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TABLE OF CONTENTSMessage from the Chairmen .2General Information.4Social Program .5IEEE SENSORS 2013 Committee .6IEEE SENSORS 2013 Track Chairs .7Asia/Oceania TPC .8Europe/Africa TPC .9The Americas TPC . 10IEEE Sensors Council Officials . 11Exhibitors. 15Industry Panel . 18Technical Program Information . 19Technical Program - Poster Information . 20Session Grid - Sunday, November 3rd . 21Session Grid - Monday, November 4th . 22Session Grid - Tuesday, November 5th. 23Session Grid - Wednesday, November 6th . 24Renaissance Baltimore Harborplace Floor Plan . 25Exhibitor Floor Plan . 26Monday Poster Session Floor Plan . 27Tuesday Poster Session Floor Plan . 29Wednesday Poster Session Floor Plan . 31Keynote Speakers . 33Sunday, November 3rd - Tutorials. 35Monday, November 4th . 38Monday, November 4th – Poster Session . 49Tuesday, November 5th . 66Tuesday, November 5th – Poster Session . 75Wednesday, November 6th . 93Wednesday, November 6th – Poster Session . 98Author Index . 1171
MESSAGE FROM THE CHAIRMENDear IEEE SENSORS 2013 participants,Welcome to Baltimore, Maryland, and to the 12th IEEE SENSORSconference. In addition to an outstanding technical program, aninformative tutorial session, and an exciting location, this year we aredelighted to present a special industrial panel and an open postersession. This conference promises to be one of the best, if not thebest to date.Consistent with the broad and multidisciplinary technical scope that theIEEE Sensors Council fosters, the IEEE SENSORS Conference strivesto offer attendees a wide array of technical subjects covering ninetopical areas: (1) Phenomena, Modeling and Evaluation, (2) Chemicaland Gas Sensors, (3) Biosensors, (4) Optical Sensors, (5) Mechanical,Magnetic, and Physical Sensors, (6) Sensor/Actuator Systems, (7)Sensor Networks, (8) Applications, and (9) Materials, Processes,Circuits, Signals, and Interfaces.This year, a total of 913 abstracts were submitted, including 48 latenews submissions. Of these, 236 will be presented in lecture sessionsand 256 in poster sessions. An additional 16 invited lecturepresentations and 22 open posters round out the program. It isimportant to note that the poster and lecture presentations haveundergone identical peer reviews. In which session a paper ispresented has no relationship to its quality; it depends only on wherethe paper best fits into the program. To stay relevant with rapidlyevolving commercial trends, this year the program also features aspecial Industry Panel Session on Tuesday, Nov. 5, to address anexciting and timely topic – Wearable Sensors: the Good, the Bad, andthe Alluring. Based on the pre-registrations, the attendance isexpected to be between 700 and 800.The highlights of this year’s social program will be the welcomereception and the banquet. The reception will be held on Sunday, Nov.3, at the Renaissance Harborplace Hotel on the 6th Floor with a viewof Baltimore harbor and Ft. McHenry, site of a pivotal Naval battleduring the War of 1812. The banquet will be held on Tuesday, Nov. 5,at the historic B&O Railroad Museum which is recognized universallyas the birthplace of American railroading (circa 1829).We wish to recognize and thank our outstanding Keynote Speakers:Professor Masayoshi Esashi of Tohoku University, Japan; ProfessorRobert Puers of Katholieke Universiteit Leuven, Belgium; and Dr.Kenneth S. Johnson, Senior Scientist at the Monterey Bay AquariumResearch Institute. We are also deeply grateful to our 16 invitedspeakers. We appreciate their expertise and willingness to share theirtime with us in Baltimore.2
