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T-top800Ultra-Soft High Thermal Conductive Gap FillerLiPOLY T-top800 is a high deflection gap pad,with outstanding thermal conductivity and lowthermal resistance in form shape. T-top800 offersexcellent compression, filling small air gaps onuneven surfaces, ensuring an efficient and consistent transfer of heat. T-top800 was designed forthermal modules with limited gap sizes and lowcompression force.Features-Applications- Thermal conductivity: 8.0 W/m*K High compression rate Low thermal impedance Silicone compound UL 94V-0 qualified Between CPU and heat sink. Between a component and heat sink Flat-panel displays Power supplies High speed mass storage drives Telecommunication hardwareSpecifications Sheet form Die-cut partsTypical PropertiesPROPERTYColorSurface tackPurple2-side/1-sideTESTMETHODUNITVisual-2-side weak--0.5 3.0ASTM D374mm3.3ASTM D792g/cm3-60 150- Deflection @10 psi3-%Deflection @20 psi15-%Deflection @30 psi33-%Deflection @40 psi47-%Deflection @50 psi60-%10ASTM D149KV/mmSurface resistivity 1011ASTM D257OhmVolume resistivity 1010ASTM D257Ohm-mThicknessDensityApplication temperatureCOMPRESSIONELECTRICALDielectric breakdownTHERMALThermal Conductivity8ASTM D5470W/m*KThermal impedance@10 psi0.295ASTM D5470 -in2/WThermal impedance@20 psi0.251ASTM D5470 -in2/WThermal impedance@30 psi0.213ASTM D5470 -in2/WThermal impedance@40 psi0.165ASTM D5470 -in2/WThermal impedance@50 psi0.134ASTM D5470 -in2/WV-0UL94-FLAME RATINGUL Flammability class
T-pad900Ultra-Soft High Thermal Conductive Gap FillerLiPOLY T-pad900 is an ultra soft and highlyconformable thermally conductive interface pad.With a thermal conductivity of 9.0 W/m*K and alow thermal resistance under minimal pressure,T-pad900 offers excellent performance at anextremely competitive price. A fiberglass layer inthe middle provides excellent cut-throughresistance.Features-Applications- Thermal conductivity: 9.0 W/m*K High compression rate Low thermal impedance Fiberglass reinforced Between CPU and heat sink. Between a component and heat sink Flat-panel displays Power supplies High speed mass storage drives Telecommunication hardwareSpecifications Sheet form Die-cut partsTypical PropertiesPROPERTYTEST METHODUNITGrayVisual-Fiberglass--2-side weak--0.5 2.5ASTM D374mm3.4ASTM D792g/cm35ASTM D224000-60 150- Deflection @10 psi12-%Deflection @30 psi42-%Deflection @50 psiELECTRICAL65-% 12ASTM D149KV/mmSurface resistivity 10 11ASTM D257OhmVolume resistivity 10 10ASTM D257Ohm-m9ASTM D5470W/m*KThermal impedance@10 psi0.282ASTM D5470 -in 2/WThermal impedance@30 psi0.194ASTM D5470 -in 2/WThermal impedance@50 psi0.129ASTM D5470 -in 2/WColorReinforced layerSurface tack2-side/1-sideThicknessDensityHardness @ without fiberglassApplication temperatureCOMPRESSIONDielectric breakdownTHERMALThermal Conductivity
Thermal Impedance & CompressionCompressionTest method: ASTM D5470Thermal Impedance ( -in2/W)Compression (%)Force(psi)0.5mm1.0 mm2.0 mm0.5mm1.0 mm2.0 0.1170.1290.140296579ReliabilityTest PropertyThermal ResistanceTest PropertyThermal ResistanceTest PropertyThermal ResistanceTest PropertyThermal ResistanceTest PropertyThermal ResistanceCompression70 Force 1280.1270.1280.127Compression150 Force 1280.1290.1280.128Compression60 / 90 % RHForce 1290.1280.1280.127Compression-40 (30min) 125 (30min)Force (psi)0 cycles100 cycles200 cycles300 cycles400 cycles500 28CompressionUltra Low Temp (-60 )Force 40.193500.1290.1280.1290.1280.1290.129
T-work7000Ultra-Soft High Thermal Conductive Gap FillerLiPOLY T-work7000 is a high performancethermally conductive interface pad. T-work7000offers outstanding thermal conductivity at11.0 W/m*K and extremely low thermal resistanceunder minimal force. T-work7000 offers excellentcompression, filling small air gaps and unevensurfaces, ensuring an efficient and consistenttransfer of heat. T-work7000 is designed for themost demanding of applications.Features- Thermal conductivity: 11.0 W/m*K High compression rate Extremely low thermal impedanceApplicationsUltra soft highly thermally conductive gap filler Between CPU and heat sink. Between a component and heat sink. Flat-panel displays Power supplies High speed mass storage drives Telecommunication hardwareHeat work7000ConfigurationsSilicone compound withSheets form,weak sticky surfaces.Die-cuts partsThermal Impedance & CompressionCompressionThermal Impedance (K-in2/W)Compression (%)Force(psi)1.0mm T2.0 mm T3.0 mm T1.0mm T2.0 mm T3.0 mm 1Test method: ASTM D5470
