140120SEE FIG. 2 FORHEAT SINK DETAIL100SO-8(.090″ x .110″)MAX DIE SIZE8K MILS2LEADFRAMESO-14METAL COPPER (.090″ x .170″)SO-16(.090″ x .170″)NARROWPACKAGE STYLEDATA TAKEN USING PHILIPS SO TEST BOARD # 7322-078, 80873Figure 2-1. Thermal Resistance, Junction-To-Ambient ( C/W)Measurement specimens are solder mounted on printedcircuit card 19 mm 28 mm 1.5 mm in still air. No auxiliarythermal condition aids are used.This data was collected using thermal test die in 20-pin PLCCpackages on PLCC test boards (2.24″ x 2.24″ x .062″ glassepoxy, type FR-4, with solder coated 1 oz./sq. ft. copper).FAST AND LS TTL DATA7-2
TAPE AND REELSTANDARD BIPOLAR LOGIC INTEGRATED CIRCUITSMotorola has now added the convenience of Tape and Reelpackaging for our growing family of standard Integrated Circuitproducts. The packaging fully conforms to the latest EIARS-481A specification. The antistatic embossed tapeprovides a secure cavity sealed with a peel-back cover tape.MECHANICAL POLARIZATIONSOIC DEVICESTypicalView is from tape sideLinear direction of travelGENERAL INFORMATION— Reel Size13 inch (330 mm) Suffix R2— Tape Width12 mm to 24 mm (see table)— Units/Reel(see table)— No Partial Reel Counts Available and Minimum Lot Size is Per TableORDERING INFORMATIONTo order devices which are to be delivered in Tape and Reel, add the suffix R2 to the device number being ordered.TABLE 2.1 Tape and Reel DataDevice TypeSO-8SO-14SO-16SO-16 WideSO-20 WideTape Width(mm)Device/ReelReel Size(inch)Min Lot Size Per Part No.Tape and ,0005,0005,0005,0005,000FAST AND LS TTL DATA7-3
PACKAGE OUTLINESSOICCase 751A-02 D Suffix14-Pin PlasticSO-14NOTES:1. DIMENSIONS “A” AND “B” ARE DATUMS AND“T” IS A DATUM SURFACE.2. DIMENSIONING AND TOLERANCING PER ANSIY14.5M, 1982.3. CONTROLLING DIMENSION: MILLIMETER.4. DIMENSION A AND B DO NOT INCLUDE MOLDPROTRUSION.5. MAXIMUM MOLD PROTRUSION 0.15 (0.006)PER SIDE.6. 751A-01 IS OBSOLETE, NEW STANDARD751A-02.-A1480.25 (0.010)P-B-BMM7 PL17R X 45 CGSEATINGPLANEKD 14 PL0.25 (0.010)T BMASDIMABCDFGJKMPRMJFSCase 751B-03 D Suffix16-Pin PlasticSO-16-A-160.25 (0.010)P-B-BMM8 PL8R X 45 GC-T-SEATINGPLANED 16 PLMK0.25 (0.010)MT BSAFJSCase 751D-03 DW Suffix20-Pin PlasticSO-20 (WIDE)11110-B-P0.25 (0.010)MBMR X 45 C-T-SEATINGPLANEMKD 20 PLMT BSMILLIMETERSMINMAX9.80 10.003.804.001.351.750.350.490.401.251.27 BSC0.190.250.100.250 7 5.806.200.250.50INCHESMINMAX0.386 0.3930.150 0.1570.054 0.0680.014 0.0190.016 0.0490.050 BSC0.008 0.0090.004 0.0090 7 0.229 0.2440.010 0.01910 PLG0.25 (0.010)DIMABCDFGJKMPRNOTES:1. DIMENSIONING AND TOLERANCING PER ANSIY14.5M, 1982.2. CONTROLLING DIMENSION: MILLIMETER.3. DIMENSION A AND B DO NOT INCLUDE MOLDPROTRUSION.4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PERSIDE.5. 