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PRE-EVENTguideConference: November 1 - 4, 2021Exposition: November 3 - 4, 2021Minneapolis Convention CenterMinneapolis, MN, USA*Co-located with MD&M Minneapoliswww.smta.org/smtaiREGISTER TODAY ATWWW.SMTA.ORG/SMTAI1
PREMIERE SPONSORSEVENT SPONSORSMEDIA AND ASSOCIATIONSPONSORS
INTRODUCTIONSMTA International provides your best chance to reconnect with the globalelectronics manufacturing community and to stay competitive, identifychallenges, innovate and exceed expectations.We invite you to attend the in-person SMTA International Conference and Exhibition from November 1 - 4, at theMinneapolis Convention Center. Virtual presentations will be available starting November 15th. We are proud ofour legacy of providing outstanding conference and exhibition experiences and this year will be no different. Theconference and exhibition are a unique opportunity for us to collaborate, share, and learn from each other andindustry experts.The team work and collaboration that goes into developing the conference and exhibition is exceptional – it reallyhighlights that SMTA is more than just an industry association, we are a family. Our technical program containspapers and presentations from true subject matter experts covering a wide range of electronic manufacturing topics.The Technical Advisory Committee and the SMTA staff, Chapter Officers and Global Board of Directors sincerely hopethat SMTA International is a valuable and enjoyable experience for you. Register today!The Industry’s Largest and StrongestTechnical ProgramThe Largest Audience of Engineers andManufacturing ProfessionalsSMTA International remains an exceptional eventas we attract an outstanding group of authors,speakers and exhibitors. Our technical programcontains papers and presentations from truesubject matter experts covering a wide range ofelectronic manufacturing topics. SMTA Internationalconsistently welcomes over 100 speakers into thetechnical program each year, along with offeringprofessional development courses and studentposter sessions.We are excited to welcome Medical Design &Manufacturing Minneapolis (MD&M) to theMinneapolis Convention Center this November.Together, the events bring one of the largestaudiences of engineering and manufacturingprofessionals to the Midwest.Not able to attend in-person? You can streamrecorded presentations starting November 15th.Explore all five manufacturing and engineeringtrade shows that share the expo floor. It’s a onestop experience delivering design to manufacturingsolutions at every stage of the manufacturingprocess—design, materials, manufacturing,automation, and packaging—in top manufacturingsectors.SECTION 1SECTION 2SECTION 3SECTION 4SECTION 5SECTION 6SECTION 7SECTION 8SECTION 9SECTION 10SECTION 11SECTION 12Page 4Page 6Page 7Page 8Page 9Page 13Page 15Page 16Page 19Page 20Page 21Page 22Advanced PackagingTechnology (APT)Flux, Solder,Adhesives (FSA)Harsh EnvironmentApplications (HE)Inspection/CounterfeitElectronics (INS)Lead-Free SolderingTechnology (LF)ManufacturingExcellence (MFX)Substrates/PCBTechnology (SUB)TechnicalInnovations (TI)Professional DevelopmentCourses (PDC’S)Students & YoungProfessionals (SYP)ElectronicsExhibition (EXPO)Women’s LeadershipProgram (WLP)THE SECTIONS INCLUDED IN THIS GUIDE:REGISTER TODAY ATWWW.SMTA.ORG/SMTAI3
