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Tantalum Surface Mount Capacitors – Low ESRT510 Multiple Anode MnO2OverviewThe low ESR, surge-robust T510 is designed for demandingapplications that require high surge current and high ripplecurrent capability. This series builds upon the provencapabilities of our industrial grade tantalum chip capacitorsto offer several advantages such as low ESR, high ripplecurrent capability, excellent capacitance stability, andimproved resistance to high in-rush currents. These benefitsare achieved though the utilization of multiple anodes aswell as high-stress, low impedance electrical conditioningperformed prior to screening. This series is classifiedas MSL (Moisture Sensitivity Level) 1 under J STD 020:unlimited floor life time at 30 C/85% RH.Benefits Meets or exceeds EIA Standard 535BAACTaped and reeled per EIA 481High surge current capabilityOptional gold-plated terminationsHigh ripple current capability100% surge current test100% steady-state accelerated agingCase sizes E and XESR as low as 10 mΩClick image above for interactive 3D contentOpen PDF in Adobe Reader for full functionalityApplicationsTypical applications include decoupling and filtering in many end applications, such as DC/DC converters, portableelectronics, telecommunications, and control units requiring high ripple current capability.Environmental ComplianceRoHS compliant (6/6) according to Directive 2002/95/EC when ordered with 100% Sn solder or gold-plated. Halogen-free Epoxy compliant with UL94 V–0 Molded Epoxy complies for outgassing testing under ASTM E 595.Built Into Tomorrow KEMET Electronics Corporation KEMET Tower One East Broward BoulevardFort Lauderdale, FL 33301 USA 954-766-2800 www.kemet.comT2014 T510 1/7/20211
Tantalum Surface Mount Capacitors – Low ESRT510 Multiple Anode MnO2K-SIMFor a detailed analysis of specific part numbers, please visit ksim.kemet.com to access KEMET’s K-SIM software. KEMETK-SIM is designed to simulate behavior of components with respect to frequency, ambient temperature, and DC bias levels.Ordering aseSizeCapacitanceCode (pF)CapacitanceToleranceRatedVoltage(VDC)Failure Rate/DesignTermination FinishESREXFirst two digitsrepresentsignificantfigures. Third digitspecifies numberof zeros.K 10%M 20%T TantalumMultipleAnodeLow ESR004 4006 6.3010 10016 16020 20025 25035 35050 50A N/AZ N/APackaging(C-Spec)T 100% Matte TinLast threeBlank 7" Reel(Sn) Plateddigits specify 7280 13" ReelH Standard SolderESR in mΩ.Coated(800 800(SnPb 5% Pb minimum)mΩ)G Gold Plated(A, B, C, D, X only)Performance CharacteristicsItemPerformance CharacteristicsOperating TemperatureRated Capacitance RangeCapacitance ToleranceRated Voltage Range 55 C to 125 C10 – 1,000 µF at 120 Hz/25 CK Tolerance (10%), M Tolerance (20%)4 – 50 VDF (120 Hz)Refer to Part Number Electrical Specification TableESR (100 kHz)Refer to Part Number Electrical Specification TableLeakage Current 0.01 CV (µA) at rated voltage after 5 minutes KEMET Electronics Corporation KEMET Tower One East Broward BoulevardFort Lauderdale, FL 33301 USA 954-766-2800 www.kemet.comT2014 T510 1/7/20212
Tantalum Surface Mount Capacitors – Low ESRT510 Multiple Anode EnduranceStorage LifeThermal ShockTemperature Stability85 C at rated voltage, 2,000 hours125 C at 2/3 rated voltage, 2,000 hours125 C @ 0 volts, 2,000 hoursMIL–STD–202, Method 107, Condition B, mounted, 55C to 125 C, 1,000 cyclesExtreme temperature exposure at asuccession of continuous steps at 25 C, 55 C, 25 C, 85 C, 125 C, 25 CWithin initial limitsDCLWithin 1.25 x initial limitESRWithin initial limitsΔC/CWithin 10% of initial valueDFWithin initial limitsDCLWithin 1.25 x initial limitESRWithin