751D-01, AND -02 OBSOLETE, NEW STANDARD751D-03.-A20INCHESMINMAX0.337 0.3440.150 0.1570.054 0.0680.014 0.0190.016 0.0490.050 BSC0.008 0.0090.004 0.0097 0 0.229 0.2440.010 0.019NOTES:1. DIMENSIONING AND TOLERANCING PER ANSIY14.5M, 1982.2. CONTROLLING DIMENSION: MILLIMETER.3. DIMENSION A AND B DO NOT INCLUDE MOLDPROTRUSION.4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)PER SIDE.5. 751B-01 IS OBSOLETE, NEW 01.351.750.350.490.401.251.27 BSC0.190.250.100.250 7 5.806.200.250.50AFSFAST AND LS TTL DATA7-4JDIMABCDFGJKMPRMILLIMETERSMINMAX12.65 12.957.407.602.352.650.350.490.500.901.27 BSC0.250.320.100.250 7 10.05 10.550.250.75INCHESMINMAX0.499 0.5100.292 0.2990.093 0.1040.014 0.0190.020 0.0350.050 BSC0.010 0.0120.004 0.0090 7 0.395 0.4150.010 0.029
PACKAGE OUTLINESSOIC (continued)Case 751E-03 DW Suffix24-Pin PlasticSO-24 (WIDE)-A2413112-B-P0.25 (0.010)MBNOTES:1. DIMENSIONING AND TOLERANCING PER ANSIY14.5M, 1982.2. CONTROLLING DIMENSION: MILLIMETER.3. DIMENSION A AND B DO NOT INCLUDE MOLDPROTRUSION.4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)PER SIDE.5. 751E-01 AND -02 OBSOLETE, NEW STANDARD751E-03.M12 PLGR X 45 C-T-MKD 24 PL0.25 (0.010)SEATINGPLANEMT BSAFJSFAST AND LS TTL DATA7-5DIMABCDFGJKMPRMILLIMETERSMINMAX15.25 15.547.407.602.352.650.350.490.410.901.27 BSC0.229 0.3170.127 0.2920 8 10.05 10.550.250.75INCHESMINMAX0.601 0.6120.292 0.2990.093 0.1040.014 0.0190.016 0.0350.050 BSC0.0090 0.01250.0050 0.01150 8 0.395 0.4150.010 0.029
PACKAGE OUTLINESCERAMIC DUAL IN-LINECase 632-08 J Suffix14-Pin Ceramic Dual In-Line-A14817NOTES:1. DIMENSIONING AND TOLERANCING PER ANSIY14.5M, 1982.2. CONTROLLING DIMENSION: INCH.3. DIMENSION L TO CENTER OF LEAD WHENFORMED PARALLEL.4. DIM F MAY NARROW TO 0.76 (0.030) WHERETHE LEAD ENTERS THE CERAMIC BODY.5. 632-01 THRU -07 OBSOLETE, NEW STANDARD632-08.-BC-T-LKSEATINGPLANEFGMNJ 14 PLD 14 PL0.25 (0.010)MT A0.25 (0.010)SMTBSCase 620-09 J Suffix16-Pin Ceramic Dual In-Line-A16918-BLC-TKSEATINGPLANEMNEFJ 16 PLGD 16 PL0.25 (0.010)0.25 (0.010)MT AMT BSSDIMABCDFGJKLMNMILLIMETERSMINMAX19.05 19.947.116.235.083.940.500.391.651.402.54 BSC0.380.214.313.187.62 BSC15 0 0.511.01INCHESMINMAX0.750 0.7850.245 0.2800.155 0.2000.015 0.0200.055 0.0650.100 BSC0.008 0.0150.125 0.1700.300 BSC0 15 0.020 0.040NOTES:1. DIMENSIONING AND TOLERANCING PER ANSIY14.5M, 1982.2. CONTROLLING DIMENSION: INCH.3. DIMENSION L TO CENTER OF LEAD WHENFORMED PARALLEL.4. DIM F MAY NARROW TO 0.76 (0.030) WHERETHE LEAD ENTERS THE CERAMIC BODY.5. 