Indicates virtual presentation(APT)ADVANCED PACKAGING TECHNOLOGYA Generic Approach for Automatic Design Rule Derivation for Assembly Design Kits (ADK)Andy Heinig, Fraunhofer IIS/EASAdditive-Print Process-Performance Interaction for Ink-Jet and Direct-Write Circuits withSurface Mount ComponentsPradeep Lall, Ph.D., Auburn UniversityAdvances in Packaging for Future Technology TrendsKai Hollstein, Institute for Microelectronic SystemsAg Sintering Die Attach Solution for System in Package RF Module- Assembly, ProcessChallenges and Resin Bleed Out OptimizationMd Hasnine, QorvoAn Approach to Use Reduced Sample Sizes for Qualification Testing Based on Failures inTime (FITS) Analysis and the Poisson Exponential Binomial Distribution for Low VolumeCustom ComponentsJacob Weber, Collins AerospaceAutomotive Gate Driver Package with Galvanically Isolated Communication LinkageBurton Carpenter, NXP SemiconductorsCPU Socket Interposer Component Level and Manufacturability Study, Part 1: SocketContact vs. Direct-Solder-Attach InterconnectionPaul Wang, Mitac International CorporationCu Conductive Paste as Via Filling Materials for Through Silicon Via (TSV) and ThroughGlass Via (TGV)Yoshinori Ejiri, Showa Denko Materials Co., Ltd.Emerging Processes and Assembly Challenges for Electronics ManufacturingGlenn Farris, Universal Instruments CorporationEnhancing Low Temperature Solder Interconnect Board Level Shock PerformanceTae-Kyu Lee, Cisco Systems, Inc.Freeze Frame Reflow to Enhance Yields for Advanced Low Profile Bottom TerminatedPackagesSteven Kummerl, Texas Instruments4REGISTER TODAY ATWWW.SMTA.ORG/SMTAI
ADVANCED PACKAGING TECHNOLOGY (APT)Fundamental Study of Core Ball BGA Technology Through Assembly to ReliabilityJimin Yao, Intel CorporationHigh Speed Data Transmission Characteristics On Glass Based InterposerSatoru Kuramochi, Dai Nippon Printing co ltdInnovative Indium and Silver-Tin Plating Processes for Connector Press-Fit ApplicationsFrank Xu, Ph.D., MacDermid Alpha Electronics SolutionsInvestigation Of Interdiffusion and Formation Of Intermetallic Compounds in PowerElectronic Substrate Joints Produced by Transient Liquid Phase BondingChidinma Imediegwu, Georgia Institute of TechnologyMicro Device Hot Solder DipGary Moffat, Retronix LtdModeling of the Effect of Thermal Pad Voiding on Quad Flatpack No-Lead ComponentsRoss Wilcoxon, Ph.D., Collins AerospaceNo Bleed Die Attach to Roughened LeadframeDan Hart, MacDermid Alpha Electronics SolutionsPerspectives and Considerations for the Implementation of Pb-Free Solders intoAerospace, Defense, and High Performance Products and SystemsAnthony Rafanelli, Ph.D., Raytheon TechnologiesReliability Assessment of Micro Via Stacking Configuration in FCPBGA Using FEMSandeep Shantaram, Ph.D., NXP SemiconductorsUnderfill Material and Interface Property Evolution in Underhood AutomotiveTemperatures over Period of 1-YearPradeep Lall, Ph.D., Auburn UniversityREGISTER TODAY ATWWW.SMTA.ORG/SMTAI5
Indicates virtual presentation(FSA)FLUX, SOLDER, ADHESIVESA Correlation Study of Solder Cup Voiding Versus Solder Joint IntegrityTimothy Pearson, Collins AerospaceAn Investigation into the Effects of Greases on Low-Load Gold-Plated Electrical ContactsUndergoing FrettingRishabh Chaudhary, M.S., Center for Advanced Life Cycle Engineering (CALCE)An Investigation on the Influence of Nickel Contamination of Plated Through Hole (PTH)Solder Joint IntegrityDave Hillman, Collins AerospaceDeliquescent Relative Humidity Measurement of No-Clean Flux ResiduesEric Campbell, IBM CorporationDevelopment of Encapsulation Solutions for Flexible Hybrid ElectronicsWeifeng Liu, Ph.D., FlexDielectric Behavior of SolderDeborah Chung, Ph.D., University at Buffalo, The State University of New YorkEdge Bonding as Viable Reinforcement for Solder Joints in High Reliability ApplicationsJimmy Shu, MacDermid Alpha Electronics SolutionsEvolution and Applications of Fine-Feature Solder Paste Printing for HeterogeneousIntegrationEvan Griffith, Indium CorporationLower Temperature Soldering Using Supercooled Liquid MetalIan Tevis, SAFI-TechMaterials Characterization and Correlation Study of Solder Paste Using ElectrochemicalImpedance Spectroscopy (EIS) and Surface Insulation Resistance (SIR)Mark McMeen, STI ElectronicsTest Methods to Differentiate Risk Between Benign and Aggressive Wave Solder No-CleanFlux ResidueKevin Zhang, Cisco Systems, Inc.6REGISTER TODAY ATWWW.SMTA.ORG/SMTAI