initial limitsΔC/CWithin 5% of initial valueDFWithin initial limitsDCLWithin 1.25 x initial limitESRWithin initial limits 25 C 55 C 85 C 125 CΔC/CIL* 10% 10% 20%DFILIL1.5 x IL1.5 x ILDCLILn/a10 x IL12 x ILΔC/CSurge VoltageMechanical Shock/VibrationWithin 10% of initial valueDF85 C, 1.32 x rated voltage 1,000 cycles(125 C, 1.2 x rated voltage)MIL–STD–202, Method 213, Condition I, 100 G peakMIL–STD–202, Method 204, Condition D, 10 Hz to2,000 Hz, 20 G peakWithin 5% of initial valueDFWithin initial limitsDCLWithin initial limitsESRWithin initial limitsΔC/CWithin 10% of initial valueDFWithin initial limitsDCLWithin initial limits*IL Initial limit KEMET Electronics Corporation KEMET Tower One East Broward BoulevardFort Lauderdale, FL 33301 USA 954-766-2800 www.kemet.comT2014 T510 1/7/20213
Tantalum Surface Mount Capacitors – Low ESRT510 Multiple Anode MnO2Electrical CharacteristicsCapacitance vs. FrequencyImpedance, ESR vs. Frequency100100T510X226M035ATE100 IMPT510E476M035ATE050 IMPT510X226M035ATE100 ESRCapacitance (μF)Impedance, ESR (Ohms)T510X336M035ATE065 IMP10T510X336M035ATE065 ESRT510E476M035ATE050 476M035ATE0500.011001,00010,000100,000Frequency ,000Frequency (Hz)10,000,000Dimensions – Millimeters (Inches)Metric will governCATHODE (-) END VIEWSIDE VIEWANODE ( ) END VIEWBOTTOM VIEWABWBHXTSGSTermination cutoutat KEMET's option,either endCase H7.3 0.34.3 0.34.0 0.3(0.287 0.012) (0.169 0.012) (0.157 0.012)7.3 0.36.0 0.33.6 0.27360–38(0.287 0.012) (0.236 0.012) (0.142 0.008)F 0.1 S 0.3 B 0.15 (.004) (.012) (Ref) 020)0.5(0.020)X(Ref)PRTAGE(Ref) (Ref) (Ref) (Min) (Ref) (Ref)0.10 0.101.71.00.133.83.53.5(0.004 0.004) (0.067) (0.039) (0.005) (0.150) (0.138) (0.138)0.10 0.100.133.83.53.5n/an/a(0.004 0.004)(0.005) (0.150) (0.138) (0.138)(mg)430.15500.73Notes: (Ref) – Dimensions provided for reference only. For low profile cases, no dimensions are provided for B, P or R because these cases do not have a bevel ora notch.These weights are provided as reference. If exact weights are needed, please contact your KEMET Sales Representative KEMET Electronics Corporation KEMET Tower One East Broward BoulevardFort Lauderdale, FL 33301 USA 954-766-2800 www.kemet.comT2014 T510 1/7/20214
Tantalum Surface Mount Capacitors – Low ESRT510 Multiple Anode MnO2Table 1 – Ratings & Part Number ReferenceRated RatedVoltage CapCaseCode/CaseSizeKEMET PartNumberDCLeakageVDC at 85 CµFKEMET/EIA(See below forpart options)µA at 25 CMax/5 6.55.05.011.011.0VDC at 85 CµFKEMET/EIA(See below forpart options)µA at 25 CMax/5 MinRatedVoltageRatedCapCase Code/Case SizeKEMET Part NumberDCLeakageDF% at 25 C120 08.08.08.08.08.08.0% at 25 C120 HzMaxDFESRMaximumOperating MSLTempMaximum AllowableRipple Current (rms)mΩ at 25 C mA at 25 C mA at 85 C mA at 125 C100 kHz100 kHz100 kHz100 71707759mΩ at 25 C mA at 25 C mA at 85 C mA at 125 C100 kHz100 kHz100 kHz100 kHzMaxESRMaximum AllowableRipple Current (rms) 125125125125 CMaximumOperatingTempReflowTemp 260 C1111111111111111111111111111111111111ReflowTemp 260 CMSL(1) To complete KEMET part number, insert M for 20% or K for 10%. Designates Capacitance tolerance.(2) To complete KEMET part number, insert T 100% Matte Tin (Sn) Plated, G Gold Plated, H Standard Solder coated (SnPb 5% Pb minimum).Designates Termination Finish.Refer to Ordering Information for additional detail.Higher voltage ratings and tighter tolerance product including ESR may be substituted within the same size at KEMET's option. Voltage substitution willbe marked with the higher voltage rating. Substitutions can include better than series. KEMET Electronics Corporation KEMET Tower One East Broward BoulevardFort Lauderdale, FL 33301 USA 954-766-2800 www.kemet.comT2014 T510 1/7/20215