620-01 THRU -08 OBSOLETE, NEW 05 19.557.366.104.19—0.530.391.27 BSC1.771.402.54 BSC0.270.235.08—7.62 BSC15 0 0.390.88INCHESMINMAX0.750 0.7700.240 0.290—0.1650.015 0.0210.050 BSC0.055 0.0700.100 BSC0.0090.011—0.2000.300 BSC0 15 0.015 0.035Case 732-03 J Suffix20-Pin Ceramic Dual In-Line2011110NOTES:1. LEADS WITHIN 0.25 mm (0.010) DIA., TRUEPOSITION AT SEATING PLANE, AT MAXIMUMMATERIAL CONDITION.2. DIM L TO CENTER OF LEADS WHEN FORMEDPARALLEL.3. DIM A AND B INCLUDES ST AND LS TTL DATA7-6MILLIMETERSMINMAX23.88 25.156.607.493.815.080.380.561.401.652.54 BSC0.511.270.200.303.184.067.62 BSC15 0 1.020.25INCHESMINMAX0.940 0.9900.260 0.2950.150 0.2000.015 0.0220.055 0.0650.100 BSC0.020 0.0500.008 0.0120.125 0.1600.300 BSC15 0 0.010 0.040
PACKAGE OUTLINESCERAMIC DUAL IN-LINE (continued)Case 758-01 J Suffix24-Pin Ceramic Dual In-Line2413112NOTES:1. DIMENSION L TO CENTER OF LEADS WHENFORMED PARALLEL.2. DIMENSIONING AND TOLERANCING PER ANSIY14.5, 1973.B-A-LCF-T-NSEATINGPLANEJKPGD 20 PL0.25 (0.010)MT ADIMABCDFGJKLNPMILLIMETERSMINMAX31.50 32.647.247.753.684.440.380.531.141.572.54 BSC0.200.332.544.197.627.870.511.279.14 10.16INCHESMINMAX1.240 1.2850.285 0.3050.145 0.1750.015 0.0210.045 0.0620.100 BSC0.008 0.0130.100 0.1650.300 0.3100.020 0.0500.360 0.400INSIDE OF LEADSMCase 623-05 J Suffix24-Pin Ceramic Dual In-Line(WIDE BODY)24NOTES:1. DIM “L” TO CENTER OF LEADS WHENFORMED PARALLEL.2. LEADS WITHIN 0.13 mm (0.005) RADIUS OFTRUE POSITION AT SEATING PLANE ATMAXIMUM MATERIAL CONDITION. (WHENFORMED PARALLEL).13B112DIMABCDFGJKLMNAFCSEATING PLANELNDGKJMMILLIMETERSMINMAX31.24 32.7712.70 15.494.065.590.410.511.271.522.54 BSC0.200.303.184.0615.24 BSC15 0 1.270.51INCHESMINMAX1.230 1.2900.500 0.6100.160 0.2200.016 0.0200.050 0.0600.100 BSC0.008 0.0120.125 0.1600.600 BSC15 0 0.020 0.050Case 740-03 J Suffix48-Pin Ceramic Dual In-LineNOTES:1. DIMENSIONING AND TOLERANCING PERANSI Y14.5M, 1982.2. CONTROLLING DIMENSION: INCH.3. DIM L TO CENTER OF LEAD WHEN TINGPLANEEFMGD 48 PL0.25 (0.010)MT AJ0.25 (0.010)MFAST AND LS TTL DATA7-7MT BMMILLIMETERSMINMAX60.36 61.5614.64 15.343.054.310.381 0.5331.27 BSC0.762 1.3972.54 BSC0.204 0.3302.544.1915.24 BSC0 10 1.016 1.524INCHESMINMAX2.376 2.4240.576 0.6040.120 0.1700.015 0.0210.050 BSC0.030 0.0550.100 BSC0.008 0.0130.100 0.1650.600 BSC0 10 0.040 0.060
PACKAGE OUTLINESPLASTICCase 646-06 N Suffix14-Pin Plastic14817NOTES:1. LEADS WITHIN 0.13 mm (0.005) RADIUS OF TRUEPOSITION AT SEATING PLANE AT MAXIMUMMATERIAL CONDITION.2. DIMENSION “L” TO CENTER OF LEADS WHENFORMED PARALLEL.3. DIMENSION “B” DOES NOT INCLUDE MOLDFLASH.4. ROUNDED CORNERS OPTIONAL.5. 