Transcription
Simulation and Design ofPrinted Circuit Boards UtilizingNovel Embedded CapacitanceMaterialApril 28, 2010Yu Xuequan, Yanhang, Zhang Gezi, Wang HaisanHuawei Technologies CO., LTD.Shanghai, ChinaTony yu@huawei.com1Yu Xuequan, Yan Hang, Zhang Gezi, Wang HaisanSimulation and Design of Printed Circuit Boards Utilizing NovelEmbedded Capacitance Material
Outline Embedded Capacitance Material Introduction Impedance Simulation Comparison for boards with ECM or FR-4Power/Ground Core Comparison of the power noise measurement In Board Interference Analysis for ECM and FR4 Board ECM Impact to Signal Integrity Board Level EMC Performance Comparison – Simulation Board Level EMC Performance Comparison – Test Result The Application Prospect of the Embedded Capacitance Materials Questions2Yu Xuequan, Yan Hang, Zhang Gezi, Wang HaisanSimulation and Design of Printed Circuit Boards Utilizing NovelEmbedded Capacitance Material
Embedded Capacitance Material Introduction Planar sandwich structure ECMHigher capacitance density than thincore FR4Higher decoupling bandwidth thandiscrete MLCC caps3M C-PLY1919um filled insulation 6nf/sq inch C/AElectrical parameters comparisonFR4 plate capacitance vs ECM (3M C-PLY19)Schematic illustration of 3M C-PLY19Frequency response comparison , MLCC vs ECMSchematic illustration of PCB plate capacitor3Yu Xuequan, Yan Hang, Zhang Gezi, Wang HaisanSimulation and Design of Printed Circuit Boards Utilizing NovelEmbedded Capacitance Material
Impedance Simulation Comparison for boards withECM or FR-4 Power/Ground Core Same board stack up and layoutOnly difference in Pwr/Gnd corematerialImpedance port set on sameposition in simulationMuch lower impedance of ECMfrom 10MHz 6GHz than FR4Much more resonance in FR4curve, higher impedance andpower noiseFR-4 PCB3M C-PLY19 PCBSample board Stack up4Impedance ComparisonBlue for ECMRed for thin core FR-4 plate capacitorYu Xuequan, Yan Hang, Zhang Gezi, Wang HaisanSimulation and Design of Printed Circuit Boards Utilizing NovelEmbedded Capacitance Material
-203M C-PLY19 (0.75mil)FR4 (3.54mil)-40dBm-60-80-100-120-140-160GHzPower ripple noise comparison in time domain Power noise frequency spectrum comparisonPower noise ripple of FR4 board is much higher than that of ECM board.ECM board shows superiority over FR4 on noise reduction in entire bandwidth10MHz-4GHz.ECM board noise close to white noise of Spectrum Analyzer in higher frequencyover 1.5GHz.Very promising for ECM to improve power supply quality, digital /analoginterference in board & board level EMI.5Yu Xuequan, Yan Hang, Zhang Gezi, Wang HaisanSimulation and Design of Printed Circuit Boards Utilizing NovelEmbedded Capacitance 91.030.770.650.520.390.260.1400.01Comparison of the power noise measurement
In Board Interference Analysis for ECM and FR4Board Port set on same connectorsposition on FR4 / ECM boardTransmission coefficient betweensame ports of ECM board is muchlower than that of FR4 boardECM board minimized risk forinterference from shared powerdistribution system within boardFR-4 PCB3M C-PLY19 PCBTransmission coefficient comparisonRed for FR4, Port1,2 ,Blue for ECM, Port3,46Yu Xuequan, Yan Hang, Zhang Gezi, Wang HaisanSimulation and Design of Printed Circuit Boards Utilizing NovelEmbedded Capacitance Material
In Board Interference Analysis for ECM and FR4BoardSimulation setup power noise distribution on FR-4boardpower noise distribution onECM boardSet noise source and noise probe on same position of FR4 / ECM boardSame noise source inputsmaller noise distribution area and lower noise amplitude on power planefor ECM board7Yu Xuequan, Yan Hang, Zhang Gezi, Wang HaisanSimulation and Design of Printed Circuit Boards Utilizing NovelEmbedded Capacitance Material
In Board Interference Analysis for ECM and FR4BoardSimulation setup 8Noise spectrum comparison on same probe positionSame noise source and probe setupSuperior noise spectrum of ECM board in all frequency rangeYu Xuequan, Yan Hang, Zhang Gezi, Wang HaisanSimulation and Design of Printed Circuit Boards Utilizing NovelEmbedded Capacitance Material
ECM Impact to Signal Integrity50MHz CLOCK 1255MHz CLOCKCIRCUIT AREA SIGNAL PROBE50MHz CLOCKCIRCUIT AREA Same functional circuit onthe board for FR4 andECM board50MHz & 125MHz clockon different zone but withsame power125M Clock as aggressor50M clock as victim to seeits signal wave andspectrum received50M clock on ECM boardless influenced by 125Mclock with better jitter andduty cycleComparison of the 50 MHz clocksignal measured waveComparison of the 50 MHz clock signalfrequency spectrums on ECM and FR4 board9Yu Xuequan, Yan Hang, Zhang Gezi, Wang HaisanSimulation and Design of Printed Circuit Boards Utilizing NovelEmbedded Capacitance Material
Board Level EMC Performance Comparison -SimulationEMI simulation result (3 Meter field )PCB FR4(3.54mil) PCB 3M C-PLY19(0.75mil)Free space field distribution10With same noise source excitation ,free space field and 3 Meter fieldresult of ECM board is lower thanthat of FR4 in all bandwidthsimulatedYu Xuequan, Yan Hang, Zhang Gezi, Wang HaisanSimulation and Design of Printed Circuit Boards Utilizing NovelEmbedded Capacitance Material
Board Level EMC Performance Comparison – TestResult703M C-PLY19 (0.75mil)FR4 (3.54mil)60dBuV/m5040302010Frequency (MHz)Radiated Emission Test Result （30MHz - 2GHz ） Radiated Emission Test in standard full wave darkwave for FR4/ECM board.Obvious better performance of ECM board from 30M to 2G ( only tested up to 2G)11Yu Xuequan, Yan Hang, Zhang Gezi, Wang HaisanSimulation and Design of Printed Circuit Boards Utilizing NovelEmbedded Capacitance 30Full Wave Darkroom1010
The Application Prospect of the EmbeddedCapacitance MaterialsDue to excellent performance of Embedded Capacitance Material in1.2.3.SI , PI , EMC, it will be well suitable for application in:Digital/analog Interference Design with Digital/analog Mixed BoardEMC Design of the Non-shielding Box-type Products with PlasticsshellPower Integrity and Signal Integrity Design of the High Speed andHigh Density Board12Yu Xuequan, Yan Hang, Zhang Gezi, Wang HaisanSimulation and Design of Printed Circuit Boards Utilizing NovelEmbedded Capacitance Material
Questions13Yu Xuequan, Yan Hang, Zhang Gezi, Wang HaisanSimulation and Design of Printed Circuit Boards Utilizing NovelEmbedded Capacitance Material
Power ripple noise comparison in time domain Power noise frequency spectrum comparison. Yu Xuequan, Yan Hang, Zhang Gezi, Wang Haisan Simulation and Design of Printed Circuit Boards Utilizing Novel . EMC Design of the Non-shielding Box-type Products with Plastics shell 3. Power Integrity and Signal Integrity Design of the High Speed and