Indicates virtual presentation(HE)HARSH ENVIRONMENT APPLICATIONSAssessment Of Long-Term Storage System Of Electronic ComponentsDiganta Das, Ph.D., University of Maryland - CALCEChallenges of Interpreting and Applying New IPC J-STD-001 Cleanliness Standards inHigh-Rel ApplicationsBill Capen, Honeywell FM&TEffect of Temperature on the Mechanical Fatigue of Solder Joints in Ball Grid ArrayAssemblyXin Wei, Auburn UniversityElectrical Performance Impact of Disinfecting Near and Around Electronic SystemsPhil Isaacs, IBM CorporationOnline Monitoring of Non-Ionic Impurities in Rinsing of Cleaned PCBAVladimir Sitko, PBT Works s.r.o.SIR Glass Test Vehicle Designed to Characterize Process MaterialsRichard Stephenson, Ph.D., EMD ElectronicsUse of Electrochemical Impedance Spectroscopy (EIS) as Test Method for HumidityInteraction with PCBARajan Ambat, Ph.D., Technical University of DenmarkREGISTER TODAY ATWWW.SMTA.ORG/SMTAI7
Indicates virtual presentation(INS)INSPECTION/COUNTERFEIT ELECTRONICSA New X-Ray Tube Technology to Revolutionise Electronics InspectionKeith Bryant, KB ConsultancyAdvanced Techniques to Identify Counterfeit ComponentsBill Cardoso, Ph.D., Creative Electron, Inc.Development of a Technique for Detecting Counterfeit Energy Storage SystemsThomas Yesufu, Ph.D., Obafemi Awolowo UniversityECM Industry ChallengesGraham Naisbitt, Gen3SystemsHead on Pillow Defect Detection Using AI Machine LearningAjay Chaddha, Ph.D., Intel CorporationNew Paradigm in Additive Manufacturing: Utilization of Computed TomographyChen Dai, Ph.D., VJ TechnologiesNot Your Father’s Flying Probe Technology: New, Advanced, and Lesser-KnownCapabilities of Contemporary Flying Probe Test SystemsGiovanni Noto, SPEA8REGISTER TODAY ATWWW.SMTA.ORG/SMTAI
Indicates virtual presentation(LF)LEAD-FREE SOLDERING TECHNOLOGYA Modified Coffin-Manson Methodology for Predicting Solder Joint Life in Eutectic TinLead and Lead-Free AssembliesJean-Paul Clech, Ph.D., EPSI Inc.A Novel Bismuth and Antimony Containing Lead-Free Solder with Enhanced ThermalReliability for Automotive and LED ApplicationsJie Geng, Indium CorporationBismuth Induced Phase Transformation: New Failure Mode for Tin-Based Solder Alloyswith Bismuth, Copper and NickelTimo Herberholz, Ph.D., Robert Bosch GmbHChallenges To Maintain High Electrical Reliability of Low Temperature Solder PasteRamakrishna Hosur Venkatagiriyappa, Ph.D., MacDermid Alpha Assembly SolutionsComparison of BGA Component Level Shock and Temperature Cycle Performance ofMultiple SnBi-Based Low Temperature SoldersKevin Byrd, Ph.D., Intel CorporationComponent Side Hot Tear Defect Root Causes And Control in Full LTS Solder JointsKevin Byrd, Ph.D., Intel CorporationSolder Ball Drift Behavior of Hybrid SnAgCu‐LTS Solder Interconnects in AcceleratedThermal CyclingLuke Wentlent, Universal Instruments CorporationJim Wilcox, Universal Instruments CorporationThermal Cycling Behaviors of Hybrid and Homogeneous Low Temperature SolderInterconnectsLuke Wentlent, Universal Instruments CorporationJim Wilcox, Universal Instruments CorporationUsing a Low Melting Point Solder in a Selective Soldering ProcessEddie Groves, Pillarhouse USA, Inc.Jonathan Wol, Pillarhouse USA, Inc.Criteria for Solder Alloy AdoptionMichael Osterman, Ph.D., University of Maryland - CALCEREGISTER TODAY ATWWW.SMTA.ORG/SMTAI9