646-05 OBSOLETE, NEW STANDARD 646-06.BANOTE 4FDIMABCDFGHJKLMNLCJNGHKSEATINGPLANEDMCase 648-08 N Suffix16-Pin D 16 PL0.25 (0.010)MT AMCase 738-03 N Suffix20-Pin Plastic11110BC-T-LKSEATINGPLANEEGNMJ 20 PLFD 20 PL0.25 (0.010)0.25 (0.010)MT AMTBMMFAST AND LS TTL DATA7-8MILLIMETERSMINMAX18.80 19.556.356.853.694.440.390.531.021.772.54 BSC1.27 BSC0.210.382.803.307.507.740 10 0.511.01INCHESMINMAX0.740 0.7700.250 0.2700.145 0.1750.015 0.0210.040 0.0700.100 BSC0.050 BSC0.008 0.0150.110 0.1300.295 0.3050 10 0.020 0.040NOTES:1. DIMENSIONING AND TOLERANCING PER ANSIY14.5M, 1982.2. CONTROLLING DIMENSION: INCH.3. DIMENSION “L” TO CENTER OF LEAD WHENFORMED PARALLEL.4. DIMENSION “B” DOES NOT INCLUDE MOLDFLASH.5. 738-02 OBSOLETE, NEW STANDARD 738-03.-A20INCHESMINMAX0.715 0.7700.240 0.2600.145 0.1850.015 0.0210.040 0.0700.100 BSC0.052 0.0950.008 0.0150.115 0.1350.300 BSC0 10 0.015 0.039NOTES:1. DIMENSIONING AND TOLERANCING PER ANSIY14.5M, 1982.2. CONTROLLING DIMENSION: INCH.3. DIMENSION “L” TO CENTER OF LEADS WHENFORMED PARALLEL.4. DIMENSION “B” DOES NOT INCLUDE MOLDFLASH.5. ROUNDED CORNERS OPTIONAL.6. 648-01 THRU -07 OBSOLETE, NEW STANDARD648-08.-A16MILLIMETERSMINMAX18.16 19.566.106.603.694.690.380.531.021.782.54 BSC1.322.410.200.382.923.437.62 BSC10 0 0.391.01DIMABCDEFGJKLMNMILLIMETERSMINMAX25.66 27.176.106.603.814.570.390.551.27 BSC1.271.772.54 BSC0.210.382.803.557.62 BSC15 0 1.010.51INCHESMINMAX1.010 1.0700.240 0.2600.150 0.1800.015 0.0220.050 BSC0.050 0.0700.100 BSC0.008 0.0150.110 0.1400.300 BSC15 0 0.020 0.040
PACKAGE OUTLINESPLASTIC (continued)Case 724-03 N Suffix24-Pin PlasticNOTES:1. CHAMFERRED CONTOUR OPTIONAL.2. DIM “L” TO CENTER OF LEADS WHEN FORMEDPARALLEL.3. DIMENSIONS AND TOLERANCES PER ANSIY14.5M, 1982.4. CONTROLLING DIMENSION: INCH.-A2413112-BLC-T-KSEATINGPLANENOTE 1NEGMJ 24 PL0.25 (0.010)FD 24 PL0.25 (0.010)T AMMT BMMCase 649-03 N Suffix24-Pin PlasticWide DGMJSEATINGPLANEINCHESMINMAX1.230 1.2650.250 0.2700.145 0.1750.015 0.0200.050 BSC0.040 0.0600.100 BSC0.007 0.0120.110 0.1400.300 BSC0 15 0.020 0.040NOTES:1. LEADS WITHIN 0.13 mm (0.005) RADIUS OF TRUEPOSITION AT SEATING PLANE AT MAXIMUMMATERIAL CONDITION.2. DIMENSION “L” TO CENTER OF LEADS WHENFORMED PARALLEL.3. 649-02 OBSOLETE, NEW STD 649-03 SEE ISSUE“C” FOR 694.440.380.511.27 BSC1.021.522.54 BSC0.180.302.803.557.62 BSC15 0 0.511.01MILLIMETERSMINMAX31.50 32.1313.21 13.724.705.210.380.511.021.522.54 BSC1.652.160.200.302.923.4314.99 15.49—10 1.020.510.380.130.760.51INCHESMINMAX1.240 1.2650.520 0.5400.185 0.2050.015 0.0200.040 0.0600.100 BSC0.065 0.0850.008 0.0120.115 0.1350.590 0.610—10 0.020 0.0400.005 0.0150.020 0.030Case 711-03 N Suffix40-Pin Plastic40NOTES:1. POSITIONAL TOLERANCE OF LEADS (D), SHALLBE WITHIN 0.25 mm (0.010) AT MAXIMUMMATERIAL