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NXP SemiconductorsSecure Connections for a Smarter WorldZPlot workgroup meetingJune 26, 2014
Secure Connections for a Smarter WorldConnected CarCyber SecurityPortable & WearableInternet of ThingsNXP SemiconductorsThe electronics industry is being driven by four mega trends that are helping shape our society:Energy Efficiency, Connected Devices, Security and Health. Connecting to these trends and enablingSecure Connections for a Smarter World, NXP Semiconductors (NASDAQ: NXPI) creates solutions forthe Connected Car, Cyber Security, Portable & Wearable and the Internet of Things.Through our innovations, customers across a wide variety of industries – including automotive, security,connected devices, lighting, industrial and infrastructure – are able to differentiate their productsthrough features, cost of ownership and/or time-to-market. With operations in more than 25 countries,NXP posted revenue of 4.82 billion in 2013. Additional information can be found on www.nxp.com2
Strong innovation track recordOur innovations are used in a wide range of applications ehicle networkingSecure identityTVTablet PCsCar access & immobilizersSecure transactionsNote-/NetbooksCar entertainmentTagging & authenticationSatellite, Cable, Terrestrialand IP set-top boxesSatellite outdoor unitsPower suppliesSolid State LightingTelematicsDesktopsMonitors and peripheralsSpeed & Angular Sensors3
Strong innovation track recordOur innovations are used in a wide range of applications (2/2)Wireless infraWireless base stationsLightingIndustrialMobileSmart gridMobile devicesPoint-to-pointLighting drivers(CFL, LED)White goodsPortable power suppliesCATV infrastructureLighting networksBroadcastingHome / buildingautomationPersonal healthBacklightingChargersPower supplies4
NXP Quality Lab Infrastructurelab locationsManchesterRQC NijmegenHamburgCaenGratkornTokyoRQC KaohsiungHong Kong/GuandongRQC BangkokCabuyaoSingaporeSerembanNXP Development LocationNXP Manufacturing LocationLabs provide Quality Services to NXP Businesses & OperationsHigher level competences & capabilities are available in the Regional Quality Centers.5
Manager RQCLeon SintnicolaasQ&R Development, CapexReliability CompetenceNebojsa JankovicRene RongenProject ManagementCapacity ManagementRonald SchravendeelTon PörtenersRQC KaohsiungRQC NijmegenRQC BangkokSharon ChenPeter VullingsKeith Sarault6
Manager RQC NijmegenPeter VullingsHRQuality SystemsStijn BonnesLeon WintersF&ASecretary SupportLinda LengowskiIngrid HaefkensReliabilityProcess & Material AnalysisFailure AnalysisFA S&CGroup leaderPMA CPA & SPAGroup leaderREL A&IGroup leaderJohan KnolLeon van NimwegenJan WijersFA A&MGroup leaderPMA PMEGroup leaderREL PSI / ESDGroup leaderBas BongersPeter VullingsRonald MinkhorstFA TSGGroup leaderMarcel vd Straaten7
RQC Four PillarsFailure AnalysisProcess- and Material AnalysisReliabilityProblem Solving and Problem Prevention8
RQC Nijmegen Failure Analysis and Silicon DebugAnalysis of design and manufacturing problems. Options for design modification.Hamamatsu Phemos-1000 PEMEFA – Electrical Failure Analysis TechniquesFault localization using tester and various analysis techniquesEFA Electrical testingElectron-Beam testing (E-beam)Agilent 93000 Electrical testerPhoto-emission Microscopy (PEM)Optical Beam Induced Resistance Change (OBIRCH)Time Resolved photon Emission (TRE)Resistive Interconnect Localization (RIL)Soft Defect Localization (SDL)Laser Assisted Device Alteration (LADA)Semicaps SOM-3000 RIL / SDL / LADAMagnetic Current ImagingCharge Contrast in FIB/SEMTRE - EmiscopeLiquid Crystal diagnosticsMicroprobingNano-probing in SEM/FIB chamber9
RQC Nijmegen Failure Analysis and Silicon DebugAnalysis of design and manufacturing problems. Options for design modification.NSC PS103SChemical DecapPFA - Physical Failure Analysis TechniquesPhysical FA-techniques– Dual-beam Focused-Ion-Beam(FIB) for x-section andcircuit modification– Parallel Electron Energy Loss Spectroscopy (PEELS)– Hi-resolution Scanning Electron Microscopy (SEM)– Hi-resolution Transmission Electron Microscopy (TEM)– Scanning/Energy Filtering TEM (S/EF-TEM)– Energy Dispersive X-Ray spectroscopy (EDX)– Scanning Acoustical Microscopy (SCAT)– (Confocal) optical microscopy– Hi-resolution 3D X-RayTecnai F-30 TEMHamamatsu C9107Backside PolishingFEI Vectra Vision &FIB200/800/835 FIBfor x-sections andfront & backsidecircuit modification10
RQC Nijmegen Process- and Materials AnalysisChemical- and Physical Analysis capabilties and competences for fast rootcause analysis and prevention of quality problems.IonTOF ToF-SIMSApplicationsDevice substrate characterization and crystal defect analysisComposition analysis of devices, chemicals and materialsContamination analysis; surfaces, chemicals, materialsChemical and Physical Analysis Techniques– SEM/EDX, TEM/EDX, AFM and FTIR; composition of devices/solids– XTT/XRT, SIRD, µPCD and preferential etch for substratecharacterization and analysis of crystal defects– ICP-OES, GFAAS , (VPD)-ICP-MS and ToF-SIMS for analysis ofmetallic (trace) contamination in solids and liquids– IC for analysis of anionic contamination in solids and liquids– GC-MS, HPLC, FTIR, TOC and ToF-SIMS for characterization oforganics and analysis of organic contamination– Auger spectroscopyHP - HPLCVPD - ICPMS11
RQC - ReliabilityReliability test Equipment:–––––––––Operation open airOperation chamberHumidity biased (THB/HAST)Humidity unbiased (Precon/UHAST)Thermo mechanical (TMCL)Mechanical testing (Drop/Vibr,)Thermal test (LTSL/HTSL)Electrical robustness test (AMR/ESD)Analyses (SCAT)
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the Connected Car, Cyber Security, Portable & Wearable and the Internet of Things. Through our innovations, customers across a wide variety of industries – including automotive, security, connected devices, lighting, industrial and infrastructure – are able to differentiate their products through features, cost of ownership and/or time-to-market. With operations in more than 25 countries .
