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ELECTRONICS ASSEMBLYELECTRONICS ASSEMBLYIPC-C-103Electronics Assembly StandardsCollection — includes 47 documentsGet the reference documents you need on all aspectsof electronics assembly, from solder materials,component characteristics, manufacturing and qualityrequirements to acceptability of the final assembly.The collection includes 47 key documents for SMTand through hole assembly, including the widely usedIPC-A-610, J-STD-001 and IPC-A-620. Visit the onlinestore for a complete list of included documents.Format: HIPC-C-108Cleaning Guides and HandbooksCollection — includes 11 documentsThis complete set of 11 documents includes thelatest editions of every IPC cleaning guide andhandbook. It is an invaluable tool for manufacturingengineers making decisions on cleaning productsand processes. Also provides guidance fortroubleshooting. Visit the online store for a completelist of included documents.Format: HACCEPTABILITYIPC-J-STD-001ERequirements for Soldered Electrical andElectronic AssembliesIPC-J-STD-001E is recognized worldwideas the sole industry-consensus standardcovering soldering assembly materialand process requirements. This revision includessupport for lead-free manufacturing, in addition toeasier to understand criteria for materials, methodsand verification for producing quality solderedinterconnections and assemblies. The requirementsfor all three classes of acceptance are included.Full-color illustrations are provided for clarity. Thisstandard fully complements IPC-A-610E. 54 pages.Released April 2010. Languages: English, Chinese,Danish, French, German, Hungarian, Polish,Romanian, Russian, Spanish, Swedish and Turkish.Formats: H, C, D, K, S, GCertification is available for J-STD-001E.Visit www.ipc.org/certification for details.4IPC-A-610EAcceptability of Electronic AssembliesValuable for inspectors, operators andtrainers, IPC-A-610 is the most widelyused electronics assembly standard inthe world. A must for all quality assurance andassembly departments, IPC-A-610E illustratesindustry-accepted workmanship criteria forelectronics assemblies through 809 full-colorphotographs and illustrations. Topics include flexattachment; board in board; part on part; lead free;component orientation and soldering criteria forthrough hole, SMT (new termination styles) anddiscrete wiring assemblies; mechanical assembly;cleaning; marking; coating; and laminaterequirements. Critically reviewed for clarity andaccuracy, the document synchronizes to therequirements expressed in other industry consensusdocuments and is used with the material and processstandard IPC J-STD-001. 400 pages. Released April2010. Languages: English, Chinese, Czech, Danish,Dutch, French, German, Hebrew, Hindi, Hungarian,Italian, Japanese, Korean, Polish, Romanian, Russian,Spanish, Swedish Turkish and Vietnamese.Formats: H, C, D, K, S, GCertification on IPC-A-610E is available. Visitwww.ipc.org/certification for details.NEW! IPC/WHMA-A-620BRequirements and Acceptance for Cableand Wire Harness AssembliesIPC and the Wire Harness Manufacturers Association(WHMA) developed this significant update, whichremains the only industry-consensus standardaddressing requirements and acceptance of cableand wire harness assemblies. This revision has 682full-color pictures and illustrations, of which 125are new or updated. Included in the 19 chapters arecriteria for wire prep, soldering to terminals, crimpingof stamped and formed contacts and machinedcontacts, insulation displacement connectors,ultrasonic welding, splicing, connectors, molding,marking, coax/biax cables, wrapping/lacing,shielding, assembly and wire-wrap terminations. 400pages. Released October 2012. Languages: English,Chinese, Danish, French, German, Hungarian andSpanish.Formats: H, C, D, K, S, GNEW! IPC-A-630Acceptability Standard for Manufacture,Inspection and Testing of ElectronicEnclosuresThis standard is the first of its kind for IPC; the firstacceptability standard for electronic enclosures. Itcontains acceptability criteria that pertain to the “boxbuild” of the assembly process. This standard hasbeen written to direct manufacturers and end usersof electronic enclosures of electrical and electronicequipment to understand the best practices to meetrequirements, ensuring the reliability and function ofthe end-item assembly for its intended design life. 30pages. Released September 2013.Formats: H, C, D, K, S, GCOMING SOON! IPC-HDBK-630Acceptability Standard for Manufacture,Inspection and Testing of ElectronicEnclosures HandbookFormat: HADVANCED TECHNOLOGIESIPC-7093Design and Assembly ProcessImplementation for Bottom TerminationComponentsDescribes the design and assembly challenges forimplementing bottom termination components (BTCs)whose external connections consist of metallizedterminals that are an integral part of the componentbody. The BTCs in this document include all typesand forms of bottom-only termination componentsintended for surface mounting. This includes industrydescriptive nomenclature such as QFN, DFN, SON,LGA, MLP and MLF. The focus of the information ison critical design, assembly, inspection, repair andreliability issues associated with BTCs. 68 pages.Released March 2011. Languages: English andGerman.Formats: H, C, D, K, S, GIPC-7094Design and Assembly ProcessImplementation for Flip Chip and Die SizeComponentsDelivers useful and practical information forproducts that employ the very complex and highdensity methods needed for flip-chip technology.The major emphasis of the new standard is toprovide information on system-level issues, flip-chipand die-size assembly and the requirements forboard and module-level reliability. In addition toproviding guidelines for flip-chip inspection, IPC-7094addresses the design of the initial element and howthe die can be evaluated during its developmentprocess with a goal toward simplification of the finalassembly. The standard also covers outsourcingmanufacturing and the procurement of known gooddie to optimize the return on investment whendeveloping products that use flip-chip technology. 75pages. Released February 2009.Formats: H, C, D, K, S, GFORMAT TYPES: H – Hard Copy C – CD-ROM D – Download K – Kit S – Site License G – Global License