CONDITION, IN RELATION TO SEATINGPLANE AND EACH OTHER.2. DIMENSION L TO CENTER OF LEADS WHENFORMED PARALLEL.3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.21B120LACNJHGFDKMSEATINGPLANEFAST AND LS TTL DATA7-9DIMABCDFGHJKLMNMILLIMETERSMINMAX51.69 52.4513.72 14.223.945.080.360.561.021.522.54 BSC1.652.160.200.382.923.4315.24 BSC0 15 0.511.02INCHESMINMAX2.035 2.0650.540 0.5600.155 0.2000.014 0.0220.040 0.0600.100 BSC0.065 0.0850.008 0.0150.115 0.1350.600 BSC0 15 0.020 0.040
PACKAGE OUTLINESPLASTIC (continued)Case 767-02 N Suffix48-Pin PlasticNOTES:1. DIMENSIONS AND TOLERANCING PER ANSIY14.5M, 1982.2. CONTROLLING DIMENSION: INCH.3. DIMENSION L TO CENTER OF LEAD WHENFORMED PARALLEL.4. DIMENSIONS A AND B DO NOT INCLUDE MOLDFLASH. MAXIMUM MOLD FLASH 0.25 (0.010).5. 767-01 OBSOLETE. NEW STANDARD 767-02.-A4825-B1TIP TAPERDETAIL X24LC-TSEATINGPLANEDETAIL XFMN48 PLJGD48 PL0.25 (0.010)0.51 (0.020)MT AMT BSFAST AND LS TTL DATA7-10SDIMABCDFGHJKLMNMILLIMETERSMINMAX61.34 62.1013.72 14.223.945.080.360.551.021.522.54 BSC1.79 BSC0.200.382.923.8115.24 BSC0 0 0.511.01INCHESMINMAX2.415 2.4450.540 0.5600.155 0.2000.014 0.0220.040 0.0600.100 BSC0.070 BSC0.008 0.0150.115 0.1500.600 BSC0 0 0.020 0.040
PACKAGE OUTLINESPLCCCase 775-02 FN Suffix20-Pin Plastic0.18 (0.007)BY BRK-N-DMT N0.18 (0.007)U–PST NSSML–PS–MSLSS–MS-M--L-Z1W20D1-P-G10.25 (0.010)XVVIEW D-DA0.18 (0.007)MT LS–MSNS–PSR0.18 (0.007)MT LS–MSNS–PSMT NS–PSLS–MSZC-T-SEATINGPLANEFDETAIL SST LMT LT N0.18 (0.007)0.18 (0.007)MMT LT NDETAIL SG10.25 PSSNLSS–P–MSSK0.10 (0.004)J0.18 (0.007)0.18 (0.007)K1EGH–PSMILLIMETERSMINMAX9.78 10.039.78 10.034.204.572.292.790.330.481.27 .071.211.071.42—0.502 10 7.888.381.02—2 10 INCHESMINMAX0.385 0.3950.385 0.3950.165 0.1800.090 0.1100.013 0.0190.050 BSC0.026 0.0320.020—0.025—0.350 0.3560.350 0.3560.042 0.0480.042 0.0480.042 0.056—0.0202 10 0.310 0.3300.040—2 10 NOTES:1. DATUMS -L-, -M-, -N-, AND -P- DETERMINEDWHERE TOP OF LEAD SHOULDER EXIT PLASTICBODY AT MOLD PARTING LINE.2. DIM GI, TRUE POSITION TO BE MEASURED ATDATUM -T-, SEATING PLANE.3. DIM R AND U DO NOT INCLUDE MOLDPROTRUSION. ALLOWABLE MOLD PROTRUSIONIS 0.25 (0.010) PER SIDE.4. DIMENSIONING AND TOLERANCING PER ANSIY14.5M, 1982.5. CONTROLLING DIMENSION: INCH.6. 775-01 IS OBSOLETE, NEW STANDARD 775-02.FAST AND LS TTL DATA7-11SS–M–PSSNLSS–P–MSS