The success of IEEE SENSORS 2013 is due to the dedication of anumber of volunteers. The Technical Program Committee (TPC)included 111 volunteers, to whom we are very grateful. Special thanksto Track Chairs Svetlana Tatic-Lucic and Srinivas Tadigadapa (Track1); Massood Atashbar and Ponnambalam Selvaganapathy (Track 2);Yu-Cheng Lin and Hongrui Jiang (Track 3); Ignacio Matias andXiaojing Zhang (Track 4); Kukjin Chun and David Elata (Track 5);Oliver Paul and Gijs Krijnen (Track 6); Thomas Newe (Track 7); DavidHorsley (Track 8), and Kenichi Takahata (Track 9) – their diligence andinsight were invaluable to the paper selection process. Special thanksalso to Tutorial Chair Massood Tabib-Azar; Industry Panel OrganizersAndrew DeHennis, Brain Jamieson, and Andy Oliver; Industrial Panelpublicist Walt Besio; Open Poster Chair Troy Nagle (who contributedtirelessly in many other roles as well); Publicity Chair Eddie Grant; andConference Treasurer Mike McShane.We also wish to thank the professional conference organizers ofConference Catalysts, LLC, under the leadership of Chris Dyer. Chris,Judy Scharmann and the rest of their team played a vital role inorganizing this conference.The locations of IEEE SENSORS conferences rotate each year;Asia/Pacific to Europe/Africa to the Americas. Next year, IEEESENSORS 2014 will be held in Valencia, Spain, Nov. 2-5, 2014. Wehope to see you there.IEEE sponsored or cosponsored more than 1000 conferences, andpublished more than 100 journals last year. The successes of IEEEare due to the more than 200,000 volunteers who serve IEEE eachyear.Robert TrewGeneral Co-ChairElliott BrownGeneral Co-ChairYogesh GianchandaniTechnical Program Chair3
GENERAL INFORMATIONRegistration & Information DeskThe Registration and Information Desk will be open during thefollowing times:Sunday, November 3Monday, November 4Tuesday, November 5Wednesday, November 67 AM - 5:30 PM7 AM - 5 PM7 AM - 5 PM7 AM - 5 PMMeeting Room LocationsConcurrent Sessions A: Maryland Salon FConcurrent Sessions B: Maryland Salon EConcurrent Sessions C: Maryland Salon AConcurrent Sessions D: Maryland Salon DConcurrent Sessions E: Watertable ABCConcurrent Sessions F: HomelandPoster Sessions: Baltimore ABName BadgesAll attendees must wear their name badges at all times to gainadmission to all Conference events.Electronic ProceedingsOne copy of the Electronic Proceedings will be provided to you on aflash drive. Additional copies may be purchased at the ConferenceRegistration Desk. The purchase price of the Electronic Proceedingswill increase after the Conference, so be sure to order your additionalcopies in advance.Additional Electronic Proceedings: 85 USD IEEE MemberAdditional Electronic Proceedings: 100 USD Non MemberMessage and Job Market BoardThe Message and Job Market Board will be located near theConference Registration Desk. Posting is allowed by job seekers.Recruiters are not allowed to post.Conference AttireAttire during the duration of the Conference is business casual.Traveler’s Checks and Credit CardsCredit cards, including MasterCard , Visa and American Express ,and traveler’s checks are accepted at most hotels, restaurants, andsouvenir shops.Tipping StandardsTipping of 15% is standard for good service and 20% for outstandingservice.SmokingAll meeting rooms and seated functions are smoke free. Please adhereto the smoking policy of the Renaissance Baltimore Harborplace Hotel.Cellular PhonesAs a courtesy to your fellow attendees, please turn off your cell phoneringer during the conference4
SOCIAL PROGRAMSunday, November 3Event: Tutorial LunchTime: 12:00 PM - 1:30 PMLocation: Baltimore ABLunch Speaker: Dr. Steven LeBoeuf, Valencell, Inc.“Starting a Medical Monitoring Company from Scratch”Event: Welcome ReceptionTime: 6:30 PM - 8:30 PMLocation: Maryland/Baltimore FoyerJoin us for the Welcome Reception on Sunday, November 3, 2013 atthe Renaissance Harborplace Hotel on the 6th Floor. Cocktails andhors d'oeuvres will served beginning at 6:30 p.m., with WelcomeRemarks at 7:00 p.m.Monday, November 4Event: Conference LunchTime: 12:45 PM - 2:15 PMLocation: Maryland Salon BCTuesday, November 5Event: Industry Panel LunchTime: 12:00 PM – 2:00 PMLocation: Maryland Salon BCEvent: Conference DinnerTime: 7:00 PM – 10:00 PMLocation: B&O Railroad MuseumOur Conference Gala dinner will be held at The Historic B&O RailroadMuseum. Located among Baltimore City's historic southwestneighborhoods, at the original site of the historic Mt. Clare Shops, theB&O Railroad Museum is recognized universally as