Tantalum Surface Mount Capacitors – Low ESRT510 Multiple Anode MnO2Recommended Voltage Derating Guidelines85 C to 125 C120%VR67% of VR100%50% of VR33% of VR% Working Voltage% Change in Working DCVoltage with TemperatureRecommended MaximumApplication Voltage 55 C to 85 C80%% Change in Working DC Voltagewith Temperature67%60%40%20%0% 55Recommended MaximumApplication Voltage(As % of Rated Voltage)2533%85Temperature (ºC)125Ripple Current/Ripple VoltagePermissible AC ripple voltage and current are related toequivalent series resistance (ESR) and the power dissipationcapabilities of the device. Permissible AC ripple voltagewhich may be applied is limited by two criteria:1. The positive peak AC voltage plus the DC bias voltage,if any, must not exceed the DC voltage rating of thecapacitor.2. The negative peak AC voltage in combination withbias voltage, if any, must not exceed the allowable limitsspecified for reverse voltage. See the Reverse Voltagesection for allowable limits.The maximum power dissipation by case size can bedetermined using the table at right. The maximum powerdissipation rating stated in the table must be reduced withincreasing environmental operating temperatures. Refer tothe table below for temperature compensation requirements.Temperature Compensation Multipliersfor Maximum Ripple CurrentT 25 C1.00T 85 C0.90T 125 C0.40T Environmental TemperatureThe maximum power dissipation rating must be reduced with increasingenvironmental operating temperatures. Refer to the TemperatureCompensation Multiplier table for details.KEMETCase CodeEIACase CodeMaximum PowerDissipation (P max)mWatts @ 25 Cw/ 20 C 7090125270285Using the P max of the device, the maximum allowable rmsripple current or voltage may be determined.I(max) P max/RE(max) Z P max/RI rms ripple current (amperes)E rms ripple voltage (volts)P max maximum power dissipation (watts)R ESR at specified frequency (ohms)Z Impedance at specified frequency (ohms) KEMET Electronics Corporation KEMET Tower One East Broward BoulevardFort Lauderdale, FL 33301 USA 954-766-2800 www.kemet.comT2014 T510 1/7/20216
Tantalum Surface Mount Capacitors – Low ESRT510 Multiple Anode MnO2Reverse VoltageSolid tantalum capacitors are polar devices and may be permanently damaged or destroyed if connected with the wrongpolarity. The positive terminal is identified on the capacitor body by a stripe plus in some cases a beveled edge. A smalldegree of transient reverse voltage is permissible for short periods per the table. The capacitors should not be operatedcontinuously in reverse mode, even within these limits.TemperaturePermissible Transient Reverse Voltage25 C85 C125 C15% of Rated Voltage5% of Rated Voltage1% of Rated VoltageTable 2 – Land Dimensions/CourtyardKEMETMetricSizeCodeDensity Level A:Maximum (Most) LandProtrusion (mm)Density Level B:Median (Nominal) LandProtrusion (mm)Density Level C:Minimum (Least) LandProtrusion 125.102.331.994.038.264.84Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflowsolder processes.Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should performqualification testing based on the conditions outlined in IPC standard 7351 (IPC–7351).1Height of these chips may create problems in wave soldering.2Land pattern geometry is too small for silkscreen outline.V1LLWWV2SGrid Placement Courtyard KEMET Electronics Corporation KEMET Tower One East Broward BoulevardFort Lauderdale, FL 33301 USA 954-766-2800 www.kemet.comT2014 T510 1/7/20217