LEAD-FREE SOLDERING TECHNOLOGY (LF)Effect of Initial Volume Ratio, Reflow Temperature and Current Stressing on theMicrostructure of SnBiAg-SAC Mixed Solder JointsEric Cotts, Binghamton UniversityEffects of Matching Lead-Free Solder Joints Compared to SnPb on BGA Reliability inThermal CyclingMohammed Belhadi, Auburn UniversityEnabling Pin in Paste Through Hole Soldering Through SnBi Low Temperature SolderSugadh Bakare, Intel CorporationEvaluations of High Reliability Lead-Free Solder PasteJasbir Bath, Koki Solder America Inc.High-Reliability Lead-Free Solders for Automotive Electronics - Thermal Cycling and ShearStrength PerformanceMorgana Ribas, Ph.D., MacDermid Alpha Electronics SolutionsHybrid Assembly and Reliability of Conventional Pb-Free BGA’s Using Low TemperatureSolder Paste for Temperature Sensitive IC ApplicationsAndrew Mawer, NXP SemiconductorsInterim Thermal Cycling Report on Hybrid and Homogeneous LTS Solder JointsRichard Coyle, Ph.D., Nokia Bell LabsIntermetallic Compound Analyses Provide Interfacial Reliability for Solder Connections inElectronicsMike Wolverton, P.E., Raytheon TechnologiesLow Temperature Soldering Product Level Certification and ProliferationKK Tang, Intel CorporationLow-Temperature Solders SMT Process Optimization for Enhanced ReliabilityMorgana Ribas, Ph.D., MacDermid Alpha Electronics SolutionsManufacturing Cost Reductions Available When Using Low MP Solder PasteMitchell Holtzer, Alpha Assembly SolutionsMechanical Characterization of SAC305 and SnPb36Ag2 BGA Assemblies Under StaticFlexural LoadingJean-Baptiste Libot, Ph.D., Safran Electronics & Defense10REGISTER TODAY ATWWW.SMTA.ORG/SMTAI
LEAD-FREE SOLDERING TECHNOLOGY (LF)Mechanical Shock Testing And Failure Analysis On Mixed SnAgCu-BiSn And Full StackBiSn Solder Joints Of CABGA192 ComponentsJagadeesh Radhakrishnan, Intel CorporationMechanical Strength - Low Melting Temperature Alloys TestLars Bruno, Ericsson ABMicroalloying Effects on Intermetallic Compound Growth and Mechanical Reliability of SnBi Solder JointsYaohui Fan, Ph.D., Purdue UniversityReducing Solder Scrap by Replacing Solder Paste with Solder Preforms when AppropriateMitchell Holtzer, Alpha Assembly SolutionsReliability of Solder Joints on Flexible Aluminum PC BoardsDivyakant Kadiwala, Averatek CorporationRole of Conformal Coating and its Strategies for Tin Whisker MitigationPreeth Sivakumar, Binghamton UniversitySolder Joint Separation During Second Reflow Induced by VIPPO Structures: Mechanismand Modeling Methodology StudyWeidong Xie, Cisco Systems, Inc.Solder Reliability Solution Model Modification with a Finite Rate of Temperature ChangeStephen Hwang, Ph.D., Sandia National LaboratoriesSolderability of Additive Cu SurfacesRebecca Wheeling, Ph.D., Sandia National LaboratoriesThe Characterization for Rework of Low Temperature Solder JointsKK Tang, Intel CorporationThe Effect of Peak Reflow Temperature on Thermal Cycling Performance and Failure Modeof Hybrid Low Temperature Solder JointsRichard Coyle, Ph.D., Nokia Bell LabsThe Effects of Surface Finish on the Microstructure of TLPS Paste JointsCatherine Shearer, EMD ElectronicsThe Influence of Element Lead (Pb) Content in Tin Plating on Tin Whisker Initiation/GrowthDavid Hillman, Collins AerospaceREGISTER TODAY ATWWW.SMTA.ORG/SMTAI11
LEAD-FREE SOLDERING TECHNOLOGY (LF)The Variation of the Electrical Resistance and Microstructure of SnBi Based Solder Jointswith Current StressingFaramarz Hadian, Ph.D., Binghamton UniversityThermal Cycling Induced Interconnect Stability Degradation Mechanism in Low MeltingTemperature Solder JointsTae-Kyu Lee, Cisco Systems, Inc.Thermal Fatigue Reliability of a 1206 Chip Resistor with High-Performance Pb-Free SolderAlloysTimothy Pearson, Collins AerospaceThermal Reliability of Mixing Bismuth Containing Solder Paste with SAC BGA’s at LowReflow Temperature- Part IISahana Marur Kempaiah, Rochester Institute of TechnologyUnveiling a Total Solution for Soldering Through-Hole Components using a LowTemperature AlloyPritha Choudhury, Ph.D., MacDermid Alpha Electronics Solutions12REGISTER TODAY ATWWW.SMTA.ORG/SMTAI
