Transcription
Welcome to the EPTAC Webinar Series:IPC 2010 APEX Conferenceand IPC-A-610E, J-STD-001E,IPC-A-600HYou are connected to our live presentation delivered via the internet. The webinar will beginshortly.1
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IPC 2010 APEX -600H
APEX 2010 New Assembly and Joining Handbook –820, Committee 7-35 001 Training and reading levels OPEN and CLOSE Book tests Testing scores4
APEX 2010 610 Training Task Group Beta Class will be inJuneLooking to have 7 hour days with an extra houroption to make up for any delaysCIS programs will have the modulesrenumberedThe program will have both close and openbook testing segmentsExams will require a score of 70% for each test,open and closed book, with no averaging of thescores5
APEX 2010600 program in a nutshell Want to use more pictures in the exam Exam questions will be different fromCIT and CIS programs Looks like we will be using 6012 and6013 for the training program6
Careful of Your Certificate We have been made aware ofcounterfeit certificates Verify all your instructors are certified bychecking with the certification centerCheck the date, the certificate number andthe certification center7
610 Changes The inclusion of definition of wire overlap and overwrapin sections: 1.5.11 and 1.5.12 and Section 6Torque requirements added to section 4 HardwareConnectors section moved to section 9.8Added Sect 4.2 Jack Post MountingModified press fit pin section 4.3.28
610 ChangesAdded the following: 4.5.1 Wire routing, added defective conditions for wire damage 4.5.2 Table 4-1 for violation of minimum bend radius Section 5.0 Soldering, new verbiage on lead-free solders 5.2.7.1 Soldering Anomalies, additional criteria on acceptanceof solder balls 5.2.7.3 Excess solder, reworded and inserted criteria to inspectwithout magnification 5.2.11 Information on definition of Lead-Free fillet lift9
610 – 6.2.4 Criteria added Burnt shrink sleeve information added tosection.10
610 Changes New sections 7.1.8.1 and 7.1.8.2 Connector MountingModified 7.2.2.1. Adhesive bondingModified 7.3.5.1 new criteria for vertical fill of platedthrough holes for Class 2 productsModified 7.3.5.9, Lead trimming that cuts into the solderfillet must be reflowedNew criteria 7.3.5.12 Board in Board for Class 1 and 211
IPC-A-610, New Item –Board inserted into slots12
610 Changes This page 8-25 is wrong,the Table 8-2 is correct,dimension “J” endoverlap is required, itdoes not have tolerancesincluded13
610 Changes14
610 Changes Section 8.3.12.3 Surface Mount Area Array,added criteria for head in pillow criteria.15
610 Changes New section 8.3.12.6 Surface Mount AreaArray, - Package on Package This is a stack up of BGA types of packagesNew Section 8.3.15 Flattened PostConnections, Round Solder Land Criteria for Class 3 has not been established for thisdevice, so only requirements are for Class 1 and 216
Highlights of 001 Changes Alloy composition to table 3-1Reorganization of paragraphsIntroduction the term Overlap and OverwrapDocument flowdown related to COTS -1.9Added moisture sensitive and process sensitive componentusage – 3.8Changed gold removal process - 4.5.1Added heat shrinkable soldering devices - 4.19Updated wire and cable preparation -5.1.1Updated wire wrap tables – Table 5.3Plus many editorial and format changes17
Couple of 001 Picture Changes Now acceptable wire wrap criteria18
001 Changes No more text boxes19
001 Changes New:Table 3-1 Maximum Limits of Solder Bath Contaminant toaccommodate the new lead-free soldersSection 4.19 Heat Shrinkable Soldering DevicesInformation on assembling and soldering wires toterminals related to overlap and overwrapSMT tables as discussed earlier in the 610 documentTable 7-19 Flatten Post ConnectionsSection 10.3 Staking (Adhesives)20
A-600 Additions 2.5.6 Cap Plating21
A-600 Additions 2.5.6 Cap Plating22
2.9.7 Tenting of Via Holes Clarification of terms.23
Added Section 2.10.1.3Conductor Thickness24
2.10.2 Better explanation ofannular ring25
2.10.3 External Annular Ring26
3.3.9 Copper Wrap Plating27
3.3.9 Copper Wrap Plating28
3.3.9 Copper Wrap PlatingCriteria29
3.3.17 Cap Plating of Filled HolesTargetAcceptableNonconforming30
When Is Training Coming? Documents for 001 should be out byJune 2010 Documents for 610 should be by July Documents for 600 should be by July/August timeframe31
Changes in SpecificationsProgram Keep watching our web sitewww.eptac.com and EPTAC solder tipsfor the coming events on the total reviewof the documents and their changes.32
Thank you33
Questions?34
Further InformationFor questions regarding this webinar,please contact Leo Lambert atleo@eptac.comFor information on any of EPTAC’s or IPC’sCertification Courses, please visit ourwebsite at http://www.eptac.com35
J-STD-001E IPC-A-600H . 4 APEX 2010 New Assembly and Joining Handbook – 820, Committee 7-35 001 Training and reading levels OPEN and CLOSE Book tests Testing scores . 5 APEX 2010 610 Training Task Group Beta Class will be i