Typical PropertiesPropertyTEST METHODUNITGray GreenVisual-2-side weak--1.0 3.0ASTM D374mm3.4ASTM D792g/cm3-60 150- Deflection @10 psi14-%Deflection @20 psi24-%Deflection @30 psi47-%Deflection @40 psi55-%Deflection @50 psi59-% 12ASTM D149KV/mmSurface resistivity 1011ASTM D257OhmVolume resistivity 1010ASTM D257Ohm-mThermal Conductivity11ASTM D5470W/m*KThermal Conductivity6.3ISO 22007-2W/m*KThermal impedance@10 psi0.223ASTM D5470 -in2/WThermal impedance@20 psi0.202ASTM D5470 -in2/WThermal impedance@30 psi0.140ASTM D5470 -in2/WThermal impedance@40 psi0.119ASTM D5470 -in2/WThermal impedance@50 psi0.108ASTM D5470 -in2/WV-0UL94-ColorSurface tack2-side/1-sideThicknessDensityApplication temperatureCOMPRESSIONELECTRICALDielectric breakdownTHERMALFLAME RATINGUL Flammability class
ReliabilityTest PropertyThermalResistanceTest PropertyThermalResistanceTest PropertyThermalResistanceTest PropertyThermalResistanceCompressionForce (psi)100hrs70 090.111500hrs1000hrsCompressionForce (psi)Initial100hrs150 rce sionForce (psi)0cycles60 / 90 % RH100hrs250hrs500hrs-40 (30min)100200cyclescycles1000hrs 125 0.1080.1090.1100.1100.1090.110Test PropertyCompressionForce (psi)Ultra Low Temp (-60 )Initial 100hrs 200hrs 300hrs 400hrs .1090.1100.1090.110
T-work8000Ultra-Soft High Thermal Conductive Gap FillerLiPOLY T-work8000 is a high performancethermally conductive interface pad. T-work8000offers outstanding thermal conductivity at15.0 W/m*K and extremely low thermal resistanceunder minimal force. T-work8000 offers excellentcompression, filling small air gaps and unevensurfaces, ensuring an efficient and consistenttransfer of heat. T-work8000 is designed for themost demanding of applications.Features Thermal conductivity: 15.0 W/m*K High compression rate Extremely low thermal impedanceApplicationsUltra soft highly thermally conductive gap filler Between CPU and heat sink. Between a component and heat sink. Flat-panel displays Power supplies High speed mass storage drives Telecommunication hardwareHeat work8000ConfigurationsSilicone compound withSheets form,weak sticky surfaces.Die-cuts partsThermal Impedance & CompressionCompressionThermal Impedance (K-in2/W)Force(psi)1.0mm T2.0 mm T3.0 mm on (%)1.0mm T2.0 mm T3.0 mm 182870.0460.0590.064798690Test method: ASTM D547010
Typical PropertiesTEST METHODUNITPurpleVisual-2-side weak--1.0 3.0ASTM D374mm3.3ASTM D792g/cm3-60 150- Deflection @10 psi10-%Deflection @20 psi42-%Deflection @30 psi64-%Deflection @40 psi71-%Deflection @50 psi79-% 12ASTM D149KV/mmSurface resistivity 1011ASTM D257OhmVolume resistivity 1010ASTM D257Ohm-mThermal Conductivity15ASTM D5470W/m*KThermal Conductivity8.5ISO 22007-2W/m*KThermal impedance@10 psi0.185ASTM D5470 -in2/WThermal impedance@20 psi0.122ASTM D5470 -in2/WThermal impedance@30 psi0.074ASTM D5470 -in2/WThermal impedance@40 psi0.054ASTM D5470 -in2/WThermal impedance@50 psi0.046ASTM D5470 -in2/WV-0UL94-PROPERTYColorSurface tack2-side/1-sideThicknessDensityApplication temperatureCOMPRESSIONELECTRICALDielectric breakdownTHERMALFLAME RATINGUL Flammability class
ReliabilityTest PropertyCompression70 Force 0750.077500.0460.0480.0470.0460.048Test PropertyCompression150 Force 0770.078500.0460.0480.0470.0470.048Test PropertyCompression60 /90%RHForce 0760.075500.0460.0470.0460.0450.045Test PropertyCompression 125 (30min)-40 (30min)Force (psi)0 cycles100 cycles200 cycles300 cycles400 cycles500 .0450.0480.0470.047Test PropertyCompressionUltra Low Temp (-60 )Force 0.047
Dielectric breakdown 12 ASTM D149 KV/mm Surface resistivity 10 1 ASTM D257 Ohm Volume resistivity 1010 ASTM D257 Ohm-m THERMAL Thermal Conductivity 15 ASTM D5470 W/m*K Thermal Conductivity 8.5 ISO 22007-2 W/m*K Thermal impedance@10 psi 0.185 ASTM D5470 -in2/W Thermal 2impedance@20 psi 0.122 ASTM D5470 -in /W Thermal impedance@30 psi 0.074 ASTM D5470