the birthplace ofAmerican railroading. There will be pre-dinner cocktails served as youwill have the chance to tour the museum and rail cars. Dinner willfollow and you will be treated to the world-class Wayne Goins JazzTrio, throughout the night!Transportation will be provided. The first departing bus will leave at 6PM to take attendees to the B&O Railroad Museum from in front of theconference hotel. Busses will take attendees back to the conferencehotel starting at 9 PM.Your paid registration fee includes one banquet ticket. Guest ticketscan be purchased for 65.00 USD each at the Registration Desk.Wednesday, November 6Event: Conference Awards LunchTime: 12:15 PM – 2:00 PMLocation: Maryland Salon BC5
IEEE SENSORS 2013 COMMITTEEGeneral Co-ChairsRobert Trew, North Carolina State University, USAElliott Brown, Wright State University, USATechnical Program ChairYogesh Gianchandani, University of Michigan, Ann Arbor, USATutorial ChairMassood Tabib-Azar, NSF, USAPublicity ChairEddie Grant, North Carolina State University, USATreasurerMike McShane, Texas A&M University, USAIndustry Panel ModeratorsAndrew DeHennis, Sensors for Medicine and Science, Inc., USABrian Jamieson, Scientific & Biomedical Microsystems, USAIndustry SubcommitteeAndrew DeHennis, Sensors for Medicine and Science, Inc., USABrian Jamieson, Scientific & Biomedical Microsystems, USAYogesh Gianchandani, University of Michigan, Ann Arbor, USAAndy Oliver, University of Michigan, Ann Arbor, USAWalt Besio, University of Rhode Island, USATroy Nagle, North Carolina State University, USAElliott Brown, Wright State University, USA6
IEEE SENSORS 2013 TRACK CHAIRSTrack 1 – Phenomena, Modeling and EvaluationSrinivas Tadigadapa, Penn State University, USASvetlana Tatic-Lucic, Lehigh University, USATrack 2 – Chemical and Gas SensorsMassood Atashbar, Western Michigan University, USAPonnambalam Ravi Selvaganapathy, McMaster University, USATrack 3 – BiosensorsYu-Cheng Lin, National Cheng Kung University, TaiwanHongrui Jiang, University of Wisconsin, Madison, USATrack 4 – Optical SensorsIgnacio R. Matias, Universidad Publica de Navarra, SpainXiaojing (John) Zhang, University of Texas at Austin, USATrack 5 – Mechanical, Magnetic, and PhysicalSensorsKukjin Chun, Seoul National University, KoreaDavid Elata, Technion – Israel Institute of Technology, IsraelTrack 6 – Sensor/Actuator SystemsOliver Paul, IMTEK, University of Freiburg, GermanyGijs Krijnen, MESA Research Institute for Nanotechnology, Universityof Twente, NetherlandsTrack 7 – Sensor NetworksThomas Newe, University of Limerick, IrelandTrack 8 – ApplicationsDavid A. Horsley, University of California, Davis, USATrack 9 – Other Sensor Topics – Materials,Processes, Circuits, Signals & Interfaces, etcKenichi Takahata, University of British Columbia, Canada7
ASIA/OCEANIA TPCTakashi Abe, Nigata University, JapanJong‐Uk Bu, Senplus Inc., South KoreaHyung-Gi Byun, Kangwon National University, South KoreaChia‐Tai Chan, National Yang‐Ming University, TaiwanYu‐Ting Cheng, National Chiao Tung University, TaiwanYoung‐Ho Cho, KAIST, Daejeon, South KoreaKukjin Chun, Seoul National University, South KoreaWan-Young Chung, Pukyong National University, South KoreaGolla Eranna, Central Electronics Engineering Research Institute, IndiaI‐Yu Huang, National Sun Yat‐sen University, TaiwanQing‐An Huang, Southeast University, ChinaKourosh Kalantar-Zadeh, RMIT University, AustraliaSeong Ho Kong, Kyungpook National University, South KoreaDong‐Weon Lee, Chonnam National University, South KoreaDae‐Sik Lee, ETRI, South KoreaChengkuo Lee, National University of Singapore, SingaporeXin Xin Li, Shanghai Institute of Microsystem and InformationTechnology, ChinaZhihong Li, Peking University, ChinaSheng‐Shian Li, National Tsing Hua University, TaiwanGeunbae Lim, Pohang University of Science and Technology,South KoreaYu-Cheng Lin, National Cheng Kung University, TaiwanMichael, Shiang‐Cheng Lu, National Tsing Hua University, TaiwanYoshinori Matsumoto, Keio University, JapanKazusuke Maenaka, University of Hyogo, JapanJianmin Miao, Nanyang Technological