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Product End-of-Life Disassembly InstructionsProduct Category: Personal ComputersMarketing Name / Model[List multiple models if applicable.]HP t410 Smart Zero ClientPurpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructionsfor the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EUdirective 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).1.0 Items Requiring Selective Treatment1.1 Items listed below are classified as requiring selective treatment.1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, asapplicable.Quantityof itemsItem DescriptionNotesincludedin productPrinted Circuit Boards (PCB) or Printed CircuitAssemblies (PCA)With a surface greater than 10 sq cmPCA1BatteriesAll types including standard alkaline and lithium coinor button style batteries1Mercury-containing componentsFor example, mercury in lamps, display backlights,scanner lamps, switches, batteries N/A0Liquid Crystal Displays (LCD) with a surface greaterthan 100 sq cmIncludes background illuminated displays with gasdischarge lamps N/A0Cathode Ray Tubes (CRT)N/A0Capacitors / condensers (Containing PCB/PCT)NA0Electrolytic Capacitors / Condensers measuringgreater than 2.5 cm in diameter or heightNA0External electrical cables and cordsPower cable1Gas Discharge LampsN/A0Plastics containing Brominated Flame Retardantsweighing 25 grams (not including PCBs or PCAsalready listed as a separate item above)NA0Components and parts containing toner and ink,including liquids, semi-liquids (gel/paste) and tonerInclude the cartridges, print heads, tubes, ventchambers, and service stations. IO arwork9Components and waste containing asbestosN/A0Components, parts and materials containingrefractory ceramic fibersN/A0EL-MF877-00Template Revision BPage 1PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containingradioactive substancesN/A02.0 Tools RequiredList the type and size of the tools that would typically be used to disassemble the product to a point where componentsand materials requiring selective treatment can be removed.Tool DescriptionTool Size (ifapplicable)Description #1 Philips screw drivers （For disassemble 1 pcs screws on rear cover2# 2.553.00kgf.cmDescription #2 Philips screw drivers （For disassemble 2 pcs screws on Metal top cover (L / R)2# 2.553.00kgf.cmDescription #3 Philips screw drivers （For disassemble 1 pcs screws on Rear I/O BKT2# 2.553.00kgf.cmDescription #4 Philips screw driver2# 2.553.00kgf.cm( For disassembel 4 pcs screws on the MBDescription #53.0 Product Disassembly Process3.1 List the basic steps that should typically be followed to remove components and materials requiring selective 7.18.19.20.Remove 1pcs Rear cover screw. Pls refer to figure 1Disassemble Rear cover. Pls refer to figure 2Use the tool to open the left cover hooks. Pls refer to figure 3Pull out the left side cover. Pls refer to figure 4Push down the left side cover. Pls refer to figure 5Remove the left cover the entire. Pls refer to figure 6Use the tool to open the Rightleft cover hooks. Pls refer to figure 7Pull out the Right side cover. Pls refer to figure 8Push down the Right side cover. Pls refer to figure 9Remove the Right cover the entire. Pls refer to figure 10Remove the left screw. Pls refer to figure 11 13Remove the Right screw. Pls refer to figure 14 16Push the Top cover down. Pls refer to figure 17 18Remove the Top cover. Pls refer to figure 19Remove the Rear IO BKT screw. Pls refer to figure 20Remove the Rear IO BKT . Pls refer to figure 21 22Remove 4pcs MB screw.Pls refer to figure 23 24Remove Main board. Pls refer to figure 25Remove Gasket 2 pcs. Pls refer to figure 26 27Remove disassembly OK. Pls refer to figure 283.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the itemscontained in the product that require selective treatment (with descriptions and arrows identifying locations).EL-MF877-00Template Revision BPage 2PSG instructions for this template are available at EL-MF877-01
Figure1.Figure 2.Figure3.Figure 4.Figure5.Figure 6.Figure7.Figure 8.Figure9.Figure 10.EL-MF877-00Template Revision BPage 3PSG instructions for this template are available at EL-MF877-01
0Template Revision BPage 4PSG instructions for this template are available at EL-MF877-01
e26.Figure27.Figure28.EL-MF877-00Template Revision BPage 5PSG instructions for this template are available at EL-MF877-01
HP t410 Smart Zero Client Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/