Indicates virtual presentation(MFX)MANUFACTURING EXCELLENCECleanliness Detection and Resistance of Solvent Extract, A Critical EvaluationDavid Lober, KYZEN CorporationCorrelation of Solder Paste Electrochemical Impedance Spectroscopy (EIS) Measurementsto Solder Paste Inspection (SPI) PerformanceMorgan Miller, InsituwareDesigning of Rheology Tests to Develop New Solder Pastes FormulationCharlotte Morin, Inventec Performance ChemicalsDetailed Study of Condensate Residues in the Soldering Process - Analysis of theResponsible Reaction Partners as well as Reasons for Condensate Polymerization andGrowth of Crystalline StructuresViktoria Rawinski, Rawinski GmbHEngineered Aqueous Cleaning - It all Comes Down to PerformanceDebbie Carboni, KYZEN CorporationIdentifying Cleaning Compatibility Issues with Electronic ComponentsClaire Brennan, Ph.D., Collins AerospaceImportancy of Good Design for Cleaning PCBAVladimir Sitko, PBT Works s.r.o.Lean Six Sigma and Model-Based Systems Engineering Capabilities Matrix Developmentfor Counterfeit Avoidance and Supply Chain Optimization in Digital TransformationEnvironmentsLaTasha Taylor Starr, Colorado State UniversityLessons Learned with Large and Heavy Copper Boards, a Review of Quality andProductivity ImprovementsPaul Wilson, Rockwell AutomationModern Electronics Defluxing – Meeting the Low VOC ChallengeNaveen Ravindran, M.S.Ch.E., ZESTRON CorporationNew Device Validates Printer Accuracy and Squeegee Force During Singular TestMichael Sivigny, CeTaQ AmericasREGISTER TODAY ATWWW.SMTA.ORG/SMTAI13
MANUFACTURING EXCELLENCE (MFX)Process and Design Guidelines for Large and Complex RF and EMI Shields for Board LevelAssemblyMohammed Alam, Intel CorporationRobotic Soldering Process Implementation and Optimization in Electronics ManufacturingSanmaher Mashaareh, P.E., Binghamton UniversityRoot Cause of Dye Stain Observed on Server Motherboard Sockets BGA Solder Joints andits Impact on Their Solder Joint Quality and ReliabilityHemant Shah, Ph.D., Intel CorporationSelective Soldering with High-Performance Lead-Free SolderGerjan Diepstraten, ITWEAESite-Specific Ionic Contamination Process Control Monitoring Plan MethodMike Bixenman, DBA, MBA, MagnalytixStatistical Analysis of Transfer Efficiency in the Age of Very Large Sample SizesRon Lasky, P.E., Ph.D., Indium CorporationThe Effect of Grain Size Distribution on the Defect Generation Mechanism of 0201 PassivesSwagatika Patra, Binghamton University-SUNYThe Effects of the Cleaning of Populated Circuits Boards on the Performance of ConformalCoating in Thermal Shock TestingChris Brightwell, Humiseal EuropeThe Evolution of Material Handling Practices and ProcessesMichael Adamson, Inovaxe CorporationThe Relationship Between Reflow Profiles and ContaminationMike Konrad, Aqueous TechnologiesThin Foil Printing in Today’s Miniaturized World: Do Printing Rules Change?Chrys Shea, Shea Engineering ServicesValidation of Changes and Monitoring Cleaning Process Stability According to J-STD 001HChapter 8Vladimir Sitko, PBT Works s.r.o.What Do You Want on Your Tombstone?Tony Lentz, FCT Assembly14REGISTER TODAY ATWWW.SMTA.ORG/SMTAI
Indicates virtual presentation(SUB)SUBSTRATES/PCB TECHNOLOGYAnalysis of Glass Transition Temperature of PCb & Substrate Using Dynamic MechanicalAnalysis & Thermomechanical AnalysisShristi Yadav, MAE Department of University of Texas at ArlingtonIdentifying Causes of Wire Bond Pad Metal Lift-Off Failures in ENEPIG DepositsPatrick Valentine, Ph.D., Uyemura USAImpact of the Surface Finish on IMC and Solder Joint Reliability with Low-TemperatureSolder PasteBritta Schafsteller, Ph.D., Atotech Deutschland GmbHImproving Immersion Silver Performance for 5G ApplicationsDenis Jacques, Technic IncInvestigation of Pd-Ge Alloy in ENEPIG Process as Better Barrier LayerYohei Kaneko, C. Uyemura & Co., Ltd.Microstructure of Weak-Micro-Via and its Failure PreventionMing-Chun Hsieh, Osaka UniversityVarying Requirements, same Inkjet Solder Mask Coating Tool - The Case of InkjetAdaptability by Printing StrategiesLuca Gautero, Ph.D., SUSS MicroTec NLREGISTER TODAY ATWWW.SMTA.ORG/SMTAI15
Indicates virtual presentation(TI)TECHNICAL INNOVATIONSA Digital Solution to Manage In-Circuit TestingZhi Peng Wang, IBM CorporationAerosol Jet Printed Interconnects for Millimeter-Wave ComponentsAlex Ramm, OptomecAn Investigation into Alternative Methods of Drying Moisture Sensitive Devices in Storageand in Re-Work ApplicationsDan Jenkins, Steel CamelAn Automated PCB Design Constraint Extraction and Verification from the SOC PlatformDesign CollateralAlan Hatfield, Intel CorporationMinoru Ishikawa, Siemens Digital Industries SoftwareComparative Study of Thermal Conductive Adhesive and Die Attach Material for HeatsinkAssemblyRaghabendra Rout, Binghamton University-SUNYCounterfeit Mitigation by In-Line Deep Visual InspectionEyal Weiss, Ph.D., CybordGaIn Based Liquid Metals as TIMs: Challenges and ConsiderationsPeter McClure, Universal Instruments’ Advanced Process LaboratoryGetting Real in the Digital WorldMichael Ford, Aegis SoftwareHigh Performance Liquid Metal Thermal Interface MaterialsRon Lasky, P.E., Ph.D., Indium CorporationLiquid Dispensed Thermal Materials – Product Formats, Properties and ManufacturingSanjay Misra, Henkel CorporationMethod of Traceability and Counterfeit Detection of Components Through the ResaleMarket Using IoT and BlockchainCurtis Grosskopf, IBM CorporationNew IPC-1783 Component Level Authentication (CLA) StandardMichael Ford, Aegis Software16REGISTER TODAY ATWWW.SMTA.ORG/SMTAI
TECHNICAL INNOVATIONS (TI)Photonic Soldering Temperature Sensitive Components with High Temperature SolderAlloysVahid Akhavan, NovaCentrixSMT Performance Analytics - Golden Cycle Time and Automated Loss Reason InferenceAndrew Scheuerman, Ph.D., Arch SystemsSystems Analysis and Axiomatic Design using Discrete Event SimulationZohair Mehkri, FlexThermal Interface Material for Advanced Electronics ApplicationsRita Mohanty, Ph.D., HenkelREGISTER TODAY ATWWW.SMTA.ORG/SMTAI17
Indicates virtual presentation(PDC’S)PROFESSIONAL DEVELOPMENT COURSESHalf day (3.5 hours) educational courses are led by internationally respectedprofessionals with extensive experience in the subject area.Course instructors deliver focused, in-depth presentations on topics of current importance to the industry,based on their research and industry experience. Professional Development Courses are applicationoriented and structured to combine field experience with scientific research to solve everyday problems.5G Impacts and New Challenges for PCB and Integrated SMTA InfrastructuresJohn Marke, UL LLCAssembly and Reliability of Flip Chip and 6-Side Molded WLCSPJohn Lau, UnimicronAssembly: Best Practices for Improving Manufacturing ProductivityJim Hall, ITM ConsultingPhil Zarrow, ITM ConsultingBall Grid Array: Design and Assembly of BGAs with Emphasis on Backward CompatibilityRay Prasad, Ray Prasad ConsultancyCleaning and Cleanliness Quantification Boot CampMike Konrad, Aqueous TechnologiesCost Conscious Test Strategies fro Electrical Cost ProductsRobert Hanson, Robert Hanson ConsultingCost Modeling Your Assembly Line or Factory to Reduce Costs and Improve ProfitabilityRon Lasky, Ph.D., Indium CorporationDesign and Assembly Process Challenges for Bottom Terminations Components (BTCs)such as QFN, DFN and MLF in Tin-Lead & Lead Free WorldRay Prasad, Ray Prasad ConsultancyFan-Out Packaging and System-in-PackageJohn Lau, UnimicronFlexible and Rigid Flex Circuit Design PrinciplesVern Solberg, Solberg Technical Consulting18REGISTER TODAY ATWWW.SMTA.ORG/SMTAI
PROFESSIONAL DEVELOPMENT COURSES (PDC’S)Introduction to Statistical AnalysisRoss Wilcoxon, Collins AerospaceLTS 101: Manufacturing Process Guidance for Implementation of SnBi Base LowTemperature Soldering for Consumer ProductsKok Kwan Tang, Intel CorporationPCB Design for Implementing 3D and High Density Semiconductor Package TechnologiesVern Solberg, Solberg Technical ConsultingPractical Use of Low Temperature Solder, Assembly, Reflow & InspectionBob Willis, bobwillis.co.ukPrinciples and Practice of Developing Soldering ProfilesRay Prasad, Ray Prasad ConsultancyReliability of Electronics – Role of Intermetallic CompoundsJennie Hwang, Ph.D., H-Technologies GroupRobotic Soldering Process, Design, Quality Control & Defects – Causes & CuresBob Willis, bobwillis.co.ukSelection Criteria of Surface Finish for Next Generation PCB Technologies: HDI, HighFrequency, RF-Microwave, 5GKunal Shah, LilotreeSolder Joint Reliability – Principle and PracticeJennie Hwang, Ph.D., H-Technologies GroupTin Whiskers: An In-Depth Technical DiscussionDavid Hillman, Collins AerospaceTolerance Mistaken: DFM Impacts of not Properly Addressing Limitations of Material,Industry Standards and Assembly Process LimitationsDale Lee, Plexus Corp.Uncommon Leadership: Developing Influence, Increasing ImpactJason Hunt, Eye Squared LeadershipREGISTER TODAY ATWWW.SMTA.ORG/SMTAI19
(SYP)STUDENTS & YOUNG PROFESSIONALSWe’re looking towards the future and the future is YOU!Tuesday, November 2 2:00pm - 4:00pmRoundtable - Growing the Future: NextGen Electronics Manufacturing WorkforceWednesday, November 3 10:00am - 3:45pmJump Start - Foundational Technical SessionsTopics include: Stencil Printing Inspection Placement Reflow DFM CleaningThursday, November 4 12:00pm - 1:00pmCasual Career ConversationsTopics include: Resume tips and tricks Starting your career (life transitions) Propelling your career (entry level to senior level) There are no dumb questions (mentors tell all)Thursday, November 4 1:30pm - 3:00pmCasual Soft Skill ConversationsTopics include: Strategic Self Promotion Putting Emotional Intelligence to Work Stress Management and Burnout20REGISTER TODAY ATWWW.SMTA.ORG/SMTAI
(EXPO)ELECTRONICS EXPOSITIONSMTA International will co-locate with Medical Design & Manufacturing (MD&M)Minneapolis bringing together one of the largest audiences of engineering andmanufacturing professionals in the Midwest.All five trade shows share the expo floor in Minneapolis. It’s a one-stop experience delivering design to manufacturing solutionsat every stage of the manufacturing process—design, materials, manufacturing, automation, cleaning and packaging—in topmanufacturing sectors.Current Exhibitors(SMTAI Exhibitor List as of August 20)1 Click SMT5N Plus Inc.ACL STATICIDEAegis SoftwareAIM SolderAkrometrixAllfavor TechnologyAlltematedAmerican Standard CircuitsANDA TechnologiesASC InternationalASMBlueRing StencilsBTU InternationalCCL DesignCeyon Telinventory Co., Ltd.CondairConductive Containers, Inc.CyberOptics CorporationELANTAS PDGEltek USA IncESSEMTEC USAEuroplacer Americas Inc.Fuji America CorporationGarland Service CompanyGlenbrook TechnologiesHanwha TechwinInovaxe CorporationInsituwareITW EAEJBC Tools. Inc.JUKI AUTOMATION SYSTEMSKICKoh Young AmericaKulicke & SoffaKYZENLinkage TechnologiesMacDermid AlphaMagnalytix, LLCMetallic