University, SingaporeKohji Mitsubayashi, Tokyo Medical and Dental University, JapanMohamed Sultan Mohamed Ali, Universiti Teknologi Malaysia,MalaysiaYuji Murakami, Toyahashi University of Technology, JapanYutaka Nonomura, Toyota Central R&D Labs, JapanKonandur Rajanna, Indian institute of Science, IndiaWen‐Pin Shih, National Taiwan University, TaiwanMitsuhiro Shikida, Nagoya University, JapanDaoheng Sun, Xiamen University, ChinaHidekuni Takao, Kagawa University, JapanAdisorn Tuantranont, National Electronics and Computer TechnologyCenter, ThailandZheyao Wang, Tsinghua University, ChinaYuelin Wang, Shanghai Institute of Microsystem and IT, CAS, ChinaWeizheng Yuan, Polytechnical University, China8
EUROPE/AFRICA TPCBassam Alfeeli, Kuwait Institute for Scientific Research, KuwaitFrancisco J. Arregui, University Publica de Navarra, SpainJosé Manuel Baptista, University of Madeira, Funchal, PortugalGiuseppe Barillaro, University of Pisa, ItalyDanick Briand, EPFL, SwitzerlandDavid Boyle, Imperial College London, UKVictor Cionca, Tyndall National Institute, IrelandOlga Conde, University of Cantabria, SpainLucia Curri, CNR IPCF Italian National Research Council Istituto per IProcessi Chimico Fisici, ItalyAndrea Cusano, Optoelectronic Group University of Sannio, ItalyDavid Elata, Technion - Israel Institute of Technology, IsraelVittorio Ferrari, University of Brescia, ItalyPaddy French, TU Delft,, The NetherlandsMikael Gidlund, ABB Corporate Research, SwedenLuc Hebrard, University of Strasbourg, FranceStephen James, Cranfield University, United KingdomJurgen Kosel, King Abdullah University of Science and Technology,Saudi ArabiaMichael Kraft, University of Duisburg‐Essen, GermanyGijs Krijnen, MESA Research Institute for nanotechnology, Universityof Twente, Enschede, The NetherlandsHaluk Kulah, METU, TurkeyDirk Lehmhus, University of Bremen, GermanyElfed Lewis, University of Limerich, IrelandIgnacio R. Matias, Universidad Publica de Navarra, SpainFrancesc Murano‐Perez, IMB‐CNM, SpainThomas Newe, University of Limerick, IrelandPatricia Nieva, University of Waterloo, CanadaOliver Paul, IMTEK, University of Freiburg, GermanyMichiel AP Pertijs, Delft University of Technology, The NetherlandsMarco Petrovich, University of Southhampton, United KingdomPatrick Pons, LAAS‐CNRS, FranceJoannis Raptis, NCSR 'Demokritos', GreeceLibor Rufer, University of Grenoble, FrancePatrick Ruther, University of Freiburg, GermanyJosé Luis Santos, University of Porto, PortugalUlrich Schmid, Vienna University of Technology, AustriaHarrie A. Tilmans, IMEC, BelgiumDeepak Uttamchandani, University of Strathclyde, United KingdomGuillermo Villanueva, EPFL, Switzerland9
THE AMERICAS TPCMassood Atashbar, Western Michigan University, USAGaurav Bahl, University of Illinois at Urbana‐Champaign, USAAlper Bozkurt, North Carolina State University, USAOliver Brand, Georgia Institute of Technology, USAVictor Bright, University of Colorado, USAElliott Brown, Wright State University, USAVenkata Chivukula, RF Micro Devices, USAGeoffrey Cranch, Naval Research Laboratory, USAShawn Cunningham, Wispry, USAJose Mireles Garcia, Universidad Autonoma de Ciudad Juarex, USAYogesh Gianchandani, Univeristy of Michigan, Ann Arbor, USAJoan Hoffmann, Johns Hopkins University, USADavid Horsley, UC Davis, USAJun (Tony) Huang, The Pennsylvania State University, USAEugene Hwang, Analog Devices, Inc., USAHongrui Jiang, University of Wisconsin, Madison, USAEric Johnson, Clemson University, USAGoutam Koley, University of South Carolina, USAJeong Bong Lee, UT Dallas, University of Texas at Dallas, USATao Li, University of Michigan, Ann Arbor, USAMichel Maharbiz, UC Berkeley, University of California, Berkeley, USAShamus McNamara, University of Louisville, USAChristopher Meyer, US Army Research Laboratory, USATamal Mukherjee, Carnegie Mellon University, USATingrui Pan, University of California, USASiavash Pourkamali, University of Texas at Dallas, USAMarcel Pruessner, Naval Research Laboratory, USALong Que, Louisiana Tech University, USAMina Rais‐Zadeh, University of Michigan, Ann Arbor, USAChristopher Salthouse, University of Massachusetts, USAPonnambalam Ravi Selvaganapathy, McMaster University, CanadaLeyla Soleymani, McMaster University, CanadaSrinivas Tadigadapa, Penn State University, USAKenichi Takahata, University of British Columbia, CanadaSvetlana Tatic-Lucic, Lehigh University, USAHuikai Xie, University of Florida, USAYong Xu, Wayne State University, USAEH Yang, Stevens Institute of Technology, USAHong Yu, Arizona State University, USAMona Zaghloul, The George Washington University, USAXin Zhang, Boston University, USAXiaojing (John) Zhang, The University of Texas at Austin, USAChristian Zorman, Case Western Reserve University, USABabak Ziaie, Purdue University, USA10
IEEE SENSORS COUNCIL OFFICIALSExCOM & AdCOMPresident (2012-2013)Vladimir Lumelsky, NASA – University of Wisconsin - Madison, USAPresident Elect (2012-2013)H. Troy Nagle, North Carolina State University, USAPast-President (Immediate)Christina M. Schober, Honeywell, Inc., USAPast-Past-PresidentMona E. Zaghloul, George Washington University, USAVice President - Finances (2013-2014)Mike McShane, Texas A&M University, USAVice President - Publications (2013-2014)John Vig, Consultant, USAVice President - Conferences (2012-2013)Michael Shur, Rensselaer Polytechnic Institute, USAVice President - Technical Operations (2012-2013)Tom Wiener, The Forté Consultancy, USASecretary - Treasurer (2013)David Horsley, University of California, Davis, USAIEEE Sensors Journal Editor-In-Chief (2012-2014)Krikor B. Ozanyan, University of Manchester, UKMember-at-Large (2012-2013)Elfed Lewis, University of Limerick, IrelandMember-at-Large (2012-2013)Paul C. P. Chao, National Chiao Tung University, TaiwanMember-at-Large (2013-2014)Hulya Kirkici, Auburn University, USAMember-at-Large (2013-2014)Anil K. Roy, DA-IICT, IndiaGOLD Committee Chair (2013)Venkata Chivukula, Intel Corporation, USAPublicity Chair (2013)Edward Grant, North Carolina State University, USAWeb EIC (2013)John Vig, Consultant, USAWeb Based Newsletter Editor-in-Chief (2013)M. Nurul Abedin, NASA – Langley Research Center, USA11
IEEE SENSORS COUNCIL OFFICIALSIEEE Fellows Committee Chair (2013)Michael Shur, Rensselaer Polytechnic Institute, USADistinguished Lecturer Program Chair (2013)Tom Wiener, The Forté Consultancy, USAAwards Chair (2013)H. Troy Nagle, North Carolina State University, USANominations Committee Chair (2013)Christina M. Schober, Honeywell, Inc., USAPast PresidentsPast-President (2010-2011)Christina M. Schober, Honeywell, Inc., USAPast-President (2008-2009)Mona E. Zaghloul, George Washington University, USAPast-President (2006-2007)Robert T. Bannon, Bannon International Consulting LLC, USAPast President (2004-2005)Tom Wiener, The Forté Consultancy, USAPast President (2002-2003)Franco Maloberti, University of Texas, Dallas, USAFounding President (2000-2001)John Vig, Consultant, USAMember Societies and their AdCom AppointeesAerospace and Electronic SystemsMichael C. Wicks, Air Force Research Laboratory, USAAntennas and PropagationAmir Zaghloul, Virginia Tech, USABroadcast TechnologyJin Zhang, Mitsubishi Electric Research Laboratories, USACircuit and SystemsSandro Carrara, École Polytechnique Fédérale de Lausanne,SwitzerlandCommunicationsKiseon Kim, GIST, KoreaComputerKathy Land, Missile Defense Agency, USAComponents, Packaging and Manufacturing TechnologyTolga Tekin, Technical University of Berlin, Germany12
IEEE SENSORS COUNCIL OFFICIALSDielectrics and Electrical InsulationGreg Stone, IRIS Power, CanadaElectromagnetic CompatibilityJohn Norgard, NASA/JSC, USAElectron DevicesAmit Lal, Cornell University, USAEngineering in Medicine and BiologyWalt Besio, University of Rhode Island, USAIndustrial ElectronicsThilo Sauter, Austrian Academy of Sciences, AustriaIndustry ApplicationsRobert D. Lorenz, University of Wisconsin-Madison, USAInstrumentation and MeasurementGeorg Brasseur, Graz University of Technology, AustriaMagneticsPavel Ripka, Czech Technical University in Prague, Czech RepublicMicrowave Theory and TechniquesReynold S. Kagiwada, Northrup Grumman, USANuclear and Plasma SciencesVacantOceanic EngineeringRobert T. Bannon, Bannon International Consulting, USAPhotonicsRobert Dahlgren, San Jose State University, USAPower and EnergyArun G. Phadke, Virginia Tech, USARobotics and AutomationCecilia Laschi, Scuola Superiore Sant'Anna, ItalySignal ProcessingRandolf Moses, Ohio State University, USASolid State CircuitsDarrin Young, University of Utah, USAUltrasonics, Ferroelectrics, and Frequency ControlVenkat R. Bhethanabotla, University of South Florida, USAVehicular TechnologyFabrice Labeau, McGill University, Canada13