www.ipc.org/onlinestoreNEW! IPC-7095CDesign and Assembly ProcessImplementation for BGAsIPC/EIA J-STD-032Performance Standard for BallGrid Array BallsImplementing ball grid array (BGA) and fine-pitch ballgrid array (FBGA) technology presents some uniquechallenges for design, assembly, inspection andrepair personnel. The major emphasis of RevisionC is on some of the new mechanical failure issuessuch as cratering or laminate defects caused afterassembly. In addition to providing guidelines forBGA inspection and repair, IPC-7095C addressesreliability issues and the use of lead-free joint criteriaassociated with BGAs. There are many photographsof X-ray and endoscope illustrations to identify someof the conditions that the industry is experiencing inthe implementation of BGA assembly processes. 165pages. Released January 2013.Formats: H, C, D, K, S, GDeveloped by IPC and EIA. 10 pages. Released June2002.Formats: H, C, D, S, GIPC-MC-790Guidelines for Multichip ModuleTechnology Utilization120 pages. Released 1992.Formats: H, C, D, S, GCLEANINGNEW! IPC-5703Cleanliness Guidelines for PrintedBoard FabricatorsPrinted board cleanliness has historically beenan unknown factor in the quality assessment ofunpopulated (bare) printed boards; this has oftenbeen attributed to a lack of understanding ofmaterials and processes. This document addressesthe various printed board fabrication processes andhow each may impact, directly or indirectly, the finalcleanliness of packaged bare printed boards andultimately printed board quality. 30 pages. ReleasedMay 2013.Formats: H, C, D, K, S, G37 pages. Released November 1990.Formats: H, C, D, S, GIPC/EIA J-STD-026Semiconductor Design Standard for FlipChip ApplicationsIPC J-STD-027Mechanical Outline Standard for FlipChip and Chip Size Configurations13 pages. Released February 2003Formats: H, C, D, S, GIPC/EIA J-STD-028Performance Standard for Construction ofFlip Chip and Chip Scale BumpsDeveloped by IPC and EIA. 36 pages. ReleasedAugust 1999.Formats: H, C, D, S, G14 pages. Released 1997.Format: HIPC-9201ASurface Insulation Resistance HandbookSurface insulation resistance (SIR) testing is a toolnot only for characterization testing of productionprocesses (such as solder masks, soldering fluxand conformal coatings), but also for examiningthe electrochemical reactions at each stage ofthe electronics assembly production process. Thishandbook covers the terminology, theories, testprocedures and test vehicles of SIR testing, includingtemperature-humidity (TH) and temperaturehumidity-bias (THB). Discussions on failure modesand troubleshooting are also included. Revision Asignificantly expands on the discussion of availableindustry test vehicles for SIR as well as test chamberset-up. 86 pages. Released August 2007.Formats: H, C, D, K, S, GIPC-9202Material and Process Characterization/Qualification Test Protocol for AssessingElectrochemical PerformanceThis document provides tests that record changes insurface insulation resistance (SIR) on a representativesample of a printed circuit assembly. It quantifies anydeleterious effects that might arise from solder fluxor other process residues left on external surfacesafter soldering, including unwanted electrochemicalreactions that grossly affect reliability. It uses testvehicles that are intended to be representative ofthe electronic circuits that are in production andis a test yielding both quantitative and qualitativedata. This test may be used for process qualification,demonstrating that a proposed manufacturingprocess or process change can produce hardwarewith acceptable end-item performance related tocleanliness. This test may also be used for processcharacterizations, including development of newprocesses or improvements to an existing process. 11pages. Released October 2011.Formats: H, C, D, K, S, GIPC-SM-784Guidelines for Chip-on-Board TechnologyImplementationDeveloped by IPC and EIA. 43 pages. ReleasedAugust 1999.Formats: H, C, D, S, GIPC-TR-476AElectrochemical Migration: ElectricallyInduced Failures in Printed WiringAssembliesIPC-CH-65BGuidelines for Cleaning of PrintedBoards and AssembliesUpdated for new technologies including lead-free,no-clean and environmentally friendly chemistries.This is a collection of information on electronic boardand assembly cleaning in a single document. Thismajor revision explains the relationship betweenmaterials, processes and contaminants in fabricationand assembly operations. It also addressescleanliness assessment and process control inrelation to cleanliness. Color pictures help withunderstanding. Supersedes IPC-CH-65A, IPC-SC-60A,IPC-SA-61A, IPC-AC-62A and IPC-SM-839. 200 pages.Released July 2011.Formats: H, C, D, K, S, GVisit the IPC online storefor current pricing.www.ipc.org/onlinestoreFORMAT TYPES: H – Hard Copy C – CD-ROM D – Download K – Kit S – Site License G – Global License5

ELECTRONICSELECTRONICS ASSEMBLYASSEMBLYIPC-9203Users Guide to IPC-9202 and the IPC-B-52Standard Test VehicleW

IPC-J-STD-001E Requirements for Soldered Electrical and Electronic Assemblies IPC-J-STD-001E is recognized worldwide as the sole industry-consensus standard covering soldering assembly material and process requirements. This revision includes support for lead-free manufacturing, in additio