Tantalum Surface Mount Capacitors – Low ESRT510 Multiple Anode MnO2Soldering ProcessPlease note that although the X/7343–43 case size canwithstand wave soldering, the tall profile (4.3 mm maximum)dictates care in wave process development.Hand soldering should be performed with care due to thedifficulty in process control. If performed, care should betaken to avoid contact of the soldering iron to the moldedcase. The iron should be used to heat the solder pad,applying solder between the pad and the termination, untilreflow occurs. Once reflow occurs, the iron should beremoved immediately. “Wiping” the edges of a chip andheating the top surface is not recommended.During typical reflow operations, a slight darkening of thegold-colored epoxy may be observed. This slight darkening isnormal and not harmful to the product. Marking permanencyis not affected by this change.Profile FeatureSnPb Assembly Pb-Free AssemblyPreheat/SoakTemperature Minimum (TSmin)100 C150 CTemperature Maximum (TSmax)150 C200 CTime (ts) from Tsmin to Tsmax)60 – 120 seconds60 – 120 secondsRamp-up Rate (TL to TP)3 C/second maximum3 C/second maximumLiquidous Temperature (TL)183 C217 CTime Above Liquidous (tL)60 – 150 seconds220 C*235 C**60 – 150 seconds250 C*260 C**20 seconds maximum30 seconds maximum6 C/second maximum6 C/second maximum6 minutes maximum8 minutes maximumPeak Temperature (TP)Time within 5 C of MaximumPeak Temperature (tP)Ramp-down Rate (TP to TL)Time 25 C to PeakTemperatureNote: All temperatures refer to the center of the package, measured on thepackage body surface that is facing up during assembly reflow.* For Case Size height 2.5 mm** For Case Size height 2.5 mmTPTLTemperatureKEMET’s families of surface mount capacitors arecompatible with wave (single or dual), convection, IR,or vapor phase reflow techniques. Preheating of thesecomponents is recommended to avoid extreme thermalstress. KEMET's recommended profile conditions forconvection and IR reflow reflect the profile conditions of theIPC/J–STD–020D standard for moisture sensitivity testing.The devices can safely withstand a maximum of three reflowpasses at these conditions.tPMaximum Ramp-up Rate 3 C/secondMaximum Ramp-down Rate 6 C/secondtLTsmaxTsmin25ts25 C to PeakTimeStorageTantalum chip capacitors should be stored in normal working environments. While the chips themselves are quite robust inother environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,and long term storage. In addition, packaging materials will be degraded by high temperature – reels may soften or warpand tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40 C and maximumstorage humidity not exceed 60% relative humidity. Temperature fluctuations should be minimized to avoid condensationon the parts and atmospheres should be free of chlorine and sulphur bearing compounds. For optimized solderability chipstock should be used promptly, preferably within three years of receipt. KEMET Electronics Corporation KEMET Tower One East Broward BoulevardFort Lauderdale, FL 33301 USA 954-766-2800 www.kemet.comT2014 T510 1/7/20218
Tantalum Surface Mount Capacitors – Low ESRT510 Multiple Anode MnO2ConstructionPolarity Stripe ( )Molded EpoxyCaseDetailed Cross SectionSilver Paint(Fourth Layer)PolarityBevel ( )Leadframe( Cathode)WasherTantalum WireTantalum WireWeld(to attach wire)Carbon(Third Layer)WasherSilver AdhesiveLeadframe( Anode)Molded EpoxyCaseMnO2(Second Layer)Ta2O5 Dielectric(First Layer)TantalumCapacitor MarkingDate Code *1 digit last number of year6 20167 20178 20189 20190 20202nd and 3rd digit week of theyear01 1st week of the year to52 52nd week of the yearstKEMETMulti-AnodeMnO2PolarityIndicator ( )PicofaradCodeKEMETIDRatedVoltageDateCode** 036 36th week of 2020 KEMET Electronics Corporation KEMET Tower One East Broward BoulevardFort Lauderdale, FL 33301 USA 954-766-2800 www.kemet.comT2014 T510 1/7/20219