PACKAGE OUTLINESPLCC (continued)Case 776-02 FN Suffix28-Pin PlasticBY BRK-N-0.18 (0.007)D-L-0.18 (0.007)UMS–PT NLS–PSSS–MSL–MSS-M-28LEADSACTUAL28T NMZ1WD1-P-G10.25 (0.010)VXMT NS–PSLS–MSVIEW D-DA0.18 (0.007)MT LS–MSNS–PSR0.18 (0.007)MT LS–MSNS–PSZC-T-JSEATINGPLANEFDETAIL ST LS–MSNSDIMABCEFGHJKRUVWXYZG1K1Z1–P0.18 (0.007)0.18 (0.007)DETAIL SG1SMMT LT NSS–M–PSSNLSS–P–MSSK0.10 (0.004)0.25 (0.010)0.18 (0.007)0.18 (0.007)K1EGHSMILLIMETERSMINMAX12.32 12.5712.32 12.574.204.572.292.790.330.481.27 .211.071.211.071.42—0.502 10 10.42 10.921.02—2 10 INCHESMINMAX0.485 0.4950.485 0.4950.165 0.1800.090 0.1100.013 0.0190.050 BSC0.026 0.0320.020—0.025—0.450 0.4560.450 0.4560.042 0.0480.042 0.0480.042 0.056—0.0202 10 0.410 0.4300.040—2 10 NOTES:1. DUE TO SPACE LIMITATION, CASE 776-02 SHALLBE REPRESENTED BY A GENERAL (SMALLER)CASE OUTLINE DRAWING RATHER THANSHOWING ALL 28 LEADS.2. DATUMS -L-, -M-, -N-, AND -P- DETERMINEDWHERE TOP OF LEAD SHOULDER EXIT PLASTICBODY AT MOLD PARTING LINE.3. DIM G1, TRUE POSITION TO BE MEASURED ATDATUM -T-, SEATING PLANE.4. DIM R AND U DO NOT INCLUDE MOLDPROTRUSION. ALLOWABLE MOLD PROTRUSIONIS 0.25 (0.010) PER SIDE.5. DIMENSIONING AND TOLERANCING PER ANSIY14.5M, 1982.6. CONTROLLING DIMENSION: INCH.7. 776-01 IS OBSOLETE, NEW STANDARD 776-02.FAST AND LS TTL DATA7-12MMT LT NSS–M–PSSNLSS–P–MSS
PACKAGE OUTLINESPLCC (continued)Case 779-02 FN Suffix68-Pin Plastic-N-0.18 (0.007)BY BRKD-L-MT N0.18 (0.007)UMS–PT 0.25 (0.010)VXMT N–PST LT NSSLS–MSNLSVIEW D-DA0.18 (0.007)MT LS–MSNS–PSR0.18 (0.007)MT LS–MSNS–PSZH0.18 (0.007)0.18 (0.007)MMS–M–PSSS–P–MSSK1CEK0.10 (0.004)-T-JGSEATINGPLANEFDETAIL SDETAIL SG10.25 (0.010)ST LS–MSNS–PDIMABCEFGHJKRUVWXYZG1K1Z10.18 (0.007)0.18 (0.007)SMILLIMETERSMINMAX25.02 25.2725.02 25.274.574.202.792.290.480.331.27 BSC0.810.66—0.51—0.6424.13 24.2824.13 24.281.211.071.211.071.421.070.50—10 2 23.12 23.621.02—2 10 INCHESMINMAX0.985 0.9950.985 0.9950.165 0.1800.090 0.1100.013 0.0190.050 BSC0.026 0.0320.020—0.025—0.950 0.9560.950 0.9560.042 0.0480.042 0.0480.042 0.056—0.0202 10 0.910 0.9300.040—2 10 NOTES:1. DUE TO SPACE LIMITATION, CASE779-02 SHALL BE REPRESENTED BY AGENERAL (SMALLER) CASE OUTLINEDRAWING RATHER THAN SHOWINGALL 68 LEADS.2. DATUMS -L-, -M-, -N-, AND -PDETERMINED WHERE TOP OF LEADSHOULDER EXIT PLASTIC BODY ATMOLD PARTING LINE.3. DIM G1, TRUE POSITION TO BEMEASURED AT DATUM -T-, SEATINGPLANE.4. DIM R AND U DO NOT INCLUDE MOLDPROTRUSION. ALLOWABLE MOLDPROTRUSION IS 0.25 (0.010) PER SIDE.5. DIMENSIONING AND TOLERANCINGPER ANSI Y14.5M, 1982.6. CONTROLLING DIMENSION: INCH.7. 779-01 IS OBSOLETE, NEW STANDARD779-02.FAST AND LS TTL DATA7-13MMT LT NSS–M–PSSNLSS–P–MSS
FAST AND LS TTL DATA7-14
y14.5m, 1982. 3. controlling dimension: millimeter. 4. dimension a and b do not include mold protrusion. 5. maximum mold protrusion 0.15 (0.006) per side. 6. 751a-01 is obsolete, new standard 751a-02.-a--b- p g c k seating plane d14 pl m f j 7 pl r x 45 1 7 14 8 case 751a-02 d suffix 14-pi