IEEE SENSORS COUNCIL OFFICIALSCouncil SupportExecutive AssistantJudy Scharmann, Conference Catalysts, LLC, USAConference Management CompanyConference Catalysts, LLC, USAWebmasterAnil K. Roy, DA-IICT, IndiaTechnical Program Papers SupportTom Wehner, Alliance Management, USAIEEE SENSORS 2014 Conference ChairsGeneral ChairCàndid Reig, University of Valencia, SpainGeneral Co-ChairLina Sarro,TUDelft, The NetherlandsTechnical Program ChairIgnacio R. Matias, Public University of Navarra, Spain14
EXHIBITORSASSISTThe NSF sponsored Center forAdvanced Self-Powered Systems ofIntegrated Sensors and Technologies(ASSIST) is developing nano-enabledenergy harvesting and storage, ultralow power electronics, radios andsensors to create innovative battery-free, body-powered, and wearablehealth and environment monitoring systems. ASSIST devices willmonitor individual health parameters and personal environmentalexposures. Long-term sensing will enable patients, doctors, andscientists to make direct correlations between health andenvironmental toxins leading to chronic disease prediction,management and treatment. ASSIST advances will accelerateenvironmental health research and clinical trials as well as informenvironmental policy.CST of America, Inc.Better Sensor through Simulation! CST EMSTUDIO is a 3D electromagnetic simulationsoftware that can help engineers to design andoptimize sensors, coils, magnets, actuators,shielding, biomedical devices, magneticrecording, induction heating and ent robust solving technology andallow many operating conditions to beassessed. Outputs include electric andmagnetic field and current distribution, force,torque, inductance, capacitance, flux linkage, heating and mechanicaldeformation.GaTech – Institute for Electronics and NanotechnologyGaTech – Institute for Electronics and Nanotechnology (lEN) iscomprised of multiple Electronics and Nanotechnology ResearchCenters, each offering a unique intellectual focus ranging from basicdiscovery and innovation to systems realization. lEN providesadvanced Nano, Micro, and Bio Laboratories valued in excess of 400M, with dedicated process and tool support expertise. Theseopen-user, fee based laboratories are available to global academic,industry, and government clientele, offering a unique andcomprehensive laboratory and teaming environment. The exhibit boothwill provide information and consultation related to the resourcesavailable at IEN to the researchers both from Industry and academia.15
IEEE GOLDIEEE Graduates of the Last Decade (GOLD) isa vibrant community of engineers, tion across the globe andthroughout IEEE societies. It is a membershipprogram to help students transition to youngprofessionalswithinthelargerIEEEcommunity. IEEE young professionals areautomatically added to the GOLD membercommunity as they graduate.IEEE SENSORS CouncilThe IEEE Sensors Council's purpose is toadvance and coordinate work in the field ofsensors carried out throughout the IEEE. TheCouncil sponsors the annual IEEE SensorsConference is responsible for the publicationof the IEEE Sensors Journal. The Council'sofficial field of interest is the theory, design,fabrication, manufacturing and application of devices for sensing andtransducing physical, chemical, and biological phenomena, withemphasis on the electronics, physics and reliability aspects of sensorsand integrated sensor-actuators. More information about the SensorsCouncil is available at www.ieee-sensors.orgMeasurement Science and Technology chnology publishes articles onnew measurement techniques and associated instrumentation. Papersthat describe experiments must represent an advance in measurementscience or measurement technique rather than the application ofestablished experimental technique. Authors must make this novelaspect clear, bearing in mind the multidisciplinary readership of thejournal. Subject coverage includes the theory, practice and applicationof measurement in physics, chemistry, engineering and theenvironmental and life sciences from inception to commercialexploitation.16
SPIESPIE is the international society foroptics and photonics, and organizesdozens of conferences annually,including SPIE Photonics West andSPIE Defense, Security, and Sensing.The SPIE Digital Library houses morethan 400,000 technical papers in cutting-edge technologies such assensors, lasers, imaging, robotics, nanotechnology, solar energy,biophotonics, and communications.TeraPicoTeraPico is a new start-up companylocated in Dayton, OH and specializing inTHz Sensor Technology. This includesnovel THz sources such as 1550-nmdriven photoconductive switches andphotomixers, novel THz components suchas structured-surface-plasmonic wire-grid polarizers and filters, andnovel instruments such as THz impulse generators and ultrawidebandtunable sweep oscillators. In addition, TeraPico intends to engage inthe development of biomedical and biological sensor systems incollaboration with strategic research partners such as U.S. MedicalSchools.Texas InstrumentsEngineering a Smarter Grid - TI isyour global smart grid systemspartner for secure, economical andfuture-proofgridinfrastructure,smart meter and home or building automation solutions. -GridInfrastructure -Smart Electricity Meters -Smart Flow Meters for Gas,Water and Heat -Smart Buildings and IoT -Communication Withmillions of energy meter ICs shipped over the past decade, TexasInstruments is the global systems provider for innovative, secure,economical and future-proof solutions for the worldwide smart grid. TIoffers the industry’s broadest smart grid portfolio of metrologyexpertise, application processors, communication systems, RFID andanalog components in readily available silicon with advanced software,tools and support for compliant solutions. Learn more atwww.ti.com/smartgrid.17
INDUSTRY PANEL"Wearable Sensors: the Good, the Bad, and the Alluring"This special Industry Lunch Panel will be held on Tuesday, November5th from 12:30 p.m. - 2:00 p.m. in Maryland Ballroom BC at theRenaissance Harborplace Hotel (IEEE SENSORS 2013 hotel) on thetopic of wearable sensors. Lunch will begin at 12:00 NOON.Our distinguished group of panelists include:Ross Alcazar, XM SquaredAbhi Chavan, Corventis IncKevin M. Haley, Under Armour, Inc.Amar Kendale, MC10Maurizio Macagno, HeapsylonBabak Parviz, GoogleIndustry Panel ModeratorsAndrew DeHennis, Sensors for Medicine and Science, Inc., USABrian Jamieson, Scientific & Biomedical Microsystems, USAOverview:With their ability to provide real-time feedback about our bodies, ourmovements, our activities, and our interaction with the world aroundus, wearable sensors promise to be a pervasive part of our everydaylives. Embedded systems provide wearable sensors with wirelessconnectivity and grant them a level of computing power undreamed ofjust a few years ago. This panel will facilitate a discussion about thepossibilities for this emerging market as well as some remainingtechnology challenges, the solution to which will usher in this newrevolution.The panel discussion will focus on are various factors that must guidethe design and development process for wearable sensors. In additionto the more common tradeoffs such as battery life, integration level,and feature set, these systems need to address human factors that willallow these devices to become an accepted (or even
6. IEEE SENSORS 2013 COMMITTEE . General Co-Chairs . Robert Trew, North Carolina State University, USA Elliott Brown, Wright State University , USA Technical Program Chair . Yogesh Gianchandani, University of Michigan , Ann Arbor, USA Tutorial Chair . Massood Tabib-Azar, NSF, USA Publicity Chair