Tantalum Surface Mount Capacitors – Low ESRT510 Multiple Anode MnO2Tape & Reel Packaging InformationKEMET’s molded chip capacitor families are packaged in 8 and 12 mm plastic tape on 7" and 13" reels in accordance withEIA Standard 481: Embossed Carrier Taping of Surface Mount Components for Automatic Handling. This packaging systemis compatible with all tape-fed automatic pick-and-place systems.Right handorientationonly( )Embossed carrier( )EmbossmentTop tape thickness0.10 mm (0.004”)maximum thickness180 mm (7.0”) or330 mm (13.”)8 mm (0.315”) or12 mm (0.472”)Table 3 – Packaging QuantityCase 60-207360-43Tape Width(mm)7" Reel*13" 01,000* No C-Spec required for 7" reel packaging. C-7280 required for 13" reel packaging. KEMET Electronics Corporation KEMET Tower One East Broward BoulevardFort Lauderdale, FL 33301 USA 954-766-2800 www.kemet.comT2014 T510 1/7/202110
Tantalum Surface Mount Capacitors – Low ESRT510 Multiple Anode MnO2Figure 1 – Embossed (Plastic) Carrier Tape DimensionsP2TT2ØD0P0(10 pitches cumulativetolerance on tape 0.2 mm)A0E1FK0B1E2B0S1WP1T1Center Lines of CavityB1 is for tape feeder reference only,including draft concentric about B0.EmbossmentFor cavity size,see Note 1, Table 4ØD1Cover TapeUser Direction of UnreelingTable 4 – Embossed (Plastic) Carrier Tape DimensionsMetric will governConstant Dimensions — Millimeters (Inches)Tape Size8 mm12 mmD1 MinimumNote 1D01.5 0.10/ 0.0(0.059 0.004/ 0.0)1.0(0.039)1.5(0.059)E1P0R Reference S1 MinimumT1T MaximumNote 2Note 3MaximumP21.75 0.104.0 0.102.0 0.05(0.069 0.004) (0.157 0.004) (0.079 0.100(0.004)Variable Dimensions — Millimeters (Inches)Tape SizePitchB1 MaximumNote 48 mmSingle (4 mm)4.35(0.171)6.25(0.246)12 mmSingle (4 mm)and Double(8 mm)8.2(0.323)10.25(0.404)E2 MinimumFP13.5 0.052.0 0.05 or 4.0 0.10(0.138 0.002) (0.079 0.002 or 0.157 0.004)2.0 0.05 (0.079 0.002) or5.5 0.054.0 0.10 (0.157 0.004) or(0.217 0.002)8.0 0.10 (0.315 0.004)T2 Maximum W Maximum A0, B0 & K02.5(0.098)8.3(0.327)4.6(0.181)12.3(0.484)Note 51. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossmentlocation and hole location shall be applied independent of each other.2. The tape, with or without components, shall pass around R without damage (see Figure 4).3. If S1 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481–D, paragraph 4.3, section b).4. B1 dimension is a reference dimension for tape feeder clearance only.5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that:(a) the component does not protrude above the top surface of the carrier tape.(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.(c) rotation of the component is limited to 20 maximum for 8 and 12 mm tapes (see Figure 2).(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 mm and 12 mm wide tape (see Figure 3).(e) see Addendum in EIA Standard 481–D for standards relating to more precise taping requirements. KEMET Electronics Corporation KEMET Tower One East Broward BoulevardFort Lauderdale, FL 33301 USA 954-766-2800 www.kemet.comT2014 T510 1/7/202111
Tantalum Surface Mount Capacitors – Low ESRT510 Multiple Anode MnO2Packaging Information Performance Notes1. Cover tape break force: 1.0 kg minimum.2. Cover tape peel strength: The total peel strength of the cover tape from the carrier tape shall be:Tape WidthPeel Strength8 mm0.1 to 1.0 newton (10 to 100 gf)12 mm0.1 to 1.3 newton (10 to 130 gf)The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be165 to 180 from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of300 10 mm/minute.3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIAStandards 556 and 624.Figure 2 – Maximum Component Rotation TMaximum Component RotationTop ViewMaximum Component RotationSide ViewTypical Pocket CenterlineTapeWidth (mm)8, 12BoMaximumRotation (20 T) sTapeMaximumWidth (mm) Rotation (8, 1220Typical Component Centerline S)AoFigure 3 – Maximum Lateral MovementFigure 4 – Bending Radius8 and 12 mm Tape0.5 mm maximum0.5 mm maximumEmbossedCarrierPunchedCarrierR KEMET Electronics Corporation KEMET Tower One East Broward BoulevardFort Lauderdale, FL 33301 USA 954-766-2800 www.kemet.comBendingRadiusRT2014 T510 1/7/202112
Tantalum Surface Mount Capacitors – Low ESRT510 Multiple Anode MnO2Figure 5 – Reel DimensionsFull Radius,See NoteW3(Includesflange distortionat outer edge)Access Hole atSlot Location(Ø 40 mm minimum)W2DA(See Note)NC(Arbor holediameter)B(see Note)(Measured at hub)W1(Measured at hub)If present,tape slot in corefor tape start:2.5 mm minimum width x10.0 mm minimum depthNote: Drive spokes optional; if used, dimensions B and D shall apply.Table 5 – Reel DimensionsMetric will governConstant Dimensions — Millimeters (Inches)Tape SizeAB MinimumCD Minimum8 mm178 0.20(7.008 0.008)or330 0.20(13.000 0.008)1.5(0.059)13.0 0.5/ 0.2(0.521 0.02/ 0.008)20.2(0.795)12 mmVariable Dimensions — Millimeters (Inches)Tape Size8 mm12 mmN MinimumW1W2 MaximumW350(1.969)8.4 1.5/ 0.0(0.331 0.059/ 0.0)12.4 2.0/ 0.0(0.488 0.078/ 0.0)14.4(0.567)18.4(0.724)Shall accommodate tapewidth without interference KEMET Electronics Corporation KEMET Tower One East Broward BoulevardFort Lauderdale, FL 33301 USA 954-766-2800 www.kemet.comT2014 T510 1/7/202113
Tantalum Surface Mount Capacitors – Low ESRT510 Multiple Anode MnO2Figure 6 – Tape Leader & Trailer DimensionsEmbossed CarrierCarrier TapePunched Carrier8 and 12 mm onlyENDRound Sprocket HolesSTARTTop Cover TapeElongated Sprocket Holes(32 mm tape and wider)Trailer160 mm minimumComponents100 mmminimum Leader400 mm minimumTop Cover TapeFigure 7 – Maximum CamberElongated Sprocket Holes(32 mm and wider tapes)Carrier TapeRound Sprocket Holes1 mm maximum, either directionStraight Edge250 mm KEMET Electronics Corporation KEMET Tower One East Broward BoulevardFort Lauderdale, FL 33301 USA 954-766-2800 www.kemet.comT2014 T510 1/7/202114
Tantalum Surface Mount Capacitors – Low ESRT510 Multiple Anode MnO2KEMET Electronics Corporation Sales OfficesFor a complete list of our global sales offices, please visit www.kemet.com/sales.DisclaimerAll product specifications, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible forchecking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information givenherein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for suchapplications, but are not intended to constitute – and KEMET specifically disclaims – any warranty concerning suitability for a specific customer application or use.The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Anytechnical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumesno obligation or liability for the advice given or results obtained.Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated componentfailures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards(such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injuryor property damage.Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that othermeasures may not be required.KEMET is a registered trademark of KEMET Electronics Corporation. KEMET Electronics Corporation KEMET Tower One East Broward BoulevardFort Lauderdale, FL 33301 USA 954-766-2800 www.kemet.comT2014 T510 1/7/202115
T2014_T510 1/7/2021 2 Fort Lauderdale, FL 33301 USA 954-766-2800 www.kemet.com Tantalum Surface Mount Capacitors - Low ESR T510 Multiple Anode MnO. 2. K-SIM. For a detailed analysis of specific part numbers, please visit ksim.kemet.com to access KEMET's K-SIM software. KEMET