ResourcesMicroScreenMid America Taping & ReelingMirtec Corp.MycronicNeoden USANihon SuperiorNikon MetrologyNordson DAGENSW Automation Sdn. Bhd.OmronOSI Electronics, Inc.PanasonicPARMIPFC Flexible CircuitsPillarhousePrecision PCB Services, Inc.RetronixScienscopeSeica Inc.Seika MachineryShenmao AmericaSimplimatic AutomationSmartsol TechnologiesSmart SpliceSMTXTRASpecialty Coating SystemsStaticStop/SelecTech Lab FlooringSteel CamelSunshine Global CircuitsSwanstrom Tools USATeradyneTest Research, Inc.Texmac/TakayaTintronicsTrans-Tec America/YamahaUniversal InstrumentsViscomVisiConsult X-Ray SolutionsVitrox USAV-TEK, Inc.ZESTRON CorporationZymet Inc.REGISTER TODAY ATWWW.SMTA.ORG/SMTAI21
(WLP)WOMEN’S LEADERSHIP PROGRAMFree for everyone and all are welcome!We extend an invitation to everyone to attend the Women’s Leadership Program to promote women in engineeringfields. Show your support for diversity in engineering fields by attending this session.Tuesday, November 2nd 1:30pm - 5:00pmCareer development presentations and speed mentoring sessions Breaking Through Unwritten Stereotypes: Good Old Boys ClubIdentifying Mentors and Cultivating SponsorsImportance of Strategic ThinkingRelentlessly Reinvent and Accelerate your Career PathPositive Outcomes from Tough SituationsFind your Strengths: Personality AnalysisTuesday, November 2nd 5:00pm - 6:00pmConnection ReceptionThe Women’s Leadership Program will continue their annual gathering, hosting the Connection Reception on theevening of Tuesday, November 2nd!22REGISTER TODAY ATWWW.SMTA.ORG/SMTAI
REGISTRATIONRegister to attend the in-person conference and exposition, taking place inMinneapolis, MN on November 1-4 or register for the virtual conference only,access starting November 15. Visit www.smta.org/smtai to register today!VIP Package - Best Value!In-Person ConferenceVirtual ConferenceAttendeeSMTA Members: 1,050Non-Members: 1,250AttendeeSMTA Members: 650Non-Members: 850AttendeeSMTA Members: 300Non-Members: 450Speakers/Session ChairsSMTA Members: 800Non-Members: 1,000Speakers/Session ChairsSMTA Members: 350Non-Members: 550SpeakersSMTA Members: 150Non-Members: 250Includes: Registration for 5 professionaldevelopment courses of yourchoosing Access to the 4-day technicalconference in Minneapolis, MN (1) Virtual conference registration Conference proceedings Women’s Leadership Program Keynote Presentation Admission to the 2-day expo colocated with MD&M MinneapolisStudents 95Students 95Includes: Access to the 4-day technicalconference in Minneapolis, MN (1) Virtual conference registration Conference proceedings Women’s Leadership Program Keynote Presentation Admission to the 2-day expo colocated with MD&M MinneapolisIncludes: Access to the virtual conferenceplatform to stream all pre-recordedpresentations starting November15th Conference proceedingsExpo Only Free for all AttendeesAccess to the two-day electronic manufacturing exposition in Minneapolis, MN! This year we are proud to co-locate with MD&MMinneapolis which will bring five shows under one roof!All prices listed in USD.For additional information about SMTA membership, please visit our membership webpage or contact the Member ServicesManager at membership@smta.org or call 1 952-920-7682.For additional exhibitor and brand visibility registration information, please refer to the Exhibits and Sponsors Page.REGISTER TODAY ATWWW.SMTA.ORG/SMTAI23
LEAD-FREE SOLDERING TECHNOLOGY A Modified Coffin-Manson Methodology for Predicting Solder Joint Life in Eutectic Tin-Lead and Lead-Free Assemblies Jean-Paul Clech, Ph.D., EPSI Inc. A Novel Bismuth and Antimony Containing Lead-Free Solder with Enhanced Thermal Reliability for Automotive and LED Applications Jie Geng, Indium